A portable device for attaching a connector to an optical fiber, the optical fiber having an end, the device comprising means for receiving the optical fiber at the end of the optical fiber; and a connector station for autonomously attaching the connector to the optical fiber.

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

An adhesive application valve comprising an applicator, a Z-axis actuator operably connected to the applicator, wherein the Z-axis actuator and the rotation device are each capable of moving independently of each other to position the applicator in a position to apply an amount of adhesive to a top substrate prior to bonding with a bottom substrate is provided. Furthermore, a machine comprising an end effector, and an adhesive application valve configured to apply an amount of adhesive onto the top substrate, the end effector configured to place the top substrate into a position of engagement with the adhesive application valve, and place the top substrate onto the bottom substrate to facilitate initial contact between the adhesive applied to the top substrate and a fill material applied to the bottom substrate is also provided. A method of optical bonding is further provided.

An overlay applicator tray including a cradle including a device slot. The device slot is configured to securely hold an electronic device in the cradle. The overlay applicator tray also can include an overlay applicator. The overlay applicator can include an overlay layer and an adhesive release liner. The overlay layer can include a top side and a bottom side. The bottom side is configured to be adhered to a screen of the electronic device. The adhesive release liner is removably attached to the bottom side of the overlay layer. The overlay applicator tray additionally can include an alignment piece coupling the cradle to the overlay applicator. The alignment piece aligns the overlay layer of the overlay applicator with the screen as the overlay layer is applied to the screen when the electronic device is securely held in the device slot. The overlay applicator tray further can include a first pull tab on the adhesive release liner. The first pull tab is configured to be pulled to remove the adhesive release liner from the bottom side of the overlay layer and expose an adhesive of the overlay layer. Other embodiments are described.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a roller device may include a carriage or housing and one or more rollers coupled or integrated with the housing, configured to apply a protective material to a surface of the electronic device in a first orientation, and configured to function as a device stand in a second orientation. In addition or alternatively, a roller guide apparatus and/or a wedge may be utilized to assist the roller device in applying the protective material to the surface of the electronic device.

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

A method for applying labels to a cable or conduit with a known circumference, the method including supplying at least one label, wherein the at least one label has a known label height, the label height is greater than the known circumference of the cable or conduit, and the label has a bottom, middle, and top portions, providing at least one tamping device, tamping the middle portion of the at least one label to the cable or conduit with the at least one tamping device, wherein the middle portion of the at least one label adheres to the cable or conduit, providing a guide shoe assembly, pressing the top portion of the at least one label against the cable or conduit with the guide shoe assembly, and pressing the bottom portion of the at least one label against the cable or conduit with the guide shoe assembly, wherein the top portion of the at least one label and the bottom portion of the at least one label overlap after pressed onto the cable or conduit. Further, wherein the step of providing a guide shoe assembly includes providing at least one guide shoe connected to a support mount and providing a rounding member.

Disclosed are a chip card assembling structure and a method thereof, including at least one base plate, at least one fixing element having a side forming a fixing trough corresponding to the base plate, at least one adhesive film disposed on one side of the fixing element to cover the fixing trough, and at least one thin-film chip received in the fixing trough and bonded to the adhesive film. To use the present invention, the adhesive film, together with the thin-film chip, is lifted and the base plate is placed into the fixing trough, following setting the adhesive film and the thin-film chip back to have the thin-film chip coupled to the base plate. Then, the adhesive film is lifted to remove the coupled thin-film chip and base plate, so that the relative position between the thin-film chip and the base plate is precise and correct.

A method for applying a label to an electrical cable having an outermost sheath with convolutions defining alternating peaks and valleys, the method including attaching the label to the sheath. The label includes a label substrate, the label substrate includes an attaching side, the attaching side being attached through an adhesive; and the label attaches to the peaks and spans across the valleys and circumferentially wraps around the sheath.