An apparatus for coating a part that has an asymmetrical edge. The apparatus includes a film dispenser, a film retriever, a mandrel; and a part holder. Preferably one or both of the mandrel and the part holder move in an angular relationship to one another, and the film dispenser and the film retriever move co-operatively in at least two dimensions with respect to the part holder. There is further provided a film having a first edge and a second edge, and the film can be a decorative coating, a protective coating or combinations of these. The film dispenser holds the first edge of the film, the film is positioned between the mandrel and the part holder and the film retriever holds the film second edge.

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

A method of manufacturing a case for a mobile electronic device is provided for cases having a generally rectangular shape, two long side walls extending substantially parallel to another, and two short end walls extending substantially parallel to one another between the long side walls. The method includes molding a case portion of a first material of a first hardness forming a substantial portion of the side walls and end walls, and a second material of a second hardness extending around the inner periphery of the first material wherein the first hardness is greater than the second hardness, presenting a strip to an outer periphery of the case portion, applying heat and pressure to a backing layer, and removing the backing strip from which the foil has been removed. The present method is advantageous in that it provides a case with a durable and chemically resistive finish.

In accordance with some embodiments, a wafer taping device is provided. The wafer taping device includes a tape delivering along a first direction. The wafer taping device also includes a wafer mount unit disposed below the tape. The wafer mount unit has an upper surface for supporting a wafer and having a notch for allowing a cut mark of the wafer to align with it. The notch is staggered with a second direction in the upper surface, and the second direction is substantially perpendicular to the first direction. In addition, the wafer taping device includes a laminating roller disposed above the wafer mount unit and having a long axis elongated in the second direction. The laminating roller is configured to reciprocate along the first direction for pressing the tape to the wafer.

A method for attaching a fingerprint module which includes providing an adhesive tape which includes a base film, a protective film which is oppositely arranged to the base film, and a number of adhesive layers positioned between the base film and the protective film and are arranged at intervals, and each of the base film and the protective film is an integral piece of film which is continuous in an entire layer. The method further includes partially peeling off the protective film to expose a first adhesive surface of one of the plurality of adhesive layers; attaching the fingerprint module to the exposed first adhesive surface of the adhesive layer; and peeling off the attached fingerprint module and adhesive layer together from the base film to expose a second adhesive surface of the adhesive layer.

The invention relates to a method for manufacturing a label laminate. The method includes forming at least one water based adhesive layer on a belt, drying said at least one water based adhesive layer on the belt, unwinding a first material layer, unwinding a second material layer, attaching said at least one dried water based adhesive layer to the surface of the first material layer, and laminating the first material layer comprising at least one water based adhesive layer together with the second material layer in order to form the label laminate. The invention also relates to a label laminate and to a system for manufacturing a label laminate.

An apparatus for applying self-adhesive labels includes a supporting base for at least one reel of a ribbon that supports self-adhesive labels, elements of feeding the ribbon to a head for applying the self-adhesive labels, and a device for taking up the ribbon. The application head can move on command about an orientation axis in order to vary its own direction of extension with respect to the unwinding direction of the ribbon from the reel. The feeder elements include at least one redirection roller, the rotation axis of which can rotate on command, with respect to the reel, about an adjustment axis that is substantially parallel to the orientation axis in order to bring the direction of extension of the ribbon at the application head.

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

An elevator maintenance kit is provided for surfacing an elevator sheave that engages with an elevator tension member. The kit includes a substrate with an adhesive backing, and a substrate applicator that is operable to apply the substrate to the sheave as the sheave is rotated. The adhesive backing is operable to attach the substrate to the sheave during the sheave rotation.