A 3D printed fiber reinforced polymer composite having a nonlinear stress-strain profile created by a central layer and a plurality of recruited successive layers.

A 3D printed fiber reinforced polymer composite having a nonlinear stress-strain profile created by a central layer and a plurality of recruited successive layers.

A method of manufacturing a circuit board is described herein. The method may include adding a resin, forming first and second fiberglass fibers, and forming first and second signal line traces capable of transmitting electrical signals. In some examples, a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace. In some examples, the first and second fiberglass fibers diagonally cross near the first and second signal line traces. In some examples, the first and second fiberglass fibers cross near the first and second signal line traces in a zig-zag pattern.