A pad removal method includes affixing a first end of a pad guide to a first edge location of a pad. The pad removal method further includes affixing a second end of the pad guide to a second edge location of the pad. The pad removal method further includes moving the first end from a first position, a first distance from the second edge location, to a second position, a second distance from the second edge location, wherein the first distance is greater than a diameter of the pad, and the second distance is less than the diameter of the pad.

Disclosed is a turntable cloth peeling jig including: a cylindrical winding cylinder including a slit formed on an outer periphery of the cylindrical winding cylinder and extending in an axial direction thereof; a cloth clamping member disposed inside the winding cylinder and configured to clamp an outer peripheral edge of a cloth inserted into the slit; an extension bar attached to one end portion of the winding cylinder so as to extend coaxially therewith; an engaging portion provided at a tip end portion of the extension bar and engaged with a rotation jig configured to rotate the winding cylinder; and a handle provided in the engaging portion and configured to support the winding cylinder when rotating the rotating jig.

After molding a substrate located between first and second molds of a molding system, a used release film that is in contact with the substrate during molding is removed from the molding system with a gripper assembly, which is reciprocally movable between a retracted position outside the molding system and an extended position in a space between the first and second molds when the first and second molds are opened. A carriage mechanism on which the gripper assembly is mounted moves the gripper assembly towards the first or second mold until the gripper assembly contacts the used release film, before an actuator actuates the gripper assembly to clamp onto a part of the used release film. The carriage mechanism also conveys the gripper assembly away from the first mold or second mold to remove the used release film from the molding system.

A system for protecting a surface of a substrate includes a protective film, which is configured to be applied and secured to the surface, as well as a backing on an adherent surface of the protective film and an application tape over an exterior surface of the protective film. Protruding features, such as tabs, adjacent to different peripheral edges of the protective film may enable removal of the backing and the application tape from the protective film, and may include features that indicate the order in which each protruding feature is to be grasped to peel its corresponding element away from the protective film. Methods of using such a system are also disclosed.

A hand tool is provided for removing a secondary liner from a tape carrier of a two-sided adhesive tape where the opposing primary side of the tape carrier is attached to a surface. The hand tool includes a handle. One end of the handle may include a handle fulcrum depending from the handle. A plurality of sharp points together define a mathematical line. The plurality of sharp points also define point axes which together define a mathematical plane. The mathematical line is coincident with the mathematical plane. The mathematical plane defines an acute angle with respect to the handle and to the handle fulcrum.

A system for protecting a surface of a substrate includes a protective film, which is configured to be applied and secured to the surface, as well as a backing on an adherent surface of the protective film and an application tape over an exterior surface of the protective film. Protruding features, such as tabs, adjacent to different peripheral edges of the protective film may enable removal of the backing and the application tape from the protective film, and may include features that indicate the order in which each protruding feature is to be grasped to peel its corresponding element away from the protective film. Methods of using such a system are also disclosed.

A sheet separation device separates a non-bonding portion of a two-ply sheet in which two sheets are overlapped and bonded together at a bonding portion of the two-ply sheet. The sheet separation device includes a winding roller and a gripper. The winding roller rotates and winds the two-ply sheet to separate the two-ply sheet. The gripper is disposed in the winding roller and configured to grip a gripped portion of the two-ply sheet at one end of the two-ply sheet without abutting a tip of the gripped portion at the one end of the two-ply sheet on a member.

A solar module exterior disassembling apparatus for disassembling an exterior of a solar module including a module body, a frame and a junction box attached to the module body includes a positioning plate supporting one surface of the module body from below the solar module and being able to move up and down, a top contact plate over the positioning plate and in contact with the other surface of the module body when the positioning plate is moved up, frame separation blades around the top contact plate and moving in parallel with a surface of the module body between a first position inside the frame and a second position outside the frame, and a pressing actuator including pressing cylinders and pressing outward from the module body and disassembling the module body by moving forward the frame separation blades from the first position to the second position with the pressing cylinders.

An operation method of a semiconductor removing apparatus includes moving a semiconductor structure to a stage, wherein the semiconductor structure includes a lower substrate, a cap, and a micro electro mechanical system (MEMS) structure between the lower substrate and the cap, and the cap has a diced portion; pulling, by a clamp assembly, a tape of a tape roll from a first side of the stage to a second side of the stage opposite to the first side, such that the tape is attached to the cap of the semiconductor structure; and pulling, by the clamp assembly, the tape of the tape roll from the second side of the stage back to the first side of the stage, such that the diced portion of the cap separates from the semiconductor structure.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a roller device may include a carriage or housing and one or more rollers coupled or integrated with the housing, configured to apply a protective material to a surface of the electronic device in a first orientation, and configured to function as a device stand in a second orientation. In addition or alternatively, a roller guide apparatus and/or a wedge may be utilized to assist the roller device in applying the protective material to the surface of the electronic device.