A peening method which can sufficiently improve fatigue properties of a lap fillet welded joint having a thin steel sheet as a base sheet, in which a knocking pin having a predetermined shape is continuously knocked as a series of knocking toward a direction inclined relative to the welding direction, the series of knocking is repeatedly performed in the welding direction, at that time, a knocking mark group made of a plurality of knocking marks formed by the series of knocking is superimposed on at least a part of an adjacent knocking mark group while an end part in the direction orthogonal to the welding direction of the knocking mark group is separated from an end part in the direction orthogonal to the welding direction of the adjacent knocking mark group.

A coated substrate has a substrate and a coating system having one or more ceramic layers. At least a first layer of one of the one or more ceramic layers is a columnar layer having as-deposited columns and intercolumn gaps. The intercolumn gaps have a mean width at least one of: at least 4.0 micrometers; and at least 1.5% of a thickness of said first layer.

Provided is a method for producing a sliding member formed by impregnating a porous base member made of a bronze-based alloy with a resin material, the sliding member including a sliding surface where both the porous base member and the resin material are exposed, the method including: a step of preparing a back metal layer; a porous base member formation step of forming the porous base member by depositing particles of the bronze-based alloy on a surface of the back metal layer and sintering the particles; an impregnation step of impregnating the porous base member with the resin material; a deformation step of deforming an end edge of the back metal layer in a direction away from the sliding surface; and a cutting step of cutting the porous base member impregnated with the resin material to form the sliding surface.

The present invention relates to a door skin comprising an exterior surface having outer portions lying on a first plane, spaced grooves recessed from the plane of the outer portions, and tonal portions having a planar area and a plurality of spaced depressions recessed from the plane of said planar area. The present invention is also directed to a method of etching a plate, for use with a molded die set, for embossing a wood grain pattern in the door skin, and the etched plate formed therefrom.

A method is described that can be used in electrodes for electrochemical devices and includes disposing a precious metal on a top surface of a corrosion-resistant metal substrate. The precious metal can be thermally sprayed onto the surface of the corrosion-resistant metal substrate to produce multiple metal splats. The thermal spraying can be based on a salt solution or on a metal particle suspension. A separate bonding process can be used after the metal splats are deposited to enhance the adhesion of the metal splats to the corrosion-resistant metal substrate. The surface area associated with the splats of the precious metal is less than the surface area associated with the top surface of the corrosion-resistant metal substrate. The thermal spraying rate can be controlled to achieve a desired ratio of the surface area of the metal splats to the surface area of the corrosion-resistant metal substrate.

A device includes a work piece including a metal bump; and a dielectric layer having a portion directly over the metal bump. The metal bump and a surface of the portion of the dielectric layer form an interface. A metal finish is formed over and contacting the metal bump. The metal finish extends from over the dielectric layer to below the interface.

A wiring board and a method for manufacturing the wiring board in which an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted. Copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect.

A highly-ordered nano-structure array, formed on a substrate, mainly comprises a plurality of highly-ordered nano-structure units. Each of the highly-ordered nano-structure units forms a receiving compartment. One end of the receiving compartment opposite to the substrate has an opening. Each of the highly-ordered nano-structure units comprises at least one thin film layer. A periphery and a bottom of the receiving compartment are defined by an inner surface of a surrounding portion of the at least one thin film layer and a top surface of a bottom portion of the at least one thin film layer, respectively. The at least one thin film layer is made of at least one material selected from the group consisting of: metal, alloy, oxide, nitride, and sulfide.

A method is described that can be used in electrodes for electrochemical devices and includes disposing a precious metal on a top surface of a corrosion-resistant metal substrate. The precious metal can be thermally sprayed onto the surface of the corrosion-resistant metal substrate to produce multiple metal splats. The thermal spraying can be based on a salt solution or on a metal particle suspension. A separate bonding process can be used after the metal splats are deposited to enhance the adhesion of the metal splats to the corrosion-resistant metal substrate. The surface area associated with the splats of the precious metal is less than the surface area associated with the top surface of the corrosion-resistant metal substrate. The thermal spraying rate can be controlled to achieve a desired ratio of the surface area of the metal splats to the surface area of the corrosion-resistant metal substrate.

A solder preform is provided, at least one surface of the solder preform (C) is provided with a plurality of protruding portions and/or recessing portions provided at a certain interval.