Patent classifications
Y10T156/1712
High altitude balloon and method and apparatus for its manufacture
A high altitude balloon, including a method and machine for manufacture, uses a perimeter border strip to couple two circular balloon panels with a lap or butt seal. Simultaneous sealing of two perimeter seals, one between the border strip and each of two balloon panels, is provided by supporting stacked balloon panels on a rotatable support and sealing around the full perimeter of the two interposed balloon panels and the border strip. The method and machine for manufacture allow for the mass production of high altitude balloons and minimize necessary material handling. The perimeter border strip can be dispensed and guided relative to the perimeter of the balloon panels for positioning before sealing together, as a bonding device is rotated relative to the balloon envelope.
Feedblock for manufacturing multilayer polymeric films
A feedblock including a first packet creator that forms a first packet including a first plurality of polymeric layers, the first plurality of layers including at least four first individual polymeric layers; and a second packet creator that forms a second packet including a second plurality of polymeric layers, the second plurality of layers including at least four second individual polymeric layers, wherein the first and second packet creators are configured such that, for each packet creator, respective individual polymeric layers of the plurality of polymeric layers are formed at approximately the same time. The feedblock may include a packet combiner that receives and combines the first and second primary packets to form a multilayer stream. In some examples, at least one of the first and second primary packets may be spread in the cross-web direction prior to being combined with one another.
Peeling method, semiconductor device, and peeling apparatus
To improve peelability, yield in a peeling step, and yield in manufacturing a flexible device. A peeling method is employed which includes a first step of forming a peeling layer containing tungsten over a support substrate; a second step of forming, over the peeling layer, a layer to be peeled formed of a stack including a first layer containing silicon oxynitride and a second layer containing silicon nitride in this order and forming an oxide layer containing tungsten oxide between the peeling layer and the layer to be peeled; a third step of forming a compound containing tungsten and nitrogen in the oxide layer by heat treatment; and a fourth step of peeling the peeling layer from the layer to be peeled at the oxide layer.
Laminates, and systems and methods for laminating
A frangible laminate includes first, second and third webs, and the second web is positioned between the first and third webs. The forming of the frangible laminate includes adhesively bonding a first plurality of sections of the second web to the first web, applying release material in order to inhibit at least some of any bonding between the first plurality of sections of the second web and the third web, and adhesively bonding a second plurality of sections of the second web to the third web. The frangible laminate is separated into a first laminate and a second laminate, so that the first laminate includes the first web and the first plurality of sections of the second web, and the second laminate includes the third web and the second plurality of sections of the second web.
Movable laminator and plastic flooring laminating device
The present invention relates to a movable laminator and a plastic flooring laminating device applied by same. A laminating mechanism, a driving mechanism and a conveying mechanism assembled on a rack compose the laminator which can make continuous reciprocating movements. The movable laminator is then disposed in an automatic production line for plastic flooring to cooperate with an extruder, a rolling unit and a drawing mechanism to laminate a plastic flooring material composed of a substrate layer, a printed layer and a wear-resisting layer into a finished plastic flooring product in an automatic operation manner. Because the time of the lamination of the material by the movable laminator can match the speed at which the material is conveyed and moved, the laminating mechanism is driven by the second power source to move from the front section position to the rear section position on the rack.
PEELING METHOD, SEMICONDUCTOR DEVICE, AND PEELING APPARATUS
To improve peelability, yield in a peeling step, and yield in manufacturing a flexible device. A peeling method is employed which includes a first step of forming a peeling layer containing tungsten over a support substrate; a second step of forming, over the peeling layer, a layer to be peeled formed of a stack including a first layer containing silicon oxynitride and a second layer containing silicon nitride in this order and forming an oxide layer containing tungsten oxide between the peeling layer and the layer to be peeled; a third step of forming a compound containing tungsten and nitrogen in the oxide layer by heat treatment; and a fourth step of peeling the peeling layer from the layer to be peeled at the oxide layer.
System and method for the production of gypsum board using starch pellets
The present invention relates to a system and method for the production of gypsum board using starch pellets. In accordance with the present disclosure, the starch necessary for board formation is provided in the form of starch pellets. These pellets are mixed with a gypsum slurry in a mixer. The pellets are initially insoluble and do not dissolve. However, during subsequent drying stages, the pellets become soluble and dissolve into the gypsum phase. This both provides the desired starch component and also results in the formation of voids within the set gypsum.
System and Method for the Production of Gypsum Board Using Starch Pellets
The present invention relates to a system and method for the production of gypsum board using starch pellets. In accordance with the present disclosure, the starch necessary for board formation is provided in the form of starch pellets. These pellets are mixed with a gypsum slurry in a mixer. The pellets are initially insoluble and do not dissolve. However, during subsequent drying stages, the pellets become soluble and dissolve into the gypsum phase. This both provides the desired starch component and also results in the formation of voids within the set gypsum.
Peeling method, semiconductor device, and peeling apparatus
To improve peelability, yield in a peeling step, and yield in manufacturing a flexible device. A peeling method is employed which includes a first step of forming a peeling layer containing tungsten over a support substrate; a second step of forming, over the peeling layer, a layer to be peeled formed of a stack including a first layer containing silicon oxynitride and a second layer containing silicon nitride in this order and forming an oxide layer containing tungsten oxide between the peeling layer and the layer to be peeled; a third step of forming a compound containing tungsten and nitrogen in the oxide layer by heat treatment; and a fourth step of peeling the peeling layer from the layer to be peeled at the oxide layer.
Feedblock for manufacturing multilayer polymeric films
A feedblock including a first packet creator that forms a first packet including a first plurality of polymeric layers, the first plurality of layers including at least four first individual polymeric layers; and a second packet creator that forms a second packet including a second plurality of polymeric layers, the second plurality of layers including at least four second individual polymeric layers, wherein the first and second packet creators are configured such that, for each packet creator, respective individual polymeric layers of the plurality of polymeric layers are formed at approximately the same time. The feedblock may include a packet combiner that receives and combines the first and second primary packets to form a multilayer stream. In some examples, at least one of the first and second primary packets may be spread in the cross-web direction prior to being combined with one another.