A method of and system for removing a portion of a thermoplastic component is provided. The component includes a thermoplastic material having a melting temperature. The method includes: a) providing a glider that includes an electrically conductive material operable to produce thermal energy resulting from electrical resistance; b) heating a portion of the glider with electrical energy to a glider operating temperature that is equal or greater than the melting temperature; and c) removing the portion by engaging the component with the glider and translating one of the glider or the component relative to the other. The engagement of the glider and the component causes an amount of the thermoplastic material to melt, and the translation of the one of the glider or the component relative to the other removes the portion from the thermoplastic component.

Soft-imprint alignment processes for patterning liquid crystal polymer layers via contact with a reusable alignment template are described herein. An example soft-imprint alignment process includes contacting a liquid crystal polymer layer with a reusable alignment template that has a desired surface alignment pattern such that the liquid crystal molecules of the liquid crystal polymer are aligned to the surface alignment pattern via chemical, steric, or other intermolecular interaction. The patterned liquid crystal polymer layer may then be polymerized and separated from the reusable alignment template. The process can be repeated many times. The reusable alignment template may include a photo-alignment layer that does not comprise surface relief structures that correspond to the surface alignment pattern and a release layer above this photo-alignment layer. A reusable alignment template and methods of fabricating the same are also disclosed.

A disassembling device facilitating a gentle disassembly of components glued together includes a base, a heating plate, a moving member, and a vacuum suction assembly. The disassembling device disassembles and separates portions of an electronic device for post-manufacture analysis or other purposes. The electronic device can disassemble glued parts with speed and high efficiency. By applying suction and sufficient heating to glued-together portions of the electronic device, damages to the electronic device can be avoided.

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

The present disclosure relates to a silicone composition for use as a temporary bonding adhesive comprising: (A) a polydiorganosiloxane having at least two alkenyl groups in each molecule; (B) a polyorganosiloxane having at least one silicon-bonded hydrogen atom in each molecule; and (C) a thermally expandable powder having an expansion ratio of 10 or more.

A solar panel disassembling apparatus for disassembling a solar panel including a glass plate and a stacked film, includes a supporting plate of which is in contact with the glass plate, a moving scraper module including a first body moving in parallel with the supporting plate, a first elevator moving vertically, and a blade connected to the first elevator and changing in height and scraping the stacked film using the blade, and a moving pressing module including a second body moving in parallel with the supporting plate, a second elevator vertically, and a pressing unit connected to the second elevator and changing in height. The moving pressing module is disposed forward in the forward movement direction of the moving scraper module and presses and aligns the stacked film using the pressing unit ahead of the moving scraper module.

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate includes: a first holding unit that includes a heating mechanism heating the processing target substrate and holds the processing target substrate; a second holding unit that includes a heating mechanism heating the supporting substrate and holds the supporting substrate; a moving mechanism that relatively moves at least the first holding unit or the second holding unit in a horizontal direction; and a porous part that is annularly provided along an outer peripheral portion of the first holding unit and formed with a plurality of pores, and supplies an inert gas to the outer peripheral portion of the first holding unit holding the processing target substrate.

A method of removing a tight buffer coating from an optical fiber involves positioning an end section of the optical fiber next to an end of a tube, with at least a portion of the the end section including a primary coating and the tight buffer coating. The tube has an inner diameter greater than an outer diameter of the primary coating and an outer diameter less than an outer diameter of the tight buffer coating. The method also involves applying energy to heat the tight buffer coating, inserting the end section of the optical fiber into the tube so that the tight buffer coating contacts the end of the tube, and advancing the end section of the optical fiber along the tube. The tube removes the tight buffer coating from the primary coating as the end section of the optical fiber is advanced.

An embodiment of the invention may include a cleaving apparatus. The cleaving apparatus may include a first arm having a first cleaving wedge and a second arm having a second cleaving wedge. The first cleaving wedge may include a first front surface and a first bottom surface, where the first front surface is oriented away from the first bottom surface. The second cleaving wedge may include a second front surface and a second bottom surface, where the second front surface is oriented away from the second bottom surface. The first arm and the second arm may be arranged to move with respect to each other. Further, the cleaving apparatus may include a heating apparatus located in the first cleaving wedge.