A nail sticker, a composition for the nail sticker and a method for preparing the composition are disclosed. Raw materials of the composition include a sizing material, which is made of the following raw materials in parts by weight: 45-85 parts of a UV thermosetting resin, 2-9 parts of a photoinitiator, 1.5-2 parts of a curing agent, 0.1-1 part of a thermal promoter, and 0.1-1 part of a leveling agent. The synchronization of the release of essential oil molecules with light/thermal curing promotes the essential oil molecules to be diffused to the interior of the sizing material more uniformly in a wider range, and during the curing and film forming of the nail sticker, an aroma spreads as tantalizing as that of baked food.

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

A nail sticker, a composition for the nail sticker and a method for preparing the composition are disclosed. Raw materials of the composition include a sizing material, which is made of the following raw materials in parts by weight: 45-85 parts of a UV thermosetting resin, 2-9 parts of a photoinitiator, 1.5-2 parts of a curing agent, 0.1-1 part of a thermal promoter, and 0.1-1 part of a leveling agent. The synchronization of the release of essential oil molecules with light/thermal curing promotes the essential oil molecules to be diffused to the interior of the sizing material more uniformly in a wider range, and during the curing and film forming of the nail sticker, an aroma spreads as tantalizing as that of baked food.

Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and when an adhesion initiation temperature of the first adhesive layer is set to T1, and an adhesion initiation temperature of the second adhesive layer is set to T2, T2 is higher than T1 by 30° C. or more.

Provided are an adhesive resin composition having high adhesiveness and high strength in acid resistance, and a laminate including the same. Provided is an adhesive resin composition including an acid-modified polyolefin resin component (A) having a weight average molecular weight of 30,000 or more and 150,000 or less, a resin component (B) having an epoxy group in a molecule, a resin component (C) having an amino group at a molecular end, and a solvent (S), in which a content of the resin component (B) is 1 part by mass or more and 30 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A), and a content of the resin component (C) is 0.5 parts by mass or more and 15 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A).

A reactive pressure sensitive adhesive composition is disclosed. A tape formed using the reactive pressure sensitive adhesive is also disclosed. In its cured state, the pressure sensitive adhesive shows superior mechanical and electrical properties compared to conventional, non-curable charge collection tapes. The tape has a cure profile pre-selected to correspond to that of a photovoltaic cell fabrication process, such that curing can take place during cell fabrication and may occur simultaneously with one or more other curing steps employed in cell fabrication.

An apparatus comprising a frame and a pressure sensitive adhesive applied to at least a portion of the frame, where the pressure sensitive adhesive is arranged to bond a pre-strained film to the frame is disclosed. A method of making the apparatus also is disclosed. Also disclosed is a method of preparing a stretch frame for manufacturing electroactive polymer devices thereon.

The present invention provides a photocurable adhesive composition. The photocurable adhesive composition comprises, based on the total solid content thereof, 10 to 40 wt % of a thermoplastic polymer containing carboxylic groups and epoxy groups, 20 to 50 wt % of an epoxy component, 1 to 10 wt % of a hydroxy-containing compound, and 0.1 to 5 wt % of a photoinitiator. The present invention further provides a photocurable adhesive tape comprising the photocurable adhesive composition. The photocurable adhesive composition and the photocurable adhesive tape prepared according to technical solutions of the present invention have excellent adhesiveness to phosphorus-containing nickel-plated substrates.

A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23° C. and greater than 23° C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.5 parts by mass or more and less than 50 parts by mass in a solid content of an epoxy resin having a novolac structure, and an organic solvent; a method for bonding adherends including forming an adhesive layer on a first adherend by applying the adhesive resin composition and drying, and then bonding a second adherend to the adhesive layer by laminating the second adherend on the adhesive layer; and an adhesive resin film including a first adhesive layer, a substrate layer, and a second adhesive layer in that order, in which any one or both of the first adhesive layer and the second adhesive layer include(s) the adhesive resin composition.