The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.

Automated fluid handling system comprising a housing and two or more fluid handling units arranged as interchangeable modular components with an external fluidics section and an internal non fluidics section, and wherein the housing comprises a liquid handling panel with two or more of component positions for receiving said interchangeable modular components such that the external fluidics section is separated from the non fluidics section by the liquid handling panel.

A heat insulating member 13 is provided on the outer circumference of a connection pipe 11. The heat insulating member 13 includes: a tube 12; and an air layer 15 between the connection pipe 11 and the tube 12. Accordingly, it is possible to always keep the temperature of a sample component at the time of detection by a detector constant and thus prevent an influence of the temperature on an output result of the detector, in a low flow rate analysis using a modularized column unit and a modularized detection unit.

Described embodiments include a system and a method. A described system includes a pipeline system. The pipeline system includes a transportation conduit containing a natural gas hydrate flowing from a first geographic location to a second geographic location. The pipeline system includes a cooling conduit running parallel to the transportation conduit, and having a heat-transfer surface thermally coupled with the flowing natural gas hydrate. The cooling conduit contains a heat-transfer fluid flowing between the first geographic location and the second geographic location. The flowing heat-transfer fluid has a target temperature range predicted to maintain a selected stability of the flowing natural gas hydrate.

Embodiments of mechanisms for processing a semiconductor wafer are provided. A method for processing a wafer includes providing a wafer process apparatus. The wafer process apparatus includes a chamber and a stage positioned in the chamber for supporting the semiconductor wafer. The method also includes supplying a process gas to the semiconductor wafer via a discharged assembly that is adjacent to the stage. The discharged assembly includes a discharged passage configured without a vertical flow path section.

Low head loss systems are detailed. The systems may include chambers having low impedance to water flow therethrough and repositionable gates or other valves within the chambers. The valves may direct water as a function of whether an associated heating device is active. At least some gates may incorporate poppet valves or other high-flow by-passes.

A bypass valve having a valve housing and a slide-longitudinally movable in the valve housing. An inlet duct, an outlet duct and a further outlet duct are formed in the valve housing. A closing body (35a) of the slide interacts, by way of its longitudinal movement, with a slide seat formed in the valve housing and thereby opens and closes a first hydraulic connection between the inlet duct and the outlet duct. A further closing body of the slide interacts, by way of its longitudinal movement, with a further slide seat formed in the valve housing and thereby opens and closes a second hydraulic connection between the inlet duct and the further outlet duct. The longitudinal movement of the slide is controlled by way of an electromagnetic actuator. The bypass valve has a cooling device for cooling the actuator.

A heat exchange device for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body having an inlet configured to receive a flow of liquid adhesive material and an outlet configured to provide the liquid adhesive material to a dispensing device for the adhesive bonding application. A fluid passageway in the body connects the inlet and the outlet. The fluid passageway includes a thin slit section in the form of an elongated ring shape, having a length along a fluid flow direction between the inlet and the outlet, the thin slit section further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. The heat exchange device further includes a heating element for heating the liquid adhesive material flowing through the thin slit section.

A hot gas generation device with which a gas flow, for example, an air flow, is heated. This device is used for heating an edge band or another coating material, in particular an adhesive layer provided on this coating material. In this way, the coating material is prepared for being applied to a (wooden) work piece, which may, for example, be plate-shaped.

A fluid pipeline has a first end and a second end. An elongated heat trace element comprised of first and second heat tubes is aligned and coupled to at least a portion of an outer surface of the fluid pipeline. The outer surface of fluid pipeline carries a first insulation material covering a first portion of the outer surface. The outer surface of the fluid pipeline further carries a second insulation material covering a second portion of the outer surface and wherein the second portion of the outer surface is different than the first portion of the outer surface. The first and second insulation materials are configured to cover the outer surface of the fluid pipeline. The fluid pipeline further comprises a third insulation material carried over a second outer surface defined by the cooperation of the first and second insulation materials.