Methods of assembling motor windings comprising wrapping windings around a central longitudinal axis in a cylindrical shape having a plurality of annularly spaced positions such that the windings form n and/or u shapes around the positions. As the windings encircle the longitudinal axis, they are wrapped in an outward spiral or inward spiral such that each pass of the windings is stacked on a previous pass.

Fabrication methods for a 3D multipath inductor, including forming a metal layer to form spiral turns about a center region, the spiral turns including segments that extend length-wise along the turns and having positions that vary from an innermost position and an outermost position relative to the center region; forming a lateral cross-over configured to couple portions of lateral segments in different relative positions from the center region to form lateral segment paths that have a substantially same length for all lateral segment paths in a grouping thereof; forming an additional metal layer to form spiral turns about the center region including corresponding geometry to the first metal layer; and forming a vertical cross-over configured to couple portions of segments on different metal layers to form vertical segment paths that have a substantially same length for all vertical segment paths in a grouping thereof.

Provided is a method of manufacturing a voice coil, and more particularly, a method of manufacturing a voice coil in which a coil pattern is formed on a wafer level package. The method includes (a) forming a first coil pattern including a first area in which a first seed metal layer is exposed upward, a second area in which a first passivation layer for forming a via hole in the first area is formed, and a third area in which a first photoresist layer is formed in a portion of the first area and the second area on an upper surface of a wafer, (b) filling an inside of the via hole formed in the first coil pattern with a conductive material and forming first coil windings, and (c) removing the first photoresist layer formed in the third area.

Methods of assembling motor windings comprising wrapping windings around a central longitudinal axis in a cylindrical shape having a plurality of annularly spaced positions such that the windings form n and/or u shapes around the positions. As the windings encircle the longitudinal axis, they are wrapped in an outward spiral or inward spiral such that each pass of the windings is stacked on a previous pass.

Various embodiments includes a stacked open pattern inductor fabricated above a semiconductor substrate. The stacked open pattern inductor includes a plurality of parallel open conducting patterns embedded in a magnetic oxide or in an insulator and a magnetic material. A layer of magnetic material may be located above the inductor and below the inductor to confine electronic noise generated in the stacked open pattern inductor to the area occupied by the inductor. The stacked open pattern inductor may include a magnetic material directly contacts one of the conducting patterns and the substrate. The stacked open pattern inductor may be fabricated using conventional integrated circuit manufacturing processes, and the inductor may be used in connection with computer systems.

A three-dimensional multipath inductor includes turns disposed about a center region on two layers, the turns on the two layers having corresponding geometry therebetween. Each of the turns is comprised of two or more segments that extend length-wise along the turns, and the segments have positions that vary from an innermost position relative to the center region and an outermost position relative to the center region. A lateral cross-over is configured to couple the segments of at least one turn on one layer with the segments on a turn on a same layer to form segment paths that have a substantially same length for all segment paths in a grouping of segment paths on that same layer. A vertical cross-over is configured to couple the segments on different vertically stacked metal layers to have the segment groups with a substantially same length for all segment paths based on vertical lengths.

Provided is a method of manufacturing a voice coil, and more particularly, a method of manufacturing a voice coil in which a coil pattern is formed on a wafer level package. The method includes (a) forming a first coil pattern including a first area in which a first seed metal layer is exposed upward, a second area in which a first passivation layer for forming a via hole in the first area is formed, and a third area in which a first photoresist layer is formed in a portion of the first area and the second area on an upper surface of a wafer, (b) filling an inside of the via hole formed in the first coil pattern with a conductive material and forming first coil windings, and (c) removing the first photoresist layer formed in the third area.

A three-dimensional multipath inductor includes turns disposed about a center region on two layers, the turns on the two layers having corresponding geometry therebetween. Each of the turns is comprised of two or more segments that extend length-wise along the turns, and the segments have positions that vary from an innermost position relative to the center region and an outermost position relative to the center region. A lateral cross-over is configured to couple the segments of at least one turn on one layer with the segments on a turn on a same layer to form segment paths that have a substantially same length for all segment paths in a grouping of segment paths on that same layer. A vertical cross-over is configured to couple the segments on different vertically stacked metal layers to have the segment groups with a substantially same length for all segment paths based on vertical lengths.