An object of the invention is to provide a coating laminated body in which coatings not containing hexavalent chromium which is an environmental concern material, and excellent in corrosion resistance and wear resistance are laminated on a base material, and to provide a method for producing the same. The coating laminated body according to the invention is a laminated body in which a multiple-layer coating is laminated on a base material. The multiple-layer coating includes: a plurality of layers of S-containing Ni alloy coatings; and a sulfur concentrated layer that is formed between the plurality of layers of S-containing Ni alloy coatings and has an S concentration higher than an S concentration of the S-containing Ni alloy coatings. Each of the plurality of layers of S-containing Ni alloy coatings has a Ni concentration of 90% or more by mass, and a difference in Ni concentration between the coatings is within 1% by mass.

An object of the invention is to provide a coating laminated body in which coatings not containing hexavalent chromium which is an environmental concern material, and excellent in corrosion resistance and wear resistance are laminated on a base material, and to provide a method for producing the same. The coating laminated body according to the invention is a laminated body in which a multiple-layer coating is laminated on a base material. The multiple-layer coating includes: a plurality of layers of S-containing Ni alloy coatings; and a sulfur concentrated layer that is formed between the plurality of layers of S-containing Ni alloy coatings and has an S concentration higher than an S concentration of the S-containing Ni alloy coatings. Each of the plurality of layers of S-containing Ni alloy coatings has a Ni concentration of 90% or more by mass, and a difference in Ni concentration between the coatings is within 1% by mass.

A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 m, and a second peak lies at 55-195 m, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 m and the area of a volumetric distribution of particle sizes of 45-205 m is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.

An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 m, and a second peak lies at 55-195 m, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 m and the area of the volumetric distribution of grain sizes of 45-205 m is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.

A chromate-free coated metal sheet according to the present invention includes: a metal sheet; and a coating film which contains an organic resin A as a film formation component and a flaky aluminum pigment C having a deactivation-treated surface on at least one surface of the metal sheet; wherein the thickness of the coating film is in a range of 1.5 to 10 m.

A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 m, and a second peak lies at 55-195 m, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 m and the area of a volumetric distribution of particle sizes of 45-205 m is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.

An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 m, and a second peak lies at 55-195 m, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 m and the area of the volumetric distribution of grain sizes of 45-205 m is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.