Methods of creating a hook for a bike rack. The methods include the steps of providing a planar metal material, cutting a two-dimensional shape from the planar metal material where the two-dimensional shape defines a hook precursor, forming the hook precursor into a three-dimensional hook where the three-dimensional hook includes a hook face, and adding a protective layer to the hook face. In some examples, the methods include processing the three dimensional hook to remove sharp edges, cutting a mounting point into the hook precursor, cutting a bevel on an edge of the hook precursor to define a beveled edge, and/or cutting a curve on an edge of the hook precursor to define a rounded edge.

An assembled blank may include a blank tip attached to a blank base, e.g., the blank tip may be welded to the blank base. The blank tip may be manufactured by modifying flat stock, e.g., tiers of blank tips may be manufactured by modifying tiers of flat stock. The blank tip may comprise a first forceps jaw, a second forceps jaw, and a blank tip aperture. The assembled blank may be disposed within a hypodermic tube and an actuation structure of a microsurgical instrument.

An encapsulated semiconductor package. As non-limiting examples, various aspects of the present disclosure provide an integrated circuit package comprising a laminate, an integrated circuit die coupled to the laminate, an encapsulant surrounding at least top and side surface of the integrated circuit die, a conductive column extending from the top side of the integrated circuit die to a top side of the encapsulant, and a signal distribution structure on a top side of the encapsulant.

A package of laminations includes a plurality of lamella segments, which are arranged in layers and embodied to be connected together as ring segments. Each of the lamella segments has a plurality of cutouts and at least one of the lamella segments has at least three cutouts. The lamella segments are interconnected via sleeves. A method for manufacturing a package of laminations, a multi-plate coupling employing the package of laminations and an industrial application using the package of laminations are also described.

Methods of creating a hook for a bike rack. The methods include the steps of providing a planar metal material, cutting a two-dimensional shape from the planar metal material where the two-dimensional shape defines a hook precursor, forming the hook precursor into a three-dimensional hook where the three-dimensional hook includes a hook face, and adding a protective layer to the hook face. In some examples, the methods include processing the three dimensional hook to remove sharp edges, cutting a mounting point into the hook precursor, cutting a bevel on an edge of the hook precursor to define a beveled edge, and/or cutting a curve on an edge of the hook precursor to define a rounded edge.

A method of manufacturing a semiconductor package includes mounting and electrically connecting a semiconductor die to a substrate. The semiconductor die and the substrate are encapsulated to form an encapsulation. Via holes are laser-ablated through the encapsulation and conductive material is deposited within the via holes to form vias. A first buildup dielectric layer is formed on the encapsulation. Laser-ablated artifacts are laser-ablated in the first buildup layer. The laser-ablated artifacts in the first buildup layer are filled with a first metal layer to form a first electrically conductive pattern in the first build up layer. The operations of forming a buildup layer, forming laser-ablated artifacts in the buildup layer, and filling the laser-ablated artifacts with an electrically conductive material to form an electrically conductive pattern can be performed any one of a number of times to achieve the desired redistribution.

The present disclosure relates to a shielded double-sided module, which includes a module substrate with a ground plane, at least one top electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a number of first module contacts attached to a bottom surface of the module substrate, a second mold compound, and a shielding structure. The second mold compound resides over the bottom surface of the module substrate, and each first module contact is exposed through the second mold compound. The shielding structure completely covers a top surface and a side surface of the module, and is electrically coupled to the ground plane within the module substrate.

An assembled blank may include a blank tip attached to a blank base, e.g., the blank tip may be welded to the blank base. The blank tip may be manufactured by modifying flat stock, e.g., tiers of blank tips may be manufactured by modifying tiers of flat stock. The blank tip may comprise a first forceps jaw, a second forceps jaw, and a blank tip aperture. The assembled blank may be disposed within a hypodermic tube and an actuation structure of a microsurgical instrument.

A package of laminations includes a plurality of lamella segments, which are arranged in layers and embodied to be connected together as ring segments. Each of the lamella segments has a plurality of cutouts and at least one of the lamella segments has at least three cutouts. The lamella segments are interconnected via sleeves. A method for manufacturing a package of laminations, a multi-plate coupling employing the package of laminations and an industrial application using the disclosed type of coupling are also described.

A method for making a composite substrate circulator comprising disposing a plurality of sleeves about a plurality of rods, disposing the plurality of rods and the plurality of sleeves in a plurality of openings in a block to form an assembly, and dividing the assembly to form a plurality of plates. Each plate includes a portion of the plurality of sleeves and the plurality of rods. The magnetic saturation (4PiMs) values of the rods and sleeves are chosen to decrease radially (rod has the highest 4PiMs).