A light emitting apparatus and a light emitting module including the same, and, more particularly, a light emitting apparatus including a light emitting device and a molding layer covering the light emitting device, and a light emitting module including the same. The light emitting apparatus includes a substrate, at least one light emitting device disposed on a surface of the substrate, a first molding layer covering at least a region of the light emitting devices, and a second molding layer surrounding an outer periphery of the substrate.

A light emitting apparatus and a light emitting module including the same, and, more particularly, a light emitting apparatus including a light emitting device and a molding layer covering the light emitting device, and a light emitting module including the same. The light emitting apparatus includes a substrate, at least one light emitting device disposed on a surface of the substrate, a first molding layer covering at least a region of the light emitting devices, and a second molding layer surrounding an outer periphery of the substrate.

A display panel, a manufacturing method therefor and a display device are provided. The display panel includes a drive backplate; at least one light emitting unit disposed on the drive backplate; a support structure disposed on the drive backplate, wherein an orthographic projection of the support structure on the drive backplate is not overlapped with an orthographic projection of the at least one light emitting unit on the drive backplate; a light shielding layer disposed on the drive backplate, wherein the light shielding layer covers at least part of the support structure and an orthographic projection of the light shielding layer on the drive backplate is not overlapped with the orthographic projection of the at least one light emitting unit on the drive backplate.

A display panel, a manufacturing method therefor and a display device are provided. The display panel includes a drive backplate; at least one light emitting unit disposed on the drive backplate; a support structure disposed on the drive backplate, wherein an orthographic projection of the support structure on the drive backplate is not overlapped with an orthographic projection of the at least one light emitting unit on the drive backplate; a light shielding layer disposed on the drive backplate, wherein the light shielding layer covers at least part of the support structure and an orthographic projection of the light shielding layer on the drive backplate is not overlapped with the orthographic projection of the at least one light emitting unit on the drive backplate.

The present invention is applicable to the technical field of display devices and relates to a display device which uses, for example, a light-emitting diode (LED). To achieve the aforementioned objective, the present invention comprises: a wiring board; a light-emitting element which is composed of individual pixels and arranged on the wiring board; an insulation layer which is located at least on a side surface of the light-emitting element; and a black-colored layer which is located on the insulation layer, wherein the black-colored layer may include a material formed by modifying the material constituting the insulation layer.

The present invention is applicable to the technical field of display devices and relates to a display device which uses, for example, a light-emitting diode (LED). To achieve the aforementioned objective, the present invention comprises: a wiring board; a light-emitting element which is composed of individual pixels and arranged on the wiring board; an insulation layer which is located at least on a side surface of the light-emitting element; and a black-colored layer which is located on the insulation layer, wherein the black-colored layer may include a material formed by modifying the material constituting the insulation layer.

Disclosed are an integrated LED packaging structure and a packaging method, and relates to the technical field of LED packaging. The disclosure includes a shell, a bottom end of the shell is fixedly connected to a pin platform, a top end of the shell is fixedly connected to an LED plug, three lamp beads are fixedly mounted at a top end of the LED plug, a bottom end of the pin platform is fixedly connected to a cup cavity, and a bottom end of the cup cavity is fixedly connected to connecting pins. The top end of the LED plug is provided with LED sockets in positions corresponding to the lamp beads, and bottom ends of inner sides of the LED sockets are fixedly connected to insulating plates. Furthermore, a combination of an in-line and SMD form is adopted, and the lower half part adopts an SMD structure.

Disclosed are an integrated LED packaging structure and a packaging method, and relates to the technical field of LED packaging. The disclosure includes a shell, a bottom end of the shell is fixedly connected to a pin platform, a top end of the shell is fixedly connected to an LED plug, three lamp beads are fixedly mounted at a top end of the LED plug, a bottom end of the pin platform is fixedly connected to a cup cavity, and a bottom end of the cup cavity is fixedly connected to connecting pins. The top end of the LED plug is provided with LED sockets in positions corresponding to the lamp beads, and bottom ends of inner sides of the LED sockets are fixedly connected to insulating plates. Furthermore, a combination of an in-line and SMD form is adopted, and the lower half part adopts an SMD structure.

There is disclosed a method of manufacturing a light emitting diode (LED) arrangement, the method comprising the steps of installing an LED on a circuit board; and covering the circuit board and other electronic components on the circuit board with a layer of silicon coating; wherein a top emitting area of the LED is kept exposed or uncovered for increasing efficiency of the LED arrangement. Also disclosed is a lighting system, comprising a plurality of light emitting diode (LED) strips in connection with a photo-voltaic (PV) panel, the LED strips comprising a plurality of LEDs and infra-red (IR) LEDs, wherein the plurality of LEDs and IR LEDs are installed on the LED strips at a ratio of 1:8, for mitigating shadow losses and for increasing efficiency of the lighting arrangement.

There is disclosed a method of manufacturing a light emitting diode (LED) arrangement, the method comprising the steps of installing an LED on a circuit board; and covering the circuit board and other electronic components on the circuit board with a layer of silicon coating; wherein a top emitting area of the LED is kept exposed or uncovered for increasing efficiency of the LED arrangement. Also disclosed is a lighting system, comprising a plurality of light emitting diode (LED) strips in connection with a photo-voltaic (PV) panel, the LED strips comprising a plurality of LEDs and infra-red (IR) LEDs, wherein the plurality of LEDs and IR LEDs are installed on the LED strips at a ratio of 1:8, for mitigating shadow losses and for increasing efficiency of the lighting arrangement.