A piezoelectric element connection structure, a vehicle, and a piezoelectric element connection method are disclosed. This piezoelectric element connection structure includes: a body; a casing that include a bottom and is fixedly connected to the body so as to face the placing area for the board; a piezoelectric element that is placed on the bottom; and a coil wire that includes a winding shape, extends from the piezoelectric element toward the placing area for the board, and electrically connects between the piezoelectric element and the board.

An RF integrated circuit device can includes a substrate and a High Electron Mobility Transistor (HEMT) device on the substrate including a ScAlN layer configured to provide a buffer layer of the HEMT device to confine formation of a 2DEG channel region of the HEMT device. An RF piezoelectric resonator device can be on the substrate including the ScAlN layer sandwiched between a top electrode and a bottom electrode of the RF piezoelectric resonator device to provide a piezoelectric resonator for the RF piezoelectric resonator device.

A vibrator includes a vibrating part including a pair of vibrating plates and a piezoelectric material provided between the pair of vibrating plates, a supporting part including a pair of supporting plates and an interplate portion provided between the pair of supporting plates, and a wire provided in the vibrating part and the supporting part, wherein the wire is exposed from the supporting part.

A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.

A composite sensor includes a first sensor outputting a first sensor signal, a second sensor outputting a second sensor signal, a circuit board electrically connected to the first and second sensors, and a mount member having one surface on which the first and second sensors and the circuit board are disposed. The first and second sensors have respective input terminals to which respective input signals are inputted, and have respective output terminals from which the first and second sensor signals are outputted. When a virtual straight line passing respective centers of the first and second sensors parallel to an arrangement direction of the sensors is defined, the respective input terminals of the first and second sensors are disposed in one of two regions divided by the virtual line, and the respective output terminals of the first and second sensors are disposed in a remaining one of the two regions.

A linear valve drive for connection to a valve body which has a valve seat is described, wherein said linear valve drive comprises a drive housing, a valve closure element and a piezoelectric actuator which is arranged within said drive housing. Said valve closure element is displaceable in the axial direction between an open position and a closed position by means of said piezoelectric actuator and an interposed actuating device. Said piezoelectric actuator is supported on said actuating device via its side directed towards the valve closure element. Said linear valve drive comprises an adjusting device which is configured such that an idle stroke of said linear valve drive is adjustable. A valve is also described.

A MEMS component having increased integration density and a method for manufacturing such a component are specified. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between the base wafer and the cover wafer. A second cavity is arranged over the cover wafer, below a thin-layer covering. The cavities contain component structures.

A fluid actuator includes an actuating portion, a piezoelectric unit, a conduction unit, and a levelness regulating portion. The actuating portion includes a first actuating area, a second actuating area, and at least one connecting section between the two actuating areas. The piezoelectric unit includes a first signal area and a second signal area. The two signal areas are provided in the same plane and are isolated from each other by an isolating portion. The piezoelectric unit corresponds in position to the first actuating area of the actuating portion. The conduction unit includes a first electrode and a second electrode. The first signal area of the piezoelectric unit is electrically connected to the first electrode, and the second signal area of the piezoelectric unit to the second electrode. The levelness regulating portion, the piezoelectric unit, and the conduction unit are located on the same side of the actuating portion.

A fluid actuator includes an actuating portion, a piezoelectric unit, a conduction unit, and a levelness regulating portion. The actuating portion includes a first actuating area, a second actuating area, and at least one connecting section between the two actuating areas. The piezoelectric unit includes a first signal area and a second signal area. The two signal areas are provided in the same plane and are isolated from each other by an isolating portion. The piezoelectric unit corresponds in position to the first actuating area of the actuating portion. The conduction unit includes a first electrode and a second electrode. The first signal area of the piezoelectric unit is electrically connected to the first electrode, and the second signal area of the piezoelectric unit to the second electrode. The levelness regulating portion, the piezoelectric unit, and the conduction unit are located on the same side of the actuating portion.

A crystal element includes a vibration part, a holding part, an electrode part, and a recess that corresponds to a recess and/or protrusion. The vibration part has a pair of vibration-part main surfaces. The holding part is formed integrally with the vibration part to be connected to an outer edge of vibration part and has a pair of holding-part main surfaces and holding-part side surfaces. The electrode part is provided at the vibration-part main surfaces. The recess is located at the holding-part side surfaces.