Patent classifications
Y10T428/12174
Sintered metal material having directional porosity and comprising at least one ferromagnetic part, and production method thereof
The invention relates to a sintered metal material comprising at least one magnetic part, characterised by directional through-pores having a size of between 1 and 100 μm, said material having a density varying by less than 20% from one sample of 1 cm3 to another taken from a one-piece part made from the material.
SINTERED METAL MATERIAL HAVING DIRECTIONAL POROSITY AND COMPRISING AT LEAST ONE FERROMAGNETIC PART, AND PRODUCTION METHOD THEREOF
The invention relates to a sintered metal material comprising at least one magnetic part, characterised by directional through-pores having a size of between 1 and 100 μm, said material having a density varying by less than 20% from one sample of 1 cm3 to another taken from a one-piece part made from the material.
Polycrystalline Diamond Cutting Element
A polycrystalline-diamond cutting element for a drill bit of a downhole tool. The cutting element includes a substrate and a diamond table bonded to the substrate. The diamond table includes a diamond filler with at least one leached polycrystalline diamond segment packed therein along at least one working surface thereof. The cutting element may be formed by positioning the diamond table on the substrate and bonding the diamond table onto the substrate such that the polycrystalline diamond segment is positioned along at least one working surface of the diamond table. A spark plasma sintering or double press operation may be used to bond the diamond table onto the substrate.
Polycrystalline diamond cutting element
A polycrystalline-diamond cutting element for a drill bit of a downhole tool. The cutting element includes a substrate and a diamond table bonded to the substrate. The diamond table includes a diamond filler with at least one leached polycrystalline diamond segment packed therein along at least one working surface thereof. The cutting element may be formed by positioning the diamond table on the substrate and bonding the diamond table onto the substrate such that the polycrystalline diamond segment is positioned along at least one working surface of the diamond table. A spark plasma sintering or double press operation may be used to bond the diamond table onto the substrate.