An automated labeling method and apparatus includes a label web-severing mechanism and a label-applying assembly, the web-severing mechanism configured to synchronously sever a plurality of labels from a self-wound label web, and the label-applying assembly configured to synchronously apply the plurality of severed labels to a corresponding plurality of articles to be labeled.

Disclosed is an assembly manufacturing method comprising: cutting a prepreg into a prepreg sheet according to a first parameter; moving the prepreg sheet to an assembly arrangement area according to a second parameter; superimposing a metal foil and a plate according to a fourth parameter to form a copper foil set; and assembling the copper foil set and the prepreg sheet according to a third parameter to form an assembly.

An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates onto the transfer rails, unloading members configured to unload the substrates from the transfer rails, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates. An apparatus for bonding semiconductor chips may comprise a transfer rail configured to transfer substrates, loading members configured to load the substrates onto the transfer rail, unloading members configured to unload the substrates from the transfer rail, a buffer member at a side of the transfer rail configured to temporarily receive the substrates loaded by the loading members, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates.

Disclosed is an assembly manufacturing method comprising: cutting a prepreg into a prepreg sheet according to a first parameter; moving the prepreg sheet to an assembly arrangement area according to a second parameter; superimposing a metal foil and a plate according to a fourth parameter to form a copper foil set; and assembling the copper foil set and the prepreg sheet according to a third parameter to form an assembly.

An automated labeling method and apparatus includes a label web-severing mechanism and a label-applying assembly, the web-severing mechanism configured to synchronously sever a plurality of labels from a self-wound label web, and the label-applying assembly configured to synchronously apply the plurality of severed labels to a corresponding plurality of articles to be labeled.

Disclosed is an assembly arrangement system, comprising a feeding unit, a conveyor unit and an assembling unit. The feeding unit comprises a supplying part and a cutting part. The supplying part is provided with a prepreg and configured to supply the prepreg to the cutting part. The cutting part cuts the prepreg to continuously form one or more prepreg sheets. The conveyor unit receives and conveys the prepreg sheet. The assembling unit comprises a metal foil supplying part, a first assembling part and a second assembling part. The second assembling part assembles a plate and a metal foil from the metal foil supplying part with the prepreg sheet from the conveyor unit into an assembly, and the first assembling part bears the assembly. Also provided is an assembly manufacturing method.

A machine for continuously forming heat-reflective blanks is provided. The heat-reflective blanks each include a blank of sheet material and a thermal film patch coupled to the blank. The machine includes an intake station configured to align a first blank of sheet material and a second blank of sheet material for application of a first thermal film patch and a second thermal film patch, respectively. The intake station is further configured to maintain a spacing between the first blank and the second blank. The intake station includes adjustable hold-down bars for maintaining an alignment and the spacing of the first and second blanks. The machine also includes an applicator station configured to apply the first and second thermal film patches to the first and second blanks, respectively, to form a first heat-reflective blank and a second heat-reflective blank, and an ejection station configured to eject the heat-reflective blanks.

An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates onto the transfer rails, unloading members configured to unload the substrates from the transfer rails, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates. An apparatus for bonding semiconductor chips may comprise a transfer rail configured to transfer substrates, loading members configured to load the substrates onto the transfer rail, unloading members configured to unload the substrates from the transfer rail, a buffer member at a side of the transfer rail configured to temporarily receive the substrates loaded by the loading members, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates.

An automated labeling method and apparatus includes a label web-severing mechanism and a label-applying assembly, the web-severing mechanism configured to synchronously sever a plurality of labels from a self-wound label web, and the label-applying assembly configured to synchronously apply the plurality of severed labels to a corresponding plurality of articles to be labeled.

An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates onto the transfer rails, unloading members configured to unload the substrates from the transfer rails, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates. An apparatus for bonding semiconductor chips may comprise a transfer rail configured to transfer substrates, loading members configured to load the substrates onto the transfer rail, unloading members configured to unload the substrates from the transfer rail, a buffer member at a side of the transfer rail configured to temporarily receive the substrates loaded by the loading members, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates.