The invention relates to a method for determining material dimensions of a longitudinal profiled section (2) during a sawing process, in which a saw blade (3) is advanced, the longitudinal profiled section (2) being machined by said saw blade (3) along a saw groove during this time; advancement position data of said saw blade (3) along the advancement path (s) being determined and, during this sawing operation, additional measurement data being determined from the group of sawing force (F.sub.s) or another variable which corresponds to the sawing force (F.sub.s). The invention is characterised in that an actual profile is determined from the advancement position data and said additional measurement data.

Embodiments provide a pre-cut infeed system for a machine center, such as an edger. A pre-cut infeed system may include an infeed, one or more saws arranged along the infeed, and a scanner optimizer system. The scanner optimizer system may scan a workpiece and determine whether greater value can be obtained from the workpiece by cutting the workpiece transversely into two or more pieces upstream of the machine center. If so, the workpiece may be cut transversely by the saw(s) positioned along the infeed, and the cut pieces may be fed sequentially into the machine center.

Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

The invention relates to a method for determining material dimensions of a longitudinal profiled section (2) during a sawing process, in which a saw blade (3) is advanced, the longitudinal profiled section (2) being machined by said saw blade (3) along a saw groove during this time; advancement position data of said saw blade (3) along the advancement path (s) being determined and, during this sawing operation, additional measurement data being determined from the group of sawing force (F.sub.s) or another variable which corresponds to the sawing force (F.sub.s). The invention is characterised in that an actual profile is determined from the advancement position data and said additional measurement data.

Embodiments provide a pre-cut infeed system for a machine center, such as an edger. A pre-cut infeed system may include an infeed, one or more saws arranged along the infeed, and a scanner optimizer system. The scanner optimizer system may scan a workpiece and determine whether greater value can be obtained from the workpiece by cutting the workpiece transversely into two or more pieces upstream of the machine center. If so, the workpiece may be cut transversely by the saw(s) positioned along the infeed, and the cut pieces may be fed sequentially into the machine center.

Embodiments provide a pre-cut infeed system for a machine center, such as an edger. A pre-cut infeed system may include an infeed, one or more saws arranged along the infeed, and a scanner optimizer system. The scanner optimizer system may scan a workpiece and determine whether greater value can be obtained from the workpiece by cutting the workpiece transversely into two or more pieces upstream of the machine center. If so, the workpiece may be cut transversely by the saw(s) positioned along the infeed, and the cut pieces may be fed sequentially into the machine center.

A tablet splitting apparatus includes a guide, a catcher, and a splitting mechanism. The splitting mechanism comprises a pair of blades and a pair of blade shifters. The guide, the catcher, and the splitting mechanism are accommodated in a housing. The housing includes an opening and a support. The support and the guide each include a sliding portion. The guide disposed at the supporting position is slid along the sliding portion of the support so as to be detachable from the supporting position through the opening. The blades and the blade shifters each comprise a sliding portion. The blades and the blade shifters are in a slidable contact with each other at the sliding portions. The blades attached to the respective predetermined positions of the blade shifters are slid along the sliding portions of the blade shifters so as to be detachable from the blade shifters through the opening.

Table saws with safety systems are disclosed. The safety systems detect and react to dangerous conditions, such as contact between the blade and a person. The table saws may include a switch, a first light that illuminates to indicate the safety system is operable, and a second light that illuminates to indicate that the safety system is inoperable. The switch may not power the saw when switched on if the second light is illuminated.

An apparatus and a method for trimming a module are disclosed. In and embodiment the method includes fixing a rear transverse side of module, guiding the rear cutting head along the rear transverse side thereby cutting off a rear overlapping portion of the overlapping film and releasing the rear transverse. The method further includes moving the module into a region of two longitudinal cutting devices, fixing the module on both longitudinal sides, guiding longitudinal cutting heads along the longitudinal sides thereby cutting off longitudinally overlapping film portions on both longitudinal sides, and releasing the longitudinal sides of the module. The method furthermore includes moving the module into a region of the front cutting device, fixing a front transverse side of the module, guiding a front cutting head along the front transverse side thereby cutting off a front overlapping portion of the overlapping film.

Table saws with safety systems are disclosed. The safety systems detect and react to dangerous conditions, such as contact between the blade and a person. The table saws may include a switch, a first light that illuminates to indicate the safety system is operable, and a second light that illuminates to indicate that the safety system is inoperable. The switch may not power the saw when switched on if the second light is illuminated.