A holding frame is provided, into which plug connector modules can be inserted, wherein the holder frame comprises or consists of two halves which can be connected to each other, a first half and a second half, wherein the halves each have a lateral surface and a cover surface, wherein the holding frame has at least one first blocking element, via which the halves can be fixed in a closed position, and wherein the at least one blocking element is movably held on the first half or on the second half. The blocking element is held on the first half or on the second half in a displaceable or rotatable or pivotable manner.

A module installation assembly for installing a module into a socket of a land grid array includes a tool having a mounting bracket for connecting the tool to an adjacent fixture, an alignment member connected to the mounting bracket, and cavity defined at least partially by the alignment member. The cavity is substantially aligned with a socket of the land grid array such that the module is configured to pass through the cavity when being connected to the socket.

Methods and systems for manufacturing a swallowable sensor device are disclosed. Such a method includes mechanically coupling a plurality of internal components, wherein the plurality of internal components includes a printed circuit board having a plurality of projections extending radially outward. A cavity is filled with a potting material, and the mechanically coupled components are inserted into the cavity. The cavity may be pre-filled with the potting material, or may be filled after the mechanically coupled components have been inserted therein. A distal end of each projection abuts against a wall of the cavity thereby preventing the potting material from covering each distal end. The cavity is sealed with a cap causing the potting material to harden within the sealed cavity to form a housing of the swallowable sensor device, wherein the distal end of each projection is exposed to an external environment of the swallowable sensor device.

A method for assembling and installing a wire bundle assembly group (WBAG) is disclosed. The method includes placing a first grouping of components of a first WBAG on a first assembly panel of a fabrication table. The method also includes assembling the first WBAG from the first grouping of components and attaching the first WBAG to the first assembly panel. The method also includes actuating a pivot of an assembly frame supporting the first assembly panel to rotate the first assembly panel about a longitudinal axis. The method further includes placing a WBAG receiving panel of a transport tool adjacent the first WBAG and the first assembly panel. The method also includes releasing the first WBAG from the first assembly panel and dropping the WBAG onto the WBAG receiving panel. Finally, the method includes attaching the first WBAG to the WBAG receiving panel.

A substrate support for control of a temperature of a semiconductor substrate supported thereon during plasma processing of the semiconductor substrate includes a temperature-controlled base having a top surface, a metal plate, and a film heater. The film heater is a thin and flexible polyimide heater film with a plurality of independently controlled resistive heating elements thermally coupled to an underside of the metal plate. The film heater is electrically insulated from the metal plate. A first layer of adhesive bonds the metal plate and the film heater to the top surface of the temperature-controlled base. A layer of dielectric material is bonded to a top surface of the metal plate with a second layer of adhesive. The layer of dielectric material forms an electrostatic clamping mechanism for supporting the semiconductor substrate.

A flip-chip bonding device and method are disclosed. The bonding device includes: a supply unit (10) for separating a flip-chip (200) from a carrier (100) and providing the flip-chip (200), the supply unit (10) including flipping device (11); a transfer unit (20) for receiving the flip-chip (200) from the flipping device (11); a position adjustment unit (30) for adjusting the positions of flip-chips (200) on the transfer unit (20); a bonding unit (40) for bonding the flip-chips (200) on the transfer unit (20) onto a substrate (400); a transportation unit (50) for transporting the transfer unit (20); and a control unit (60) for controlling the movement of the preceding units. The transfer unit (20) is capable of receiving multiple flip-chips (200) and allows the flip-chips (200) to be bonded simultaneously. This can result in savings in bonding time and an improvement in throughput. Moreover, during the transportation of the transfer unit (20), the positions of the flip-chips (200) thereon can be adjusted by the position adjustment unit (30), thereby ensuring high positional accuracy of the flip-chips (200) in the subsequent bonding step. As a result, a high-accuracy bonding can be achieved.

A method of mounting a module to a land grid array is provided. The method includes installing a tool to a fixture. The tool includes at least one alignment member and at least one cavity partially defined by the at least one alignment member. The at least one cavity of the tool is aligned with one or more corresponding sockets of the land grid array. The method further includes installing a module through the cavity such that the module is substantially aligned with the socket as it is connected to the land grid array.

A substrate support for control of a temperature of a semiconductor substrate supported thereon during plasma processing of the semiconductor substrate includes a temperature-controlled base having a top surface, a metal plate, and a film heater. The film heater is a thin and flexible polyimide heater film with a plurality of independently controlled resistive heating elements thermally coupled to an underside of the metal plate. The film heater is electrically insulated from the metal plate. A first layer of adhesive bonds the metal plate and the film heater to the top surface of the temperature-controlled base. A layer of dielectric material is bonded to a top surface of the metal plate with a second layer of adhesive. The layer of dielectric material forms an electrostatic clamping mechanism for supporting the semiconductor substrate.

An apparatus for control of a temperature of a substrate has a temperature-controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus.

A holding frame for a plug-type connector is intended to have good heat resistance and a high level of mechanical robustness and, when installed in a metallic plug-type connector housing, enable protective grounding while at the same time being convenient to use, in particular during the replacement of individual modules. To this end, it is proposed to manufacture the holding frame at least partially from spring-elastic sheet metal. For this purpose, the holding frame can have a basic portion and a deformation portion, which are formed from different materials. The basic portion is used for fixing an accommodated module in a plane. The deformation portion can assume an insertion state and a holding state, wherein the insertion state permits insertion of at least one module into the holding frame in a direction transverse to the plane and an accommodated module is fixed in the holding state.