Provided is a method of producing a light-emitting element, the method being capable of producing a light-emitting element including a first light emitting layer and banks on the first light emitting layer, without damaging the first light emitting layer. The method of producing a light-emitting element of the present disclosure includes: preparing a base element including a monochromatic first light emitting layer on a substrate; forming a patterned fluororesin film by disposing a photosensitive resin composition at least containing a fluororesin having a crosslinking site and a repeating unit derived from a hydrocarbon containing a fluorine atom, a solvent, and a photopolymerization initiator on the base element such that photosensitive resin composition partitions at least one region of the base element; and baking the patterned fluororesin film at a temperature of 200° C. or lower to cure the patterned fluororesin film.

A trilayer resist system design and method for patterning organic devices including organic light emitting diode (OLED) devices suited for high-definition light field displays. The trilayer resist system is comprised of a fluoropolymer base layer, an inorganic transfer layer and a top positive-type photoresist layer that protects organics formed upon a substrate from damage resulting from the radiation, developers and solvents used in traditional photolithography techniques and thereby resulting in a high-resolution multi-colored OLED array.

A display device that can easily have high resolution is provided. A display device having both high display quality and high resolution is provided. A display device with high contrast is provided. A first EL film is deposited in contact with a top surface and a side surface of each of a first pixel electrode and a second pixel electrode each having a tapered shape. A first sacrificial film is formed to cover the first EL film. The first sacrificial film and the first EL film are etched to expose the second pixel electrode and form a first EL layer over the first pixel electrode and a first sacrificial layer over the first EL layer, and then, the first sacrificial layer is removed. The first EL film and the second EL film are etched by dry etching. The first sacrificial layer is removed by wet etching.

The disclosure provides LED display panel and manufacturing method thereof. LED display panel includes: substrate; LED on substrate; pixel defining layer defining pixel opening on substrate, the LED being within pixel opening; and first encapsulation layer on light emitting side of LED. Portion of first encapsulation layer within pixel opening includes sidewall inclined with respect to substrate, surface of sidewall close to LED includes first portions and second portions alternately arranged in direction away from LED and connected to each other, and inclination angles of first portions with respect to substrate are smaller than those of second portions with respect to substrate. Refractive index of material of first encapsulation layer is greater than refractive index of material of each of layer structures directly on both sides of first encapsulation layer in direction perpendicular to substrate.

A method for fabricating an array substrate, comprising: providing a base substrate; forming a driving-circuit layer, which comprises first driving circuits and second driving circuits; forming a first electrode layer, which comprises transferring electrodes electrically connected to the first driving circuits, and pixel electrodes electrically connected to the second driving-circuits; forming a pixel-defining layer, which is provided with pixel openings and connecting via holes; forming a first pattern-defining layer, which covers the connecting via holes and exposes the pixel openings; forming an organic light-emitting-material layer, which covers the pixel openings and the first pattern-defining layer; removing the first pattern-defining layer, such that the organic light-emitting-material layer forms an organic light-emitting layer; forming a second pattern-defining layer surrounding the connecting via holes; and forming a second electrode layer, which comprises a common electrode and fingerprint-recognition electrodes isolated by the second pattern-defining layer.

A method of manufacturing a display panel includes providing a base substrate and forming a plurality of anodes above the base substrate; forming a photoresist layer above a side of the base substrate above which the plurality of anodes are formed, the photoresist layer including a plurality of openings and each opening corresponding to at least one anode; and forming a plurality of light emitting layers and a cathode layer sequentially above a side of the base substrate above which the plurality of anodes and the photoresist layer are formed, the cathode layer including a plurality of cathode films and each cathode film corresponding to a single opening.

A quantum dot LED display apparatus includes a substrate having a plurality of banks deposited thereon. A plurality of red emitting LED sub-pixels, green emitting LED sub-pixels, and blue emitting LED sub-pixels are individually disposed between the banks. Each of the red emitting LED sub-pixels, green emitting LED sub-pixels, and blue emitting LED sub-pixels has an emissive layer, wherein each of the emissive layers comprises quantum dots, an organic matrix, and a photoinitiator. A first concentration of the photoinitiator in the blue emitting LED sub-pixels is lower than a second concentration of the photoinitiator in the red emitting LED sub-pixels, and lower than a third concentration of the photoinitiator in the green emitting LED sub-pixels.

A technique, comprising: forming in situ on a support substrate: a first metal layer; a light-absorbing layer after the first metal layer; a conductor pattern after the light-absorbing layer; and a semiconductor layer after the conductor pattern; patterning the semiconductor layer using a resist mask to form a semiconductor pattern defining one or more semiconductor channels of one or more semiconductor devices; and patterning the light-absorbing layer using the resist mask and the conductor pattern, so as to selectively retain the light-absorbing layer in regions that are occupied by at least one of the resist mask and the conductor pattern.

A method for manufacturing the pixel definition layer includes forming a photolithographic material film on a substrate; performing a pre-drying treatment, a first exposure treatment, and a development treatment sequentially on the photolithographic material film to form an initial pattern of the pixel definition layer; and performing a second exposure treatment and a curing treatment sequentially on the initial pattern to form a final pattern of the pixel definition layer.

Alight-emitting element includes an anode electrode, a cathode electrode, a light-emitting layer, a positive hole transport layer, and an electron transport layer. The light-emitting layer, the positive hole transport layer, and the electron transport layer are provided between the anode electrode and the cathode electrode. The light-emitting layer includes QD phosphor particles, a positive hole transport substance configured to transport positive holes transported thereto by the positive hole transport layer, an electron transport substance configured to transport electrons transported thereto by the electron transport layer, and a photosensitive host material.