Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further incudes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

When picking a die from an adhesive tape, a collet of a pick arm is positioned at a distance over the die, the die being mounted on a first surface of the adhesive tape. A flow of air is then generated onto a second surface of the adhesive surface opposite to the first surface for blowing the adhesive tape to displace the die towards a die-holding surface of the collet. Thereafter, the die is retained on the die-holding surface of the collet while the adhesive tape separates from the die.

A system and method for separating a layer from a layer assembly when the layer assembly includes a backing layer and a material layer. The system includes an automated machine having a controller and an end effector. A separating tool is attached to the end effector of the automated machine. The separating tool includes a displacing member, with an outer face, configured to establish a void between the backing layer and the material layer by displacing a portion of the backing layer. The separating layer also includes a securing member configured to establish a mechanical connection with a displaced portion of the backing layer.

The object of the invention is a flat file which is suitable for lifting off films from intermediate layers.

An apparatus and method for removing labels from containers made of plastics, such as PET bottles includes: a tubular stator and a rotor defining an annular chamber that extends along a path; on the rotor members are mounted for rotationally dragging and pushing the containers inside the annular chamber; on the tubular stator there are first scraping tools provided with first tip ends; the dragging and thrusting members include second scraping tools provided with second tip ends that are distributed along one or more helical paths; the first tip ends and the second tip ends define respectively in the annular chamber a first punctiform scraping surface and a second punctiform scraping surface for the containers, in which the distance between the first punctiform scraping surface and the second punctiform scraping surface is maintained substantially constant in a longitudinal and circumferal direction with respect to the rotor.

When picking a die from an adhesive tape, a collet of a pick arm is positioned at a distance over the die, the die being mounted on a first surface of the adhesive tape. A flow of air is then generated onto a second surface of the adhesive surface opposite to the first surface for blowing the adhesive tape to displace the die towards a die-holding surface of the collet. Thereafter, the die is retained on the die-holding surface of the collet while the adhesive tape separates from the die.

A method for separating a window includes providing a display device including a display panel, a window disposed on the display panel and including a color layer. An adhesive layer is disposed between the display panel and the window. Heat is applied to the display device. The method includes inserting a disassembling stick between the display panel and the window to separate an edge of the display panel from the window. The method includes cooling the display device. The method includes separating the display panel and the window from each other.

A chip ejecting apparatus includes a table configured to be provided with a dicing tape and a target chip adhered to an upper surface of the dicing tape, an ejector unit including a plurality of gas holes configured to inject a gas toward a lower surface of the dicing tape, and a control unit configured to separately control on/off operations of the plurality of gas holes and select an active gas hole group from the plurality of gas holes. The active gas hole group is selected to overlap the target chip, and is configured to inject the gas toward the dicing tape along a direction from a first edge of the target chip toward a second edge of the target chip opposite to the first edge of the target chip.

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further incudes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

A mobile dismantling system includes an automatic frame dismantling apparatus, a fragmenting apparatus, and a conveying apparatus, all of which are disposed on a mobile apparatus, such as a wheeled transport vehicle. The automatic frame dismantling apparatus includes a dismantling platform and frame dismantling members. The fragmenting apparatus includes a back plate fragmenting device and a cell encapsulation laminate fragmenting device, each of which has a fragmenting platform, a fragmenting unit, and a material collecting and sorting device. The conveying apparatus is disposed above the automatic frame dismantling apparatus and the fragmenting apparatus, and includes a robot for moving solar cell module.