The invention provides machines for removing strips of masking from glazing panes. Also provided are methods of removing strips of masking from glazing panes. One embodiment of a machine for removing strips of masking material from a glazing pane includes a cutting head and a processing station. The processing station can be constructed to retain the glazing pane in a processing position with a first surface of the glazing pane oriented toward the cutting head. The cutting head can be movable in various directions across the masked glazing pane and include cutters to cut strips from the masking material.

A device for forming a separation starting point that allows separation of a surface layer of a processed member to form a remaining portion is provided. A manufacturing device of a stack including a support and a remaining portion of a processed member whose surface layer is separated is provided. The device for forming the separation starting point includes a stage that supports the processed member, a cutter that faces the stage, a head portion that supports the cutter, an arm portion that supports the head portion, and a moving mechanism that relatively moves the cutter to the stage.

There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.

A method of removing a carrier plate is used to peel off and remove the carrier plate from a workpiece of a disk-shaped composite substrate in which the workpiece is disposed on a face side of the carrier plate with a temporary adhesive layer interposed therebetween. The method includes a step forming step of forming a step protruding laterally from the carrier plate more on a reverse side of the carrier plate than on the face side of the carrier plate, by removing an outer circumferential portion of the workpiece, an outer circumferential portion of the temporary adhesive layer, and a face-side side of an outer circumferential edge of the carrier plate, a starting point region forming step of forming a starting point region that acts as a starting point in peeling off the carrier plate from the workpiece.

There is provided a carrier plate removing method for removing a carrier plate from a workpiece disposed on a top surface of a carrier plate via a provisional bonding layer. The carrier plate removing method includes a stepped portion forming step of forming a stepped portion in which the workpiece projects sideward as compared with the carrier plate by processing the carrier plate so as to remove a peripheral portion of the carrier plate along a peripheral edge of the carrier plate from an undersurface side opposite from the top surface of the carrier plate, a carrier plate holding step of holding the carrier plate by a carrier plate holding unit, and a removing step of removing the carrier plate from the workpiece by applying a force from the carrier plate side to the stepped portion, and moving the workpiece in a direction of separating from the carrier plate.

A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.

There is provided a removal method of a carrier plate used when the carrier plate is removed from a workpiece bonded to a region excluding an outer rim part in a front surface of the carrier plate by a temporary bonding layer disposed on the whole of the front surface of the carrier plate. This removal method of a carrier plate includes a temporary bonding layer removal step of removing part or all of an outer rim part of the temporary bonding layer, a holding step of holding the workpiece from the upper side by a holding unit after removing part or all of the outer rim part of the temporary bonding layer, and a carrier plate removal step of removing the carrier plate from the workpiece by applying a downward force to the outer rim part of the carrier plate from the side of the front surface.

A method of removing a carrier plate is used to peel off and remove the carrier plate from a workpiece of a disk-shaped composite substrate in which the workpiece is disposed on a face side of the carrier plate with a temporary adhesive layer interposed therebetween. The method includes a step forming step of forming a step protruding laterally from the carrier plate more on a reverse side of the carrier plate than on the face side of the carrier plate, by removing an outer circumferential portion of the workpiece, an outer circumferential portion of the temporary adhesive layer, and a face-side side of an outer circumferential edge of the carrier plate, a starting point region forming step of forming a starting point region that acts as a starting point in peeling off the carrier plate from the workpiece.

A carrier plate removing method for removing a carrier plate from a workpiece previously provided through a temporary bonding layer on the front side of the carrier plate is provided. The carrier plate removing method includes a shoulder portion forming step of processing a peripheral portion of the carrier plate along a peripheral edge thereof from the front side of the carrier plate on which the workpiece is provided, thereby forming a shoulder portion as a lower part connected to the back side of the carrier plate, the lower part projecting horizontally outward from the side surface of an upper part connected to the front side of the carrier plate.

There is provided a removal method of a carrier plate used when the carrier plate is removed from a workpiece bonded to a region excluding an outer rim part in a front surface of the carrier plate by a temporary bonding layer disposed on the whole of the front surface of the carrier plate. This removal method of a carrier plate includes a temporary bonding layer removal step of removing part or all of an outer rim part of the temporary bonding layer, a holding step of holding the workpiece from the upper side by a holding unit after removing part or all of the outer rim part of the temporary bonding layer, and a carrier plate removal step of removing the carrier plate from the workpiece by applying a downward force to the outer rim part of the carrier plate from the side of the front surface.