A lug nut removal tool enables a user to remove a seized lug nut from a threaded stud. The lug nut removal tool comprises a drill bit which is drilled through a guide which can be adjusted in size by a collar. The drill bit comprises a plurality of blades separated by slots; the plurality of blades are mechanically coupled to cutting edges. The guide comprises guide slots which can be used to align the guide about the seized lug nut. In this manner, the user can attach the guide onto the seized lug nut and tighten the guide with a set screw. Then the user can attach the drill bit onto an air drill to cutting edge out the seized lug nut.

A protective cover for an electrostatic chuck may include a conductive wafer and a plasma resistant ceramic layer on at least one surface of the conductive wafer. The plasma resistant ceramic layer covers a top surface of the conductive wafer, side walls of the conductive wafer and an outer perimeter of a bottom surface of the conductive wafer. Alternatively, a protective cover for an electrostatic chuck may include a plasma resistant bulk sintered ceramic wafer and a conductive layer on a portion of a bottom surface of the plasma resistant bulk sintered ceramic wafer, wherein a perimeter of the bottom surface is not covered. The protective layer may be used to protect an electrostatic chuck during a plasma cleaning process.

A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber.

A chuck apparatus grips a workpiece by a gripping section having a pair of chuck members. The chuck apparatus is equipped with a cover member and pressing members. The cover member includes insertion holes through which fingers of the chuck members are inserted, and seal members that surround the insertion holes and abut against the fingers. The cover member is attached to a body so as to cover base portions of the chuck members, and is elastically deformable so as to follow displacement of the chuck members. The pressing members press the seal members against the fingers.

In embodiments, manufacturing a protective cover for an electrostatic chuck comprises coating a top surface and side walls of a conductive wafer with a plasma resistant ceramic, masking an inner region of a bottom surface of the conductive wafer, coating inner region of the bottom surface with the plasma resistant ceramic, and grinding the inner region of the bottom surface to a flatness of less than approximately 300 microns. In embodiments, a protective cover is manufactured by a process comprising applying a mask to an outer perimeter of a bottom surface of a plasma resistant ceramic wafer, coating the bottom surface of the plasma resistant ceramic wafer with an electrically conductive layer, and removing the mask, wherein an inner region of the bottom surface of the plasma resistant ceramic wafer is coated with the conductive layer.

A device for processing wafer-shaped articles comprises a closed process chamber. The closed process chamber comprises a housing providing a gas-tight enclosure, a rotary chuck located within the closed process chamber and adapted to hold a wafer shaped article thereon, and an interior cover disposed within said closed process chamber. The interior cover is movable between a first position in which the rotary chuck communicates with an outer wall of the closed process chamber, and a second position in which the interior cover seals against an inner surface of the closed process chamber adjacent the rotary chuck to define a gas-tight inner process chamber.

The invention relates to a tool holding device comprising a tool holding body for securing, in a fixed manner, a rotary tool comprising a shaft, provided with a clamping section and a receiving opening for the shall of the tool, a coolant feeding device for pressurized fluid, at least one coolant guiding device for guiding the coolant into a clamped tool shaft. The coolant guiding device is designed as at least one flat groove on an inner side of the receiving opening, joining to the front side on a free end of the tool holding body and directly adjacent to the tool shaft in the surroundings of the tool holding device or a coolant storing chamber and or collecting chamber is provided in the region of the free end of the tool holding body, to which the at least one coolant guiding device joins. The coolant storing chamber and or collecting chamber is connected by means of an annular gap to the surroundings of the tool holder device. The coolant storing chamber and/or collecting chamber and the annular gap are defined at least partially by the work shaft.

In embodiments, manufacturing a protective cover for an electrostatic chuck comprises coating a top surface and side walls of a conductive wafer with a plasma resistant ceramic, masking an inner region of a bottom surface of the conductive wafer, coating inner region of the bottom surface with the plasma resistant ceramic, and grinding the inner region of the bottom surface to a flatness of less than approximately 300 microns. In embodiments, a protective cover is manufactured by a process comprising applying a mask to an outer perimeter of a bottom surface of a plasma resistant ceramic wafer, coating the bottom surface of the plasma resistant ceramic wafer with an electrically conductive layer, and removing the mask, wherein an inner region of the bottom surface of the plasma resistant ceramic wafer is coated with the conductive layer.

A protective cover for an electrostatic chuck may include a conductive wafer and a plasma resistant ceramic layer on at least one surface of the conductive wafer. The plasma resistant ceramic layer covers a top surface of the conductive wafer, side walls of the conductive wafer and an outer perimeter of a bottom surface of the conductive wafer. Alternatively, a protective cover for an electrostatic chuck may include a plasma resistant bulk sintered ceramic wafer and a conductive layer on a portion of a bottom surface of the plasma resistant bulk sintered ceramic wafer, wherein a perimeter of the bottom surface is not covered. The protective layer may be used to protect an electrostatic chuck during a plasma cleaning process.

A drill chuck has a chuck body having a plurality of angularly spaced and axially extending but angled guide grooves each holding a jaw that is axially displaceable between an axially front closed position and an axially rear open position. Each jaw has an outer edge formed with external teeth, and also has an axially rearwardly directed rear face extending at an acute angle to a plane perpendicular to the axis. A ring rotatable on the body about the axis has an internal screwthread meshing with the teeth, and an adjustment sleeve rotationally coupled to the ring is rotatable to move the jaws between the open and closed positions. A cover disk on the rear end of the body is formed with respective throughgoing chip-discharge holes each having an inner end aligned with a respective one of the grooves and an outwardly open outer end.