A semiconductor module according to the present disclosure includes a substrate, at least one semiconductor element located on the substrate, and a heat dissipation member located above the at least one semiconductor element. In the semiconductor module according to one aspect of the present disclosure, a position of the at least one semiconductor element is shifted from a center of the substrate in a plan view of the substrate.

A lighting device disclosed in an embodiment of the invention includes a heat dissipation plate having a recess portion; a circuit board accommodated in the recess portion of the heat dissipation plate and having pads; a light source portion having bonding pads; connection members respectively connecting between the pads and the bonding pads; and an adhesive member that adheres the light source portion to the heat dissipation plate. The light source portion includes a support member; light emitting devices having light emitting chips and a wavelength conversion layer; and a resin member. Each of the connection members has a ribbon shape, and a width of each of the connection members is more than twice the thickness of each of the connection members, and each of the connection members may include two ends respectively connected to the bonding pads and the pads, and a center portion extending convexly between the two ends.

A semiconductor light emission element includes: a substrate having insulating or semi-insulating properties; a light-emitting functional layer where a first semiconductor layer having a first polarity, a light emission layer, and a second semiconductor layer having a second polarity are sequentially laminated on the substrate; an insulating film covering the light-emitting functional layer; a first pad electrode and a second pad electrode electrically connected to the first semiconductor layer and the second semiconductor layer, respectively, and at least one intermediate pad electrically insulated from the light-emitting functional layer, the first, second, and at least one intermediate pads being provided on the insulating film; and a pad separation groove separating each of the first pad electrode, the second pad electrode, and the intermediate pad, and exposing the insulating film.

The present disclosure relates to a display device. A display device of one embodiment is provided with at least one sensor area. The display device includes a substrate. The display device includes a thin film transistor on the substrate. The display device includes a planarization layer disposed to cover the thin film transistor. The display device includes a light emitting diode on the planarization layer. The light emitting diode including a first electrode, an emission layer on the first electrode, and a second electrode on the emission layer. The display device includes a bank configured to expose at least part of the first electrode and disposed on the planarization layer. The display device includes a sensor part disposed on a back surface of the substrate in the sensor area. The display device includes a heat dissipation panel disposed between the substrate and the first electrode.

An electronic device includes a casing, a heat source and a heat-dissipation unit. The casing has an accommodation space and a first surface. The heat source is arranged in the accommodation space. The heat-dissipation unit is disposed on the first surface. A part of the casing is located between the heat source and the heat-dissipation unit. The heat-dissipation unit has multiple tubular spaces with open ends. These tubular spaces respectively extend in a first direction parallel to the first surface and are arranged side by side on the first surface. The heat-dissipation unit has a height in a second direction perpendicular to the first surface, and at least one of the tubular spaces has a width in a third direction parallel to the first surface and perpendicular to the first direction. The ratio of the height to the width is between 1.4 and 5.2.

A lighting device disclosed in an embodiment of the invention includes a heat dissipation plate having a recess portion; a circuit board accommodated in the recess portion of the heat dissipation plate and having pads; a light source portion having bonding pads; connection members respectively connecting between the pads and the bonding pads; and an adhesive member that adheres the light source portion to the heat dissipation plate. The light source portion includes a support member; light emitting devices having light emitting chips and a wavelength conversion layer; and a resin member. Each of the connection members has a ribbon shape, and a width of each of the connection members is more than twice the thickness of each of the connection members, and each of the connection members may include two ends respectively connected to the bonding pads and the pads, and a center portion extending convexly between the two ends.

A micro LED display panel includes an integrated circuit (IC) backplane; a micro LED array provided on the IC backplane, the IC backplane controlling the micro LED array; and a heat dissipation structure provided on the IC backplane and in contact with edges of the micro LED array.

A display device includes a substrate, a display panel driver disposed on the substrate, data lines disposed on the substrate, electrically connected to the display panel driver, and each extending in a first direction, and a heat dissipation pattern disposed on the substrate, overlapping at least a portion of the data lines in a plan view, and extended to the substrate through contact holes.

The present application provides an optical module. The optical module comprises: a housing assembly; an optical assembly, disposed in the housing assembly; and a heat dissipation elastic sheet, sandwiched between the optical assembly and the housing assembly. The heat dissipation elastic sheet comprises a heat dissipation portion, and the heat dissipation portion is in contact with the optical assembly. The heat dissipation elastic sheet further comprises a deformation portion, the deformation portion is connected to the heat dissipation portion, and the deformation portion is bent relative to the heat dissipation portion. The deformation portion is provided with a hollow area, so that the deformation portion can be bent and deformed. In this way, the heat dissipation elastic sheet of the present application is convenient for secondary disassembly and assembly, and can be in elastic contact with an element to be cooled, thereby avoiding adverse effects as much as possible on performance of the element to be cooled due to excessive stress of the element to be cooled.

A display device, an electronic device including the display device, and a method for manufacturing the display device are disclosed. The display device may include a display panel, a heat dissipating member below the display panel, and a bottom chassis below the heat dissipating member. The heat dissipating member may include a heat dissipating plate including graphite, an adhesive layer on at least one surface of the heat dissipating plate, wherein the adhesive layer may include a polyurethane, and a base material film spaced and/or apart (e.g., spaced apart or separated) from the heat dissipating plate with the adhesive layer therebetween. The adhesive layer may include a polyol that includes a polycarbonate polyol. The adhesive layer may include a first portion adjacent to the heat dissipating plate and a second portion adjacent to the base material film.