Quantum computing assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a quantum computing assembly may include: a package substrate; a first die coupled to the package substrate; and a second die coupled to the second surface of the package substrate and coupled to the first die; wherein the first die or the second die includes quantum processing circuitry.

Quantum computing assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a quantum computing assembly may include: a package substrate; a first die coupled to the package substrate; and a second die coupled to the second surface of the package substrate and coupled to the first die; wherein the first die or the second die includes quantum processing circuitry.

A superconducting lead is presented for conducting electrical current to a superconducting device. the superconducting lead comprises first and second sections arranged one after the other along the lead, such that when the lead is brought to the superconducting device, the first and second sections are respectively proximal and distal sections with respect to the superconducting device, the proximal and distal sections being configured such that they differ from one another in at least one of heat conductance and working current.

A high temperature superconducting joint, a high temperature superconducting wire or tape comprising a high temperature superconducting joint, or an MRI or NMR machine comprising a high temperature superconducting wire or tape comprising a high temperature superconducting joint. Also, methods for producing a high temperature superconducting joint for use in a superconducting wire or an MRI or NMR machine, or other high field generating coil.