A heat-debondable adhesive article having two opposing sides is provided that includes a shape-memory polymer sheet in its temporary strained shape that includes a plurality of slits therein and a first adhesive on one opposing side of the polymer sheet and a second adhesive on the other opposing side of the polymer sheet. The provided article, optionally, includes a first substrate in contact with the first adhesive and a second substrate in contact with the second adhesive. The article can be debonded by heating the article to a temperature equal to or greater than a transition temperature for the shape-memory polymer sheet.

A method of removing backing film from a sheet element is provided. The sheet element has a preimpregnated layer, and sheets of backing film are adhered to the top and bottom of the preimpregnated layer. The backing film has a different coefficient of thermal expansion than the preimpregnated layer, and a plane of the sheet element is defined by the peripheral edge. A shear strain is created between the backing films and the preimpregnated layer by cooling the sheet element. A fluid stream is directed at a portion of the peripheral edge, the fluid stream being directed in the plane of the sheet element. The fluid stream causes the backing films to separate from the top and bottom of the preimpregnated layer. A differential pressure is simultaneously applied to the backing films relative to the fluid stream to cause the backing films to be removed from the preimpregnated layer.

A mobile dismantling system includes an automatic frame dismantling apparatus, a fragmenting apparatus, and a conveying apparatus, all of which are disposed on a mobile apparatus, such as a wheeled transport vehicle. The automatic frame dismantling apparatus includes a dismantling platform and frame dismantling members. The fragmenting apparatus includes a back plate fragmenting device and a cell encapsulation laminate fragmenting device, each of which has a fragmenting platform, a fragmenting unit, and a material collecting and sorting device. The conveying apparatus is disposed above the automatic frame dismantling apparatus and the fragmenting apparatus, and includes a robot for moving solar cell module.

A film-peeling apparatus is adapted to peel a protective film on a surface of a substrate. The surface of the substrate has a bare area which is not covered by the protective film. The film-peeling apparatus includes a punching member, a connector connected to the punching member, and a controller. The controller is configured for driving, through the connector, the punching member to punch at predetermined positions nearby or on a first edge of the protective film adjacent to the bare area.

A method of removing backing film from a sheet element is provided. The sheet element has a preimpregnated layer, and sheets of backing film are adhered to the top and bottom of the preimpregnated layer. The backing film has a different coefficient of thermal expansion than the preimpregnated layer, and a plane of the sheet element is defined by the peripheral edge. A shear strain is created between the backing films and the preimpregnated layer by cooling the sheet element. A fluid stream is directed at a portion of the peripheral edge, the fluid stream being directed in the plane of the sheet element. The fluid stream causes the backing films to separate from the top and bottom of the preimpregnated layer. A differential pressure is simultaneously applied to the backing films relative to the fluid stream to cause the backing films to be removed from the preimpregnated layer.

This invention relates to removable pressure sensitive adhesive compositions and constructions that contain an emulsion acrylic pressure sensitive adhesive copolymer of a plurality of acrylic monomers and at least one polymerizable acid. The invention further relates to labels, particularly removable polymeric labels for use on reusable containers.

Method and device for delamination/dismantling of multi-layer systems SM comprising several layers including at least one organic layer, wherein the layers are separated by interfaces, characterized in that it comprises at least the following steps: Mixing the multilayer system with a fluid composed of at least one gas having the particularity of causing the swelling of at least one of the layers and one or more non-reactive liquids having the particularity of allowing the separation of each layer unitarily or of subsets of layers composing the multilayer system without degradation of the constituents of the layers, the gas/liquid fluid being raised in temperature and pressure, Recovering separately at least one or more layers or a subset of undegraded layers.

A method for manufacturing a circuit board includes: forming a first adhesive layer on a first surface of a vibration unit, in which the vibration unit includes at least one piezoelectric material layer; forming a first stacking structure on the first adhesive layer; and applying a voltage to the at least one piezoelectric material layer to cause the at least one piezoelectric material layer to vibrate, such that the first stacking structure is separate from the vibration unit.

A film-peeling apparatus is adapted to peel a protective film on a surface of a substrate. The surface of the substrate has a bare area which is not covered by the protective film. The film-peeling apparatus includes a punching member, a connector connected to the punching member, and a controller. The controller is configured for driving, through the connector, the punching member to punch at predetermined positions nearby or on a first edge of the protective film adjacent to the bare area.

A method for manufacturing a circuit board includes: forming a first adhesive layer on a first surface of a vibration unit, in which the vibration unit includes at least one piezoelectric material layer; forming a first stacking structure on the first adhesive layer; and applying a voltage to the at least one piezoelectric material layer to cause the at least one piezoelectric material layer to vibrate, such that the first stacking structure is separate from the vibration unit.