The present invention discloses a device for assembling products in a die. The device comprises a pushing portion and an assembling portion. The pushing portion comprises a pushing block (11), a pushing spring (10) and a pushing wedge (9) wherein the pushing block (11) is connected with the pushing spring (10), the pushing wedge (9) is arranged above the pushing block (11) and is in wedge-shaped connection with the pushing block (11). The assembling portion comprises an assembling wedge (6), a transmission wedge (4) and an assembling male die (5), wherein the transmission wedge (4) is arranged above the assembling male die (5) in wedge-shaped connection and both of them are arranged in the lower die base (2), the assembling wedge (6) is arranged above the transmission wedge (4) in wedge-shaped connection while in contact.

The invention involves the extraction process of a glow plug pencil (23) or a broken pencil (23) which is stuck in a cylinder head (13) housing (11) of a glow plug engine comprising a lower (19) and upper (17) part, so that the upper part (17) forms a shoulder (21) with the lower part (19), the pencil (23) being stuck in the lower part (19). The process is remarkable in that it includes a step (a) for drilling a bore in the pencil (23) according to the longitudinal direction of the latter which is performed with the use of a drill bit (1) comprising a drilling part (5) with flutes (7) and a shank (3) respectively having a diameter smaller and greater than the lower part diameter (19) of the housing (11) so that the shank (3) forms a shoulder (9) with the drilling part (5), and in that step a) for drilling the bore includes the drilling of the pencil (23) until the said shoulder (9) of the drill bit (1) is positioned to a stop against the shoulder (21) of the housing (11).

A wafer producing apparatus includes: an ingot grinding unit configured to grind and planarize an upper surface of an ingot held by a first holding table; a laser applying unit configured to apply a laser beam of such a wavelength as to be transmitted through the ingot to the ingot, with a focal point of the laser beam positioned at a depth corresponding to the thickness of a wafer to be produced from an upper surface of the ingot held by a second holding table, to form a peel-off layer; a wafer peeling unit configured to hold the upper surface of the ingot held by a third holding table and peel off the wafer from the peel-off layer; and a carrying tray having an ingot support section configured to support the ingot and a wafer support section configured to support the wafer.

A system for generating rules inserted into at least one pattern board including: a controller configured to generate at least one shape diagram, the controller also configured to determine number and measurement of crease rules to be generated based on the at least one shape diagram; a cutting station configured to receive and cut a first crease rule into the number and measurement of the crease rules; and a sorter configured to receive the crease rules from the cutting station and sort the crease rules according to the measurement of the crease rules, wherein the sorted crease rules are inserted into each of the at least one pattern board along with a cutting rule shaped by each of at least one bender.

A wafer producing apparatus includes an ingot grinding unit that grinds the upper surface of an ingot to planarize the upper surface, a laser irradiation unit that positions the focal point of a laser beam with such a wavelength as to be transmitted through the ingot to a depth corresponding to the thickness of a wafer to be produced from the upper surface of the ingot and irradiates the ingot with the laser beam to form a separation layer, a wafer separating unit that separates the wafer from the ingot, and a tray having a support part that supports the separated wafer.

The present invention relates to an integrated processing machine for positioning, trimming and punching of the ceiling splicing structure, comprising a rack and a mounting base for processing at the lower part of the rack, which is provided with a lifting and clamping device passing through the rack cooperating with the splice plate, the upper part of the rack is provided with a processing port, which cooperates with a trimming and positioning device, the trimming and positioning device comprises a lifting cylinder for trimming and positioning disposed on the mounting base for processing, the lifting cylinder for trimming and positioning is connected with a mounting base for trimming and positioning, the mounting base for trimming and positioning is provided with a first trimming knife and a second trimming knife which cooperates with the two splice plates respectively, and the mounting base for processing is provided with a processing mechanism matching with the processing mating port and cooperating with two splice plates; In the present invention, the trimming and positioning device and the processing device are designed to cooperate with each other, the trimming and positioning device is able to complete the trimming of the side slits of the splice plates while positioning the two splice plates without interfering with the operation of the hole and groove processing device, which greatly improves the efficiency of integrated processing.

A wafer producing apparatus includes an ingot grinding unit that grinds the upper surface of an ingot to planarize the upper surface, a laser irradiation unit that positions the focal point of a laser beam with such a wavelength as to be transmitted through the ingot to a depth corresponding to the thickness of a wafer to be produced from the upper surface of the ingot and irradiates the ingot with the laser beam to form a separation layer, a wafer separating unit that separates the wafer from the ingot, and a tray having a support part that supports the separated wafer.

The present invention relates to an integrated processing machine for positioning, trimming and punching of the ceiling splicing structure, comprising a rack and a mounting base for processing at the lower part of the rack, which is provided with a lifting and clamping device passing through the rack cooperating with the splice plate, the upper part of the rack is provided with a processing port, which cooperates with a trimming and positioning device, the trimming and positioning device comprises a lifting cylinder for trimming and positioning disposed on the mounting base for processing, the lifting cylinder for trimming and positioning is connected with a mounting base for trimming and positioning, the mounting base for trimming and positioning is provided with a first trimming knife and a second trimming knife which cooperates with the two splice plates respectively, and the mounting base for processing is provided with a processing mechanism matching with the processing mating port and cooperating with two splice plates; In the present invention, the trimming and positioning device and the processing device are designed to cooperate with each other, the trimming and positioning device is able to complete the trimming of the side slits of the splice plates while positioning the two splice plates without interfering with the operation of the hole and groove processing device, which greatly improves the efficiency of integrated processing.

A wafer producing apparatus includes: an ingot grinding unit configured to grind and planarize an upper surface of an ingot held by a first holding table; a laser applying unit configured to apply a laser beam of such a wavelength as to be transmitted through the ingot to the ingot, with a focal point of the laser beam positioned at a depth corresponding to the thickness of a wafer to be produced from an upper surface of the ingot held by a second holding table, to form a peel-off layer; a wafer peeling unit configured to hold the upper surface of the ingot held by a third holding table and peel off the wafer from the peel-off layer; and a carrying tray having an ingot support section configured to support the ingot and a wafer support section configured to support the wafer.

The invention involves the extraction process of a glow plug pencil (23) or a broken pencil (23) which is stuck in a cylinder head (13) housing (11) of a glow plug engine comprising a lower (19) and upper (17) part, so that the upper part (17) forms a shoulder (21) with the lower part (19), the pencil (23) being stuck in the lower part (19). The process is remarkable in that it includes a step (a) for drilling a bore in the pencil (23) according to the longitudinal direction of the latter which is performed with the use of a drill bit (1) comprising a drilling part (5) with flutes (7) and a shank (3) respectively having a diameter smaller and greater than the lower part diameter (19) of the housing (11) so that the shank (3) forms a shoulder (9) with the drilling part (5), and in that step a) for drilling the bore includes the drilling of the pencil (23) until the said shoulder (9) of the drill bit (1) is positioned to a stop against the shoulder (21) of the housing (11).