Patent classifications
H10H29/8552
DISPLAY DEVICE INCLUDING A SEMICONDUCTOR LIGHT EMITTING DEVICE
A display device including the semiconductor light emitting device according to an embodiment including a planarization layer disposed on the semiconductor light emitting device, a first opaque filler disposed to be spaced apart on the planarization layer, and a light reflective filling layer disposed around the semiconductor light emitting device, wherein the light reflective filling layer is positioned lower than the top surface of the semiconductor light emitting device.
LIGHT-EMITTING DEVICE AND DISPLAY DEVICE
A light-emitting device includes a first light emitter and a second light emitter. A first drive current through the first light emitter and a second drive current through the second light emitter flow in opposite directions. A period in which the first drive current flows and a period in which the second drive current flows at least partially overlap each other. This structure causes the phase of an electromagnetic wave induced by the first drive current to be opposite to the phase of an electromagnetic wave induced by the second drive current, thus allowing the electromagnetic waves to at least partially cancel each other and reducing electromagnetic interference.
Display Panel and Manufacturing Method Therefor, and Display Device
A display panel, a manufacturing method therefor and a display device are provided. The display panel includes a drive backplate; at least one light emitting unit disposed on the drive backplate; a support structure disposed on the drive backplate, wherein an orthographic projection of the support structure on the drive backplate is not overlapped with an orthographic projection of the at least one light emitting unit on the drive backplate; a light shielding layer disposed on the drive backplate, wherein the light shielding layer covers at least part of the support structure and an orthographic projection of the light shielding layer on the drive backplate is not overlapped with the orthographic projection of the at least one light emitting unit on the drive backplate.
DISPLAY DEVICE
A display device includes a pixel array substrate, light emitting elements, a lower plate and a black pattern layer. The pixel array substrate has a display surface and a bottom surface opposite to the display surface. The display surface has pixel regions and light transmitting regions arranged alternately. The light emitting elements are disposed on the display surface and electrically connected to the pixel array substrate, where the light emitting elements are located in the pixel regions. The bottom surface is located between the display surface and the lower plate. The black pattern layer is disposed between the pixel array substrate and the lower plate, and has light shielding parts and first opening areas arranged alternately. The light shielding parts overlap with the pixel regions, and the first opening areas overlap with the light transmitting regions.
DISPLAY SUBSTRATE, TRANSFER ASSEMBLY, TRANSFER METHOD AND DISPLAY DEVICE
A display substrate, including a first substrate and a backplane arranged in a sequentially laminated manner, and a light-emitting layer, where the light-emitting layer includes a binding pads and a light-emitting elements arranged one-to-one corresponding to each other, where the binding pad is arranged on a side of the backplane away from the first substrate, and a pin of the light-emitting element is electrically connected to the binding pad, where the binding pad includes a first region and a second region, the orthographic projection of the first region on the backplane is covered by the orthographic projection of the light-emitting element on the backplane, and the orthographic projection of the second region on the backplane is arranged on the outer side of the orthographic projection of the light-emitting element on the backplane.
CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME, DISPLAY SUBSTRATE, AND DISPLAY APPARATUS
A chip structure includes a chip wafer unit and a color conversion substrate unit disposed on a light-exit side of the chip wafer unit. The chip wafer unit includes a light-emitting layer and an electrode layer sequentially stacked in a first direction. The light-emitting layer includes light-emitting portions. Each light-emitting portion includes at least two light-emitting sub-portions. The electrode layer includes a cathode, connection electrodes, and anodes in one-to-one correspondence with the light-emitting portions. The at least two light-emitting sub-portions are sequentially connected through at least one connection electrode. Among the at least two light-emitting sub-portions sequentially connected, a first one light-emitting sub-portion is a first selected light-emitting sub-portion, and a last one light-emitting sub-portion is a second selected light-emitting sub-portion. The first selected light-emitting sub-portion is connected to the cathode, and the second selected light-emitting sub-portion is connected to an anode.
LIGHT ABSORPTION FILTER, OPTICAL FILTER, MANUFACTURING METHOD FOR OPTICAL FILTER, ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE, INORGANIC ELECTROLUMINESCENT DISPLAY DEVICE, AND LIQUID CRYSTAL DISPLAY DEVICE
A light absorption filter containing a resin, a specific dye, and a compound that generates a radical upon ultraviolet irradiation, in which a polymer constituting the resin contains a crosslinkable group, a light absorption filter containing a resin, a compound A having an acid group, a compound B that forms a hydrogen bond with the acid group contained in the compound A and generates a radical upon ultraviolet irradiation, and a specific dye, in which the compound A is contained in a side chain of a polymer constituting the resin, an optical filter using these light absorption filters and a manufacturing method thereof, and an organic electroluminescent display device, an inorganic electroluminescent display device, or a liquid crystal display device, each of which contains the optical filter.
DISPLAY PANEL AND DISPLAY APPARATUS
A display panel includes: a substrate; light-emitting elements located on a side of the substrate; a first light-blocking layer located on a side of the first light-emitting unit away from the substrate and comprising a first opening; a second light-blocking layer located on a side of the first light-blocking layer away from the substrate and comprising a second opening. One of the light-emitting elements comprises a first light-emitting unit and a second light-emitting unit. Along a direction perpendicular to a plane of the substrate, both the first opening and the second opening at least partially overlap with the first light-emitting unit. An area of the first opening is greater than an area of the second opening, and an orthographic projection of the second light-blocking layer on the plane of the substrate at least partially covers an edge of the first opening.
DISPLAY DEVICE USING LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF
The present invention is applicable to the technical field of display devices and relates to a display device which uses, for example, a light-emitting diode (LED). To achieve the aforementioned objective, the present invention comprises: a wiring board; a light-emitting element which is composed of individual pixels and arranged on the wiring board; an insulation layer which is located at least on a side surface of the light-emitting element; and a black-colored layer which is located on the insulation layer, wherein the black-colored layer may include a material formed by modifying the material constituting the insulation layer.
METHOD FOR MANUFACTURING A DISPLAY PANEL, DISPLAY PANEL AND DISPLAY DEVICE
Provided are a method for manufacturing a display panel, a display panel and a display device, which relate to the field of display technology and are used to optimize the performance of the display panel. The method includes: forming a light-emitting device layer on one side of a substrate, the light-emitting device layer including a plurality of light-emitting elements; forming a first light management layer on a side of the light-emitting device layer away from the substrate, the first light management layer including a plurality of openings spaced apart from each other; forming a second light management layer, at least part of which being located in the openings, the second light management layer including resin and dye, a photocuring treatment and a thermal curing treatment are performed during the formation of the second light management layer, and the photocuring treatment is performed earlier than the thermal curing treatment.