PROCESS FOR PRODUCING BANDS FOR BIOMEDICAL SENSORS AND BANDS PRODUCED ACCORDING TO THIS PROCESS

Abstract

Process for producing bands for biological measurements on the basis of flexible circuits on a carrier strip, provided with a flexible insulating substrate provided, on at least one of its faces, with conductive tracks, contact pads and electrodes, includes the application, to said face, of masking means leaving the contact pads and/or the electrodes of the band visible and the selective deposition of a layer of noble metal on said contact pads and electrodes through said masking means.

Claims

1. A process for producing bands for biological measurements on the basis of flexible circuits on a carrier strip, provided with a flexible insulating substrate provided, on at least one of its faces, with conductive tracks, contact pads and electrodes, comprising an application, to said face, of masking means leaving the contact pads and/or the electrodes of the band visible and a selective deposition of a layer of noble metal on said contact pads and electrodes through said masking means.

2. The process for producing bands as claimed in claim 1, wherein the production of the carrier strip comprises a succession of steps comprising a deposition or a lamination of a first layer of metal or of a metal alloy on the flexible insulating substrate of said carrier strip and production of the tracks, contact pads and electrodes by means of a photolithography or laser-etching process on said layer.

3. The process as claimed in claim 1, comprising, before said selective deposition, a deposition of a second layer of metal or of a metal alloy on the tracks, contact pads and electrodes.

4. The process as claimed in claim 1, wherein the process is a reel to reel process producing a plurality of bands aligned side by side with one another continuously on the carrier strip which is rolled off a first reel and then rolled back onto a second reel.

5. The process as claimed in claim 4, wherein, the carrier strip being rolled off again, the process comprises a deposition of a bioactive material on the electrodes of the measurement bands, and one or more steps of laminating and then cutting out these measurement bands.

6. The process as claimed in claim 1, wherein the masking means for said selective deposition are chosen from a film, an inlay, a tool such as a plastic tool forming a stencil or a masking strip made of foam and are applied to the carrier strip and provided with cut-outs leaving said contact pads and/or said electrodes exposed for said selective metallization.

7. The process as claimed in claim 2, wherein a thickness of the first layer of metal or of a metal alloy is chosen to be between 10 μm and 20 μm.

8. The process as claimed in claim 3, wherein the deposition (30) of the second layer of metal or of a metal alloy has a thickness from 1 μm to 10 μm and preferably from 2 μm to 5 μm.

9. The process as claimed in claim 1, wherein the selective deposition of the layer of noble metal has a thickness from 10 nm to 100 nm.

10. A band for biological measurements produced according to the process of claim 1, wherein the material of the flexible insulating substrate is chosen from polyetherimide (PEI) polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), a glass-epoxy composite and a suitable paper.0

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Other features, details and advantages will become apparent from reading the detailed description below and from studying the appended drawings, in which:

[0030] FIG. 1 shows an exemplary band applicable to the process of the present application;

[0031] FIG. 2 shows a schematic view of steps in an exemplary process according to the present application;

[0032] FIG. 3 shows a schematic view of additional process steps.

DETAILED DESCRIPTION

[0033] The drawings and description below primarily contain elements of certain character. Therefore, they may not only serve for better understanding of the present disclosure but also contribute to the definition thereof, as the case may be.

[0034] The present disclosure relates to bands for biomedical sensors for taking biological measurements. Such bands, one example of which is schematically shown in FIG. 1 before final cutting-out, comprise a flexible substrate and contact pads 102, here square in shape, which are intended to make an electrical connection with complementary pads of a connection device for the measurement apparatus accommodating the band, and are connected to electrodes 103, 104 by tracks 101. The electrodes accommodate an active product such as an enzyme which, in a reaction with a bodily fluid containing a given marker, for example glucose in the case of a band for monitoring a diabetic person, will modify an electrical characteristic of the band.

[0035] The bands are produced on the basis of a carrier strip provided with lateral sprocket holes 120, which forms the flexible insulating substrate for the bands, on which the tracks, pads and electrodes are arranged by means of an, advantageously, reel-to-reel (or roll-to-roll) process.

[0036] The material of the carrier strip which will form the flexible insulating substrate for the bands may be chosen from a polyetherimide (PEI), a polyethylene terephthalate (PET), a polyethylene naphthalate (PEN), a polyimide (PI), a glass-epoxy composite or a suitable paper. The width of the strip is adjusted according to the length of the bands which will be produced side by side on the strip. According to the conventional dimensions for bands used in the field and the reel-to-reel devices, the width of the strip may be 35 mm, 70 mm or 150 mm.

[0037] The thickness of the carrier strip is in the range from 50 μm to 350 μm.

[0038] The process schematically shown in FIG. 2 comprises a first step of depositing tracks, pads and electrodes made of metal, for example of copper or of copper-based alloy, on the substrate formed by the carrier strip.

[0039] These are, for example, produced by means of photolithography of a copper layer bonded and/or laminated to the substrate or of a layer originating from copper deposition such as electrodeposition. They may also be deposited by lamination.

[0040] In the case of bonding or of lamination, the sheet of copper 2 may itself come from a reel 12 which is rolled off and applied continuously to the carrier strip rolled off the reel 11. Bonding is carried out using conventional techniques for producing flexible electronic circuits and, for example, the adhesive may be of two types:

a.—liquid, the gluing process then taking place via coating using a roller or a slot;
b.—in the form of a film, the bonding process then taking place via lamination.

[0041] After bonding, a curing step may be carried out at a temperature that may range from 20 to 120° C.

[0042] The thickness of the sheet of copper 2 is conventionally chosen to be between 10 μm and 20 μm and more particularly 12 μm or 18 μm.

[0043] Next, the process comprises producing copper tracks from the sheet of copper, using a photolithography process which uses a step 20 of putting a photoresist and a mask in place, a step 21 of exposing the unmasked portions of the photoresist to radiation, dissolving the exposed portions of the photoresist followed by a chemical attack 22 which removes the portions of copper from the regions which are no longer covered by the photoresist.

[0044] Alternatively, the electrical contact lands may also be mechanically cut out to form a conductive grid which is then roll-bonded to the substrate.

[0045] Once the electrical circuit has been made of copper, the process potentially continues with the deposition 30 of a layer of nickel with or without phosphorus on the copper tracks so as to protect them from oxidation.

[0046] This layer may be deposited using electrodeposition or autocatalytic deposition.

[0047] The layer of nickel has a thickness that affords adequate corrosion resistance, preferably between 2 μm and 5 μm.

[0048] Next, the process of the application comprises application 40 of masking means 41 to the track-side of the strip which leave the contact pads and the electrode regions of the band exposed and selective deposition 50 of a layer of noble metal on said contact pads and electrode regions through the masking means 41.

[0049] The selective deposition of gold with a thickness from 1 to 100 nanometers, for example performed using electrodeposition or autocatalytic deposition, makes it possible to obtain connection regions of low electrical resistance and with resistance to oxidation.

[0050] A number of solutions can be used to produce the masking means. In any case, these means 41 will comprise cut-outs 42 which leave the contact pads and/or electrodes exposed to allow selective deposition of the noble metal thereon.

[0051] The masking means may consist of a film provided with openings allowing selective deposition of the noble metal.

[0052] They may also consist of an inlay provided with openings allowing selective deposition and applied to the strip as it moves into an electrolytic bath or onto a deposition liquid applicator.

[0053] They may additionally consist of a tool, for example a plastic tool forming a stencil, provided with cut-outs leaving the contact pads and electrodes exposed, which is placed on the strip and applied to the tracks of the carrier strip at a station for depositing the noble metal.

[0054] They may also consist of a masking strip made of foam applied to the strip and provided with said cut-outs leaving the contact pads and electrodes exposed.

[0055] The masking means are positioned in the manufacturing process so as to perform selective deposition through application to the strip as it moves into an electrolytic bath or onto a deposition liquid applicator, the openings leaving the contact pads and/or electrodes exposed. The steps of the process are carried out continuously in succession on the rolled-off carrier strip. The manufacturer producing the carrier strip forming the flexible circuits to produce the bands may then punch the unneeded segments of the tracks 105 and roll the strip with its flexible circuits back onto a reel 13 for potential storage before delivery to the company which performs the step of depositing the biosensor on the bands or for internal transfer to a production line suitable for handling biological products in order to finish the bands.

[0056] To finish the bands, they have to be provided with their one or more biosensors. To that end, the carrier strip 1 is rolled off the reel 13 again to carry out the deposition 61 of bioactive material on the electrodes using a deposition device 60. The bioactive material may, for example, be an enzyme suitable for measuring glucose in the treatment of diabetes.

[0057] Once this operation has been performed, one or more lamination steps are carried out and the bands 100 are separated in one or more cutting steps 70, 71, for example by means of a first cutter blade which separates the band panels and a punch 71 which trims the bands.

[0058] The present disclosure provides an optimized solution for the mass production of biosensor bands, in particular in the context of a reel-to-reel process, and a decrease in the amount of gold or of noble metal required for this manufacture.