Patent classifications
Y10T29/49048
SLIDER WITH BOND PAD ARRANGEMENTS
The present invention is directed to the fabrication of head sliders for use in hard disk drives, and in particular the provision and usage of electrical bond pads on the slider surface structure to accommodate needs of the fabrication process as well as slider operation within a disk drive.
Method of processing a slider
The present invention is directed to the fabrication of head sliders for use in hard disk drives, and in particular the provision and usage of electrical bond pads on the slider surface structure to accommodate needs of the fabrication process as well as slider operation within a disk drive.
MANUFACTURING METHOD OF A SLIDER
A manufacturing method of a slider includes steps of: (a) providing a row bar with a plurality of slider elements connecting together; (b) lapping surfaces of the row bar so as to obtain a predetermined requirement; (c) lowering the temperature of the surfaces lapped in the step (b) before and/or during lapping; and (d) cutting the row bar into a plurality of sliders. The present invention can prevent a local high temperature generated on the magnetic head during lapping so that the performance of the magnetic head is improved.
One or more sliders that include a protective overcoat that extends across the entire air bearing surface
A slider comprises an air bearing surface having a leading edge at a first end of the air bearing surface; a trailing edge at a second end of the air bearing surface, wherein the first end is opposite to the second end; a first region adjacent to the trailing edge, wherein the first region comprises one or more transducer elements; and a second region adjacent to the first region and the leading edge. The air bearing surface has a protective overcoat layer as an outermost layer, wherein the protective overcoat layer extends across the entire air bearing surface. The air bearing surface comprises a lapped surface and a plurality of milled surfaces, wherein a surface potential difference between the lapped surface and a milled surface is 0+/−50 milliVolts or less as measured according to Kelvin Probe Force Microscopy (KPFM).
ONE OR MORE SLIDERS THAT INCLUDE A PROTECTIVE OVERCOAT THAT EXTENDS ACROSS THE ENTIRE AIR BEARING SURFACE
The present disclosure relates to kiss lapping sliders after patterning an air bearing surface pattern, followed by applying a protective overcoat to the air bearing surface. The present disclosure also involves related sliders.
DUAL PURPOSE BOND PADS FOR HEAD SLIDERS AND METHODS OF PROCESSING A SLIDER
The present invention is directed to the fabrication of head sliders for use in hard disk drives, and in particular the provision and usage of electrical bond pads on the slider surface structure to accommodate needs of the fabrication process as well as slider operation within a disk drive.
Methods of manufacturing one or more sliders that includes a second lapping process after patterning, and related sliders
The present disclosure relates to kiss lapping sliders after patterning an air bearing surface pattern, followed by applying a protective overcoat to the air bearing surface. The present disclosure also involves related sliders.
Method of processing a slider
The present invention is directed to the fabrication of head sliders for use in hard disk drives, and in particular the provision and usage of electrical bond pads on the slider surface structure to accommodate needs of the fabrication process as well as slider operation within a disk drive.
Tapered junction shield for self-compensation of asymmetry with increasing aspect ratio for tunneling magneto-resistance (TMR) type read head
A junction shield (JS) structure is disclosed for providing longitudinal bias to a free layer (FL) having a width (FLW) and magnetization in a cross-track direction between sidewalls in a sensor. The sensor is formed between bottom and top shields and has sidewalls extending from a front side at an air bearing surface (ABS) to a backside that is a stripe height (SH) from the ABS. The JS structure has a single layer (JS1) adjacent to each sensor sidewall and with a magnetization parallel to that of the FL, and a tapered top surface such that JS1 has decreasing thickness with increasing height from the ABS. As aspect ratio or AR (SH/FLW) increases above 1, longitudinal bias increases proportionally to slow an increase in asymmetry as AR increases, and without introducing a loss in amplitude for a reader with low AR.
Method of forming tapered junction shield for self-compensation of asymmetry with increasing aspect ratio for tunneling magneto-resistance (TMR) type read head
A junction shield (JS) structure and method of forming the same are disclosed for providing longitudinal bias to a free layer (FL) having a width (FLW) and magnetization in a cross-track direction between sidewalls in a sensor. The sensor is formed between bottom and top shields and has sidewalls extending from a front side at an air bearing surface (ABS) to a backside at a stripe height (SH) from the ABS. The JS structure has a lower layer (JS1) with magnetization parallel to that of the FL, and a tapered top surface such that JS1 has decreasing thickness with increasing height from the ABS. As aspect ratio or AR (SH/FLW) increases above 1, longitudinal bias increases proportionally to slow an increase in asymmetry as AR increases, and without decreasing amplitude for a reader with low AR. The JS1 layer may be antiferromagnetically coupled to an upper JS layer for stabilization.