Provided is a composition for forming a hard coating layer, which includes an epoxy siloxane resin, a crosslinking agent including a compound having an alicyclic epoxy group, a thermal initiator including a compound represented by a specific chemical formula, a photoinitiator, a fluorine-substituted (meth)acrylate compound, and silica nanoparticles surface-modified with a fluorine compound, and forms a hard coating layer having excellent hardness and antifouling property and suppressing curling.

A gas turbine engine article includes a substrate and an environmental barrier coating disposed on the substrate. The environmental barrier coating includes oxygen-scavenging particles. Each oxygen-scavenging particle includes a silicon-containing core particle encased in an oxygen barrier shell.

A multilayered polyimide film includes a first polyimide layer containing fluorine-containing polymer particles and having a first surface and a second surface, and a second polyimide layer and a third polyimide layer respectively disposed on the first surface and the second surface. The second and the third polyimide layers contain organic silicon oxygen compound particles. The multilayered polyimide film has a coefficient of thermal expansion (CTE) between about 13 and about 30 ppm/° C.

A photo-curable coating composition comprising (1) a polyfunctional (meth)acrylic monomer, (2) a photopolymerization initiator, and (3) a specific hydroxyphenyltriazine base UV absorber has high mar resistance and long-term weather resistance.

A coated substrate including a substrate including a treated layer, a photocatalytic layer, and a protective layer for impeding photocatalyst derived degradation of the treated layer, the protective layer being provided between the photocatalytic layer and the treated layer, the protective layer comprising colloidal particles distributed in a matrix comprised at least partly of an organosilicon phase which is oxidizable by the reactive oxygen species to form a non-volatile inorganic phase, wherein the organosilicon phase includes a surfactant incorporating an organosilicon component.

An article comprises a substrate, a first functional polymeric phase change material, and a plurality of containment structures that contain the first functional polymeric phase change material. The article may further comprise a second phase change material chemically bound to at least one of the plurality of containment structures or the substrate. In certain embodiments, the article further comprises a second phase change material and a binder that contains at least one of the first polymeric phase change material and the second phase change material. The containment structure may be a microcapsule or a particulate confinement material

Provided is a circuit substrate, including a glass film (10) forming a rough layer (11) after surface roughness processing, a resin adhesion (20) located the rough layer (11) on either side of the glass film (10), and a metal foil (30) located on the outside of resin adhesion layer (20). The glass film (10), the resin adhesion layer (20) and the metal foil (30) are joined together through suppressing. The circuit substrate employs the glass film (10) which forms a rough layer (11) after surface roughness processing as a carrier material, so that the resin adhesion layer (20) and the surface of the glass film (10) have a good binding force, and the dielectric constant of the circuit substrate has slight difference in the directions of X, Y and Z. Also provided is manufacturing method for a circuit substrate.

A poly-crystalline silicon ingot having a bottom and defining a vertical direction includes a plurality of silicon grains grown in the vertical direction, in which the plurality of the silicon grains have at least three crystal orientations; and a nucleation promotion layer comprising a plurality of chips and chunks of poly-crystalline silicon on the bottom, wherein the poly-crystalline silicon ingot has a defect density at a height ranging from about 150 mm to about 250 mm of the poly-crystalline silicon ingot that is less than 15%.

A sandwich structure for enhancement of photoluminescence (PL) from luminescent films and the corresponding preparation method are disclosed. The sandwich structure comprises a support, a luminescent film grown on the support, and a single-layer close-packed microsphere array deposited onto the luminescent film. The microspheres have high transmittance excitation light and emitted light, respectively. The low price of dielectric microspheres is beneficial to industrial applications. The stable chemical properties of dielectric microspheres make PL enhanced in a long term. Both metal and non-metal materials can be used as the support in the sandwich structure. These features significantly improve the technique of PL enhancement for luminescent films.

The present invention relates to the use of an abrasion-resistant surface material for the coating of melamine resin laminates and to a laminate comprising the surface material used in accordance with the invention, and to a method for producing the laminate.