A component mounting apparatus including a component supply device which includes a carrier tape that accommodates a component to be mounted on a board in which a plurality of feeders having carrier tapes loaded are respectively mounted at a plurality of mounting positions, which automatically discharges a carrier tape to a tape insertion port of the feeder based on a component discharge instruction, and which automatically conveys an inserted carrier tape to a suction position at which a component is suctioned when the carrier tape is inserted into the tape insertion port; and control device which instructs discharge or supply of a component.

An integrated circuit package comprising one or more electronic component(s); a first substrate including a first surface and a second surface of the first substrate; and a second substrate including a first surface and a second surface of the second substrate. The first substrate including a first first-substrate cavity on the first surface of the first substrate. The second substrate includes a first second-substrate cavity on the first surface of the second substrate. The second surface of the first substrate and the second surface of the second substrate is located between the first surface of the first substrate and the first surface of the second substrate; or the first surface of the first substrate and the first surface of the second substrate is located between the second surface of the first substrate and the second surface of the second substrate.

A component supply device including a main body provided with an introducing region into which a component supply tape holding components is introduced and configured to supply the components by sending the component supply tape introduced into the main body via the introducing region in a longitudinal direction of the component supply tape. The device comprises a tape supporter insertable into the introducing region while supporting the component supply tape, and a clamping mechanism configured to sandwich and hold at least a part of a supported part of the component supply tape supported by the tape supporter with respect to the tape supporter. The component supply tape is introduced into the main body by inserting the tape supporter into the introducing region with the component supply tape held by the clamping mechanism.

In an exemplary embodiment, a multilayer coil component includes: a substrate body; and a coil embedded in the substrate body and containing a wound conductor; wherein the substrate body has: magnetic layers containing multiple metal magnetic grains, provided around conductor layers that constitute parts of the wound conductor in a direction roughly orthogonal to the coil axis of the coil; and multiple high-hardness insulating grains harder than the multiple metal magnetic grains and smaller in average grain size than the multiple metal magnetic grains, provided between a pair of the conductor layers adjacent to each other in the direction of the coil axis and also between a pair of the magnetic layers adjacent to each other in the direction of the coil axis. The multilayer coil component can prevent shorting in the wound conductor while increasing the inductance.

A wire wound-type coil component with an integrated structure does not have a bonding portion where there is concern about reliability with respect to a spiral conductive wire, a terminal electrode, and an annular core. A coil component includes a core with an integrated structure, at least part of which is a winding core portion, which has an annular shape having a through-hole, and which is made of a non-conductive material; and a coil conductor with an integrated structure, which has a spiral conductive wire arranged to spirally extend around the winding core portion and first and second terminal electrodes formed at both end portions of the spiral conductive wire, respectively. The coil component is manufactured through three-dimensionally shaping the core, the coil conductor, and a shape holding member for holding a shape of a wall surface of the core defining the through-hole, by using a 3D printer.

An electronic circuit component mounting head which mounts electronic circuit components to a circuit substrate is provided. The mounting head includes a rotating/raising/lowering axis held on a head main body as to be capable of rotation and of being raised/lowered, a suction nozzle held on the rotating/raising/lowering axis as to be capable of being raised/lowered and not capable of being rotated relatively, and the rotating/raising/lowering axis and suction nozzle can be rotated as necessary by an electric motor. A raising/lowering driving member is held on head main body as to be capable of being raised/lowered, and is raised/lowered by a first linear motor. A first engaging section of the raising/lowering driving member is engaged with the rotating/raising/lowering axis, and a second engaging section of a second linear motor is held on the raising/lowering driving member engaged with suction nozzle.

A component mounting machine includes a tool station and a determination section. The tool station detachably accommodates a holding member including a main body section which can hold a component to be mounted on a board and multiple identification sections which can identify multiple accommodation angles. The determination section determines an angle difference in which the accommodation angle of the holding member differs from a predetermined accommodation angle. At least one identification section of the multiple identification sections is defined as a first identification section, the at least one identification section being exposed when the accommodation angle of the holding member is the predetermined accommodation angle in a close state in which the multiple identification sections are partially covered by a shielding member. When the determination section cannot recognize the first identification section in the close state, the determination section attempts to recognize a second identification section.

Methods and apparatus for joining a chip with a substrate. The chip is moved by with a pick-and-place machine from a first location to a second location proximate to the substrate over a first time. In response to moving the chip in a motion path from the first location to the second location, a plurality of solder bumps carried on the chip are liquefied over a second time that is less than the first time. While the solder bumps are liquefied, the chip is placed by the pick-and-place machine onto the substrate.

A reel for a component mounting apparatus that pulls a carrier tape out of the reel and pitch-feeds and supplies the carrier tape by a tape feeder in a component supply part and picks up a supplied component and mounts the component in a substrate by a mounting head. The reel includes: a reel core part; and the carrier tape being wound and stored around the reel core part, wherein the carrier tape includes a distal end fixed to the reel core part, and a brittle part that is positioned in the vicinity of the distal end and is broken by action of longitudinal tension in excess of a prescribed strength on the carrier tape, and the pitch-feed separates the carrier tape from the reel core part at the brittle part.

A system including multiple inspection machines and an NG board discharge machine which moves an NG board to a checking position visible to a worker. The system acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position.