Patent classifications
H10H29/8583
LENS, LENS ARRAY, DISPLAYING MODULE AND DISPLAYING DEVICE
The embodiments of the present disclosure provide a lens, a lens array, a displaying module and a displaying device. The lens includes a main lens body and a light emitting member; the main lens body is a conical housing having an inner cavity, and the light emitting member is disposed at a first end of the main lens body; a first quadric surface is disposed in the inner cavity of the main lens body; a second quadric surface is disposed on an inner wall of the main lens body; the first quadric surface is convex toward the first end of the main lens body, and the second quadric surface is convex toward a second end of the main lens body.
SEMICONDUCTOR MODULE
A semiconductor module according to the present disclosure includes a substrate, at least one semiconductor element located on the substrate, and a heat dissipation member located above the at least one semiconductor element. In the semiconductor module according to one aspect of the present disclosure, a position of the at least one semiconductor element is shifted from a center of the substrate in a plan view of the substrate.
MICRO LED DISPLAY PANEL AND INTEGRATED CIRCUIT BACKPLANE
A micro LED display panel includes an integrated circuit (IC) backplane including a bottom pad array and a micro LED array comprising a plurality of micro LED structures provided on the IC backplane, one micro LED structure of the plurality of micro LED structures being electrically connected with one bottom pad of the plurality of bottom pads. The micro LED structure includes a mesa structure; a first thermal conductive layer formed surrounding a sidewall of the mesa structure, a material of the first thermal conductive layer being an electrically insulative material with high thermal conductivity; and a second thermal conductive layer filled between adjacent ones of micro LED structures. The IC backplane further includes: one or more heat dissipation structures provided corresponding to an area outside the micro LED structure and passing thought the IC backplane to radiate heat to outside, wherein the heat dissipation structure and the bottom pad are separated.