A method for manufacturing an organic memory device is disclosed. According to one embodiment, the method comprises the steps of: forming a first electrode on a substrate; forming an organic active layer on the first electrode; and forming a second electrode on the organic active layer through an orthogonal photolithography technique using a fluorinated material.

Embodiments of a method for packaging Integrated Circuit (IC) dies and an IC device are described. In an embodiment, a method for packaging IC dies involves creating openings on a substrate, where side surfaces of the openings on the substrate are covered by metal layers, placing the IC dies into the openings on the substrate, applying a second metal layer to the substrate, where the IC dies are electrically connected to at least a portion of the second metal layer, and cutting the substrate into IC devices.

An organic light emitting diode (OLED) dual screen display is provided, including a first OLED display panel and a second OLED display panel opposite to the first OLED display panel. Both edges of the first OLED display panel and both edges of the second OLED display panel are adhered by a sealant. Both the first OLED display panel and the second OLED display panel include an open area and a non-open area, and the non-open area is provided with a black matrix.

An organic light emitting diode (OLED) dual screen display is provided, including a first OLED display panel and a second OLED display panel opposite to the first OLED display panel. Both edges of the first OLED display panel and both edges of the second OLED display panel are adhered by a sealant. Both the first OLED display panel and the second OLED display panel include an open area and a non-open area, and the non-open area is provided with a black matrix.

A display apparatus including an electrically-controlled phase retardation layer, a reflective polarizer, a micro light emitting diode panel and a reflective layer is provided. The electrically-controlled phase retardation layer has a first side and a second side opposite to each other. The reflective polarizer is disposed at the first side of the electrically-controlled phase retardation layer. The micro light emitting diode panel is disposed at the second side of the electrically-controlled phase retardation layer and includes a circuit substrate and a plurality of micro light emitting diodes. The reflective layer is disposed between the reflective polarizer and the circuit substrate. An orthogonal projection of the reflective layer on the circuit substrate is not overlapped with orthogonal projections of the micro light emitting diodes on the circuit substrate.

A process for producing a viscous epoxy syrup from at least one liquid multifunctional epoxy, comprising the steps of: adding an initiator selected from the group consisting of electron-poor monoisocyanate, photoinitiator and thermal initiator to at least one liquid multifunctional epoxy; mixing the components; polymerizing the multifunctional epoxy such that the viscosity of the resulting epoxy syrup is at least twice as high, preferably at least four times as high and in particular at least ten times as high as the viscosity of the employed epoxy in the unreacted state
makes it possible to produce epoxy adhesives having pressure-sensitive properties.

A display apparatus including an electrically-controlled phase retardation layer, a reflective polarizer, a micro light emitting diode panel and a reflective layer is provided. The electrically-controlled phase retardation layer has a first side and a second side opposite to each other. The reflective polarizer is disposed at the first side of the electrically-controlled phase retardation layer. The micro light emitting diode panel is disposed at the second side of the electrically-controlled phase retardation layer and includes a circuit substrate and a plurality of micro light emitting diodes. The reflective layer is disposed between the reflective polarizer and the circuit substrate. An orthogonal projection of the reflective layer on the circuit substrate is not overlapped with orthogonal projections of the micro light emitting diodes on the circuit substrate.

A process for producing a viscous epoxy syrup from at least one liquid multifunctional epoxy, comprising the steps of: adding an initiator selected from the group consisting of electron-poor monoisocyanate, photoinitiator and thermal initiator to at least one liquid multifunctional epoxy; mixing the components; polymerizing the multifunctional epoxy such that the viscosity of the resulting epoxy syrup is at least twice as high, preferably at least four times as high and in particular at least ten times as high as the viscosity of the employed epoxy in the unreacted state
makes it possible to produce epoxy adhesives having pressure-sensitive properties.

The invention relates to a method for producing a semiconductor component comprising a radiation-emitting optical semiconductor chip or a plurality of radiation-emitting optical semiconductor chips, said method comprising: applying the radiation-emitting optical semiconductor chip or the plurality of radiation-emitting optical semiconductor chips to a deformable flat support deforming the support; and permanently fixing the deformation.

This application discloses a display panel and a manufacturing method thereof and a display device. The display panel comprises a first substrate and a second substrate disposed opposite to each other, a first display element is disposed at a side of the first substrate that is close to the second substrate, a second display element is disposed at a side of the second substrate that is close to the first substrate, and both of a light-exiting surface of the first display element and a light-exiting surface of the second display element are towards the second substrate. Sub-pixels of the first display element and sub-pixels of the second display element are disposed in a staggered manner, and regions in the second display element that correspond to the sub-pixels of the first display element are light transmissive regions.