A display panel, a method for manufacturing a display panel, and a display apparatus. The display panel includes a display region, a non-display region at least partially surrounding the display region, and further includes a base plate, a wiring layer, a light-emitting layer, and an isolation structure. The wiring layer is located on a side of the base plate and includes a metal layer located in the display region and a signal line layer located in the non-display region. The light-emitting layer is located on a side of the wiring layer away from the base plate and includes a plurality of light-emitting units. The isolation structure is located on a side of the wiring layer away from the base plate and is provided with an isolation opening configured to accommodate the light-emitting unit.

A micro light emitting diode (LED) is provided. The micro LED includes a first light emitting unit and a second light emitting unit disposed on a top of the first light emitting unit. A first electrode of the first light emitting unit is inserted through a groove of the second light emitting unit and electrically connected with a substrate. A third light emitting unit is either shielded by the first light emitting unit or arranged at one side of the first light emitting unit. The first light emitting unit, the second light emitting unit, and the third light emitting unit are connected with a common connection point of the substrate by respective common electrodes. Thus an area of a light emitting surface of the micro LED is further reduced.

Disclosed are an integrated LED packaging structure and a packaging method, and relates to the technical field of LED packaging. The disclosure includes a shell, a bottom end of the shell is fixedly connected to a pin platform, a top end of the shell is fixedly connected to an LED plug, three lamp beads are fixedly mounted at a top end of the LED plug, a bottom end of the pin platform is fixedly connected to a cup cavity, and a bottom end of the cup cavity is fixedly connected to connecting pins. The top end of the LED plug is provided with LED sockets in positions corresponding to the lamp beads, and bottom ends of inner sides of the LED sockets are fixedly connected to insulating plates. Furthermore, a combination of an in-line and SMD form is adopted, and the lower half part adopts an SMD structure.

A light-emitting device includes a support; a first electrically-conductive part, a second electrically-conductive part, and a third electrically-conductive part disposed apart from one another on the support; a first light-emitting element disposed on the first electrically-conductive part; and an integrated circuit electrically connected to the first light-emitting element. At least a portion of the first electrically-conductive part is located between the second electrically-conductive part and the third electrically-conductive part in a first direction. The integrated circuit and the first light-emitting element are arranged side by side in a second direction orthogonal to the first direction. A maximum length of the integrated circuit in the second direction is smaller than a maximum length of the integrated circuit in the first direction.

The present disclosure discloses a light emitting module including at least one light emitting device, the light emitting device comprising a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer.

A light source includes a substrate, a light-emitting device, and a first bonding member. The first bonding member is disposed between a first electrode of the light-emitting device and a first upper surface of a first metal member of the substrate to bond the first electrode and the first metal member, and is disposed between a second electrode of the light-emitting device and a second upper surface of a second metal member of the substrate to bond the second electrode and the second metal member. An upper portion of the insulating member of the substrate is located between the first electrode and the second electrode of the light-emitting device. Each of the first lower surface of the first metal member, the second lower surface of the second metal member, and the lower portion of the insulating member is exposed.

The present application relates to the technical field of light-emitting diodes, and particularly relates to a flip-chip high-voltage light-emitting diode. The present application designs on one light-emitting unit a protruding part which faces the center position of the flip-chip high-voltage light-emitting diode, so that a vulnerable position of an isolation groove is prevented from being pressed against by an ejector pin, and meanwhile, a situation of electric leakage caused by film layer breakage is avoided, thereby improving reliability.

A micro LED array includes a plurality of micro LED structures, wherein each of the micro LED structure includes: a mesa structure; a first thermal conductive layer formed surrounding a sidewall of the mesa structure, wherein a material of the first thermal conductive layer is an electrically insulative material with high thermal conductivity; and a bottom connect structure provided at a bottom of the mesa structure to electrically connect the mesa structure to a bottom pad of an integrated circuit (IC) backplane.

A micro LED display panel includes an integrated circuit (IC) backplane including a bottom pad array and a micro LED array comprising a plurality of micro LED structures provided on the IC backplane, one micro LED structure of the plurality of micro LED structures being electrically connected with one bottom pad of the plurality of bottom pads. The micro LED structure includes a mesa structure; a first thermal conductive layer formed surrounding a sidewall of the mesa structure, a material of the first thermal conductive layer being an electrically insulative material with high thermal conductivity; and a second thermal conductive layer filled between adjacent ones of micro LED structures. The IC backplane further includes: one or more heat dissipation structures provided corresponding to an area outside the micro LED structure and passing thought the IC backplane to radiate heat to outside, wherein the heat dissipation structure and the bottom pad are separated.

Provided is a light emitting device including: a plurality of light emitters including semiconductor layers; and a heat conductor unit that provides a light emitter arrangement region in which the plurality of light emitters are arranged, in which the heat conductor unit includes a heat-dissipation heat conductor for dissipating heat generated from the plurality of light emitters, and an area of the heat-dissipation heat conductor, in a plan view, is larger than an area of the light emitter arrangement region.