A light-emitting device includes a first light emitter and a second light emitter. A first drive current through the first light emitter and a second drive current through the second light emitter flow in opposite directions. A period in which the first drive current flows and a period in which the second drive current flows at least partially overlap each other. This structure causes the phase of an electromagnetic wave induced by the first drive current to be opposite to the phase of an electromagnetic wave induced by the second drive current, thus allowing the electromagnetic waves to at least partially cancel each other and reducing electromagnetic interference.

A micro LED panel having a micro LED array and the system and method to manufacture the micro LED panel are provided according to the present disclosure. The micro LED array includes at least one micro LED structure. The micro LED structure at least includes: a mesa structure and a re-growth layer. In some embodiments, the mesa structure comprises a first type epitaxial layer, a light emitting layer and a second epitaxial layer. In some embodiments, the re-growth layer is grown on at least part of the sidewall of the first type epitaxial layer, the whole sidewall of the light emitting layer and at least part of the sidewall of the second type epitaxial layer. The present disclosure can decrease the non-radiation recombination at the sidewall of the mesa structure and improve the light emitting efficiency of the micro LED structure.

A micro LED panel having a micro LED array and the system and method to manufacture the micro LED panel are provided by the present disclosure. The micro LED array includes at least one micro LED structure. The micro LED structure at least includes: a mesa structure and a photonic crystal structure array. The photonic crystal structure array formed through the mesa structure from top to bottom, thereby realizing higher directional light emission, simpler structure and lower cost.

A Micro-LED display chip and a method for manufacturing the same are provided according to the present application. The method includes: providing a driving substrate; providing a first LED layer; bonding the first LED layer to the driving substrate, where the first LED units and a first conductive column are electrically connected to contacts respectively; disposing a second LED layer on the first LED layer, where the second LED layer consists of multiple second LED units and a second filling structure located between the second LED units, the second LED units are electrically connected to the first conductive column directly below them, and the second LED units emit light of a different color from that of the first LED units. This facilitates reducing the process difficulty in manufacturing the multicolor Micro-LED display chips.

A micro LED panel having a micro LED array and the system and method to manufacture the micro LED panel are provided. The micro LED array includes at least one micro LED structure. The micro LED structure at least includes: a mesa structure and a re-growth layer (04). The re-growth layer (04) is grown on at least part of the sidewall of the first type epitaxial layer (01) and on the whole sidewall of the light emitting layer (03), thereby decreasing the non-radiation recombination on the sidewall of the mesa structure and improving the light emitting efficiency.

A display substrate, including a first substrate and a backplane arranged in a sequentially laminated manner, and a light-emitting layer, where the light-emitting layer includes a binding pads and a light-emitting elements arranged one-to-one corresponding to each other, where the binding pad is arranged on a side of the backplane away from the first substrate, and a pin of the light-emitting element is electrically connected to the binding pad, where the binding pad includes a first region and a second region, the orthographic projection of the first region on the backplane is covered by the orthographic projection of the light-emitting element on the backplane, and the orthographic projection of the second region on the backplane is arranged on the outer side of the orthographic projection of the light-emitting element on the backplane.

A splicing display device is provided. The splicing display device includes at least two first display units and a second display unit. The first display units are spliced and connected. Each of the first display units includes a non-display area. The second display unit is disposed on a light-emitting side of the first display units, and attached and fixed to a splicing position of the non-display areas of the two adjacent first display units.

A driving backplane includes a substrate, a plurality of pad groups, and a plurality of marks. The plurality of pad groups and the plurality of marks are located on a same side of the substrate, a pad group includes at least one pad, and orthogonal projections of the plurality of marks on the substrate and orthogonal projections of the plurality of pad groups on the substrate have no overlap. The pad group corresponds to at least one mark. An orthogonal projection of the at least one mark on the substrate is located on a circumference of an orthogonal projection of a corresponding area of the pad group on the substrate, is adjacent to an orthogonal projection of the pad group on the substrate, and has a first gap from the orthogonal projection of the pad group on the substrate.

The invention relates a transfer process for micro elements, including at least one picking step wherein at least one micro element is picked up from at least one donor surface by at least one transfer surface and at least one placing step wherein at least one micro element is placed upon at least one receiving surface from at least one transfer surface, wherein the process according to the invention enables that at least the picking step benefits of several flexible parameters.

Light sources including one or more light emitting diodes (LEDs) comprise a down converter material on the one or more LEDs; and a functional material that is laser-patterned on the down converter material. The functional material may be a distributed Bragg reflector (DBR). a dichroic filter (DCF), a ceramic material, or a powdered phosphor layer. The down converter material may comprise a polycrystalline ceramic plate of a phosphor material. A method of manufacturing a light source comprises: patterning a functional material of a light source comprising one or more light emitting diodes and a phosphor material.