STRUCTURE AND METHOD FOR STABILIZING LEADS IN WIRE-BONDED SEMICONDUCTOR DEVICES

Abstract

A semiconductor device having a leadframe including a pad (101) surrounded by elongated leads (110) spaced from the pad by a gap (113) and extending to a frame, the pad and the leads having a first thickness (115) and a first and an opposite and parallel second surface; the leads having a first portion (112) of first thickness near the gap and a second portion (111) of first thickness near the frame, and a zone (114) of reduced second thickness (116) between the first and second portions; the second surface (112a) of the first lead portions is coplanar with the second surface (111a) of the second portions. A semiconductor chip (220) with a terminal is attached the pad. A metallic wire connection (230) from the terminal to an adjacent lead includes a stitch bond (232) attached to the first surface of the lead.

Claims

1. A leadframe comprising: a metallic pad surrounded by a plurality of leads, each of the plurality of leads including a first surface and an opposite second surface, the first surface being adapted to connect a bond wire: wherein each of the plurality of leads including a first portion, a second portion and a third portion, wherein the first portion includes a first section with a first thickness and a second section with a second thickness, the second portion includes the second thickness, and the third portion includes the first thickness.

2. The leadframe of claim 1, wherein the metallic pad and the plurality of leads include a base metal selected from a group consisting of copper, copper alloys, aluminum, aluminum alloys, iron-nickel alloys, and Kovar.

3. The leadframe of claim 2, wherein the first surface includes a layer of nickel plated on the base metal and a layer of palladium plated on the nickel layer, and a layer of gold plated on the palladium layer.

4. A semiconductor device comprising: a metallic pad; and a semiconductor chip, attached to the metallic pad, and electrically connected to a first surface of each of a plurality of leads, each of the plurality of leads including an opposite second surface; wherein each of the plurality of leads including a first portion, a second portion and a third portion, wherein the first portion includes a first section with a first thickness and a second section with a second thickness, the second portion includes the second thickness and the third portion includes the first thickness, and wherein the second portion is offset from the opposite second surface.

5. The device of claim 4 wherein the semiconductor chip is electrically connected to the first surface of each of the plurality of leads via wire connections, and wherein the wire connection on the first surface includes a stitch bond.

6. The device of claim 5 further including a package of a polymeric compound covering portions of the semiconductor chip, wire connection, and at least a portion of each of the plurality of leads.

7. A method for stitch-bonding onto stabilized leads comprising: providing a leadframe including a pad surrounded by elongated leads arranged in a pattern, each lead having a portion of reduced thickness near the pad; positioning compliant, non-adhesive, and heat-tolerant material on a heater block in a configuration to support the reduced thickness portions of the elongated leads; placing the leadframe on the heater block with the reduced thickness portions of the leads resting on the compliant material; attaching a semiconductor chip to the pad, the chip having terminals; and bonding wires to the terminals, spanning the wires to respective leads, and forming stitch bonds on the reduced thickness portions of the leads.

8. The method of claim 7 wherein the stitch bonds are diffusion bonds based on metal interdiffusions.

9. The method of claim 8 wherein the wires are selected from a group including copper, copper alloys, gold, and aluminum, and alloys thereof.

10. The method of claim 9 wherein the bonds to the terminals are ball bonds, each ball bond including the processes of forming a free air ball, squashing the ball onto the respective chip terminal, and forming a ball bond.

11. The method of claim 10 wherein the ball bond is based on forming intermetallic layers.

12. The leadframe of claim 1, wherein the second portion is offset from the opposite second surface.

13. The leadframe of claim 1, wherein a surface of the first section and a surface of the third portion are coplanar.

14. The leadframe of claim 1, wherein the second thickness is lesser than the first thickness.

15. The leadframe of claim 1, wherein each of the plurality of leads is spaced from the metallic pad by a gap and extending to a frame.

16. The leadframe of claim 1, wherein the first portion is closer to the metallic pad than the second portion and the third portion, and the second portion is in between the first portion and the second portion.

17. The leadframe of claim 1, wherein the first portion is between an end of the lead and a point where the section with the first thickness and the section with the second thickness end, and wherein the third portion is at another end of the lead.

18. The leadframe of claim 4, wherein a surface of the first section and a surface of the third portion are coplanar.

19. The leadframe of claim 4, wherein the second thickness is lesser than the first thickness.

20. The leadframe of claim 5, wherein the wire connection on a surface of the semiconductor chip includes a ball bond.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0010] FIG. 1A shows a perspective bottom view of an exemplary leadframe with structures according to the invention stabilizing elongated leads for the wire bonding process.

[0011] FIG. 1B illustrates a magnified view of a portion of the leadframe of FIG. 1A.

[0012] FIG. 2 depicts a cross section of a wire bonded and packaged semiconductor device with a leadframe having elongated leads with stabilizing structures for the wire bonding process.

[0013] FIG. 3 illustrates the process of wire bonding a semiconductor chip assembled on a leadframe, which is placed on a heater block with features to support elongated leads during the wire bonding process.

[0014] FIG. 4 is a diagram of the process flow for fabricating fail-safe stitch bonds on half-etched leads using a compliant compensator on the heater block.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Embodiments of the invention are found in devices with semiconductor chips assembled on a support such as a metallic leadframe and encapsulated in a package of a polymeric compound. FIG. 1A illustrates an exemplary embodiment comprising a leadframe designated 100 as used for the assembly of semiconductor chips in semiconductor device fabrication. Leadframe 100 is viewed from the bottom perspective.

[0016] Leadframe 100 includes a pad 101 for assembling a semiconductor chip, tie bars or straps 102 connecting pad 101 to the frame 150, and a plurality of elongated leads 110 surrounding pad 101. As FIGS. 1A and 1B show, one end 112 of elongated leads 110 faces pad 101, but is spaced from pad 101 by a gap 113. In the example of FIG. 1A, leads 110 are shaped as elongated flat leads with one flat end 111 remote and facing away from pad 101. End 111 is thickened and has a surface 111a, which will protrude from the encapsulating material of the eventual package; such leads are used in Quad Flat No-Lead (QFN) devices or in Small Outline No-Lead (SON) devices. The protruding surface of the flat end is designated 111a in FIG. 1B. It should be noted that in some device families straps 102 may include bendings and steps, since pad 101 and leads 110 may not be in the same plane.

[0017] Leadframes are preferably made from a flat sheet of a base metal, which is selected from a group including copper, copper alloys, aluminum, aluminum alloys, iron-nickel alloys, and Kovar. For many devices, the parallel surfaces of the leadframe base metal are treated to create strong affinity for adhesion to plastic compound, especially molding compounds. As an example, the surfaces of copper leadframes may be oxidized, since copper oxide surfaces are known to exhibit good adhesion to molding compounds. Other methods include plasma treatment of the surfaces, or deposition of thin layers of other metals on the base metal surface. As an example for copper leadframes, plated layers of tin have been used, or a layer of nickel (about 0.5 to 2.0 μm thick) followed by a layer of palladium (about 0.01 to 0.1 μm thick) optionally followed by an outermost layer of gold (0.003 to 0.009 μm thick).

[0018] The enlargement of a few leads in FIG. 1B illustrates that leads 110 have an end piece 112 facing the gap 113 towards pad 101. The surface 112a of thickened end piece 112 is coplanar with surface 111a of thickened end piece 111 (thickness 115). This is a consequence of the fact that surfaces 111a and 112a originate from the surface of the original metal sheet, which was continuous before creating the downset 114 (by etching, stamping, or coining). Forming the thinned zones 114 (thickness 116) serves the double purpose of generating surface contours, which may be different on one lead surface compared to the opposite surface, and creating more area and mechanical grips for enhancing adhesion between polymeric package compounds and metallic leadframe surfaces.

[0019] As illustrated in FIG. 2, exemplary leadframe 100 is intended for wire bonding, specifically ball bonding, to electrically interconnect the terminals of chip 220 and leads 110. The wires 230 used for bonding are preferably made of copper, gold, aluminum, and alloys thereof, and have diameters of approximately 25 μm. The wires, the chip and portions of the leadframe pad and leads are encapsulated in a package 260 preferably made of a filler-filled polymeric compound.

[0020] As indicated in FIG. 3, a wire bonding process may begin with positioning the semiconductor chip on a heated pedestal 350 to raise the temperature to between 150 and 300° C. For copper and aluminum wires, ball formation and bonding may need to be performed in a reducing atmosphere such as dry nitrogen gas with a few percent hydrogen gas. For the process. The wire is strung through the capillary of an automated bonder. A capillary is an elongated tube of an inert material such as a ceramic with a fine bore (the capillary in the strict sense) suitable for guiding a metal wire in the 15 to 33 μm diameter range. At the wire end extruding from the capillary tip, a free air ball is created by melting the wire end using either a flame or a spark technique. The ball has a typical diameter from about 1.2 to 1.6 wire diameters. The capillary is moved towards a chip terminal 321 as an attachment pad. Terminal 321 may be an alloy of aluminum and copper. The soft ball is pressed against the metallization of pad 321 by a compression force, often combined with ultrasonic movement of the ball relative to the pad, transmitting ultrasonic energy and forming layers of intermetallic compounds thickness between about 50 and 100 nm). The compression (also called Z- or mash) force is typically between about 17 and 75 gram-force/cm.sup.2 (about 1670 to 7355 Pa); the ultrasonic time between about 10 and 30 ms; the ultrasonic power between about 20 and 50 mW. The bonding process results in a metal nail head or squashed ball 231 with intermetallic compounds (“intermetallic bond”).

[0021] In contrast to ball bonds, the stitch bonds 232 (sometimes referred to as wedge bonds) are created by pressing wire 230 against the metal of the lead, preferably copper or plated layers of palladium or gold. For the temperature of the leads somewhat lower than the heated pedestal (i.e., between 150 and 300° C.), only metal interdiffusion is created for the stitch bonds, since ultrasonic agitation is not provided. It should be pointed out that herein this type of bond is referred to as “diffusion bond” in distinction to intermetallic bond. Based on the geometric shape of the capillary tip, the capillary leaves an imprint in the flattened portion of the attached wire. The wire portion with the transition from the round wire to the flattened wire is bent and is called the heel of the stitch bond.

[0022] As stated, the interdiffusion to be achieved for a successful stitch bond requires that pressure to the wire is applied by the capillary, and that lead 310 is able to withstand this pressure. Otherwise for leads 310, which have a portion 311 both elongated and reduced in thickness (by half-etching), the resilient strength of portion 311 may not be sufficient to counterbalance the pressure. If a product development cycle would not allow enough time to redesign the leads for including thickened end 112 (see FIG. 1B), then an alternative support for leads 311 can summarily obtained by a compensating material 340 positioned under the end portion 311 of elongated lead 310.

[0023] Material 340 is a heat-tolerant and non-adhesive polymer, which can be easily formed (for instance by cutting configurations from a polymeric sheet) to fit on a hot stage in a geometrical configuration suitable to support the plurality of half-etched leads during the process of attaching the stitch bonds to the leads. The material needs to be compliant enough so that its height can be adjusted under pressure (by the capillary) to compensate any height difference among the leads caused by the half-etch process. The polymeric material behaves as a self-adjuster or an auto compensator. As a consequence, all leads appear at the same correct height in the stitch attach process and thus allow a reliable stitch bond formation.

[0024] In the example of FIG. 3, the polymeric material 340 may be formed as a square-shaped ring resting on hot stage 350 to support the half-etched leads 311 on all four sides surrounding pad 101 spaced by gap 113 (see FIG. 1A). When the capillary exerts pressure on a lead 311 for forming the stitch bond, surface 311a of lead 311 is substantially coplanar with surface 101a of pad 101.

[0025] After the stitch bond attachment, the capillary may break off the wire. or the capillary with the wire may be lifted to span an arch 204 from the ball 203 to a pad 205 on a substrate or a leadframe. When the wire touches the pad surface, the capillary tip is pressed against the wire in order to flatten it and thus to form a stitch bond 206, sometimes referred to as a wedge bond.

[0026] The capillary rises again to a height sufficient to display a length of wire with enough metal to form the next ball. Then, a tear method is initiated to break the wire near the end of the stitch bond and leave the exposed wire length dangling from the capillary tip ready for the next ball-forming melting step. Various wire-breaking methods are commonly employed, among them the so-called clamp-tear method and the table-tear method.

[0027] Standardized bond pull tests, with pulls measured in gram-force, are used to gauge the strength of the ball bonds and the stitch bonds. The pull tests to measure the quality of the bonds may be repeated by pull tests to measure the reliability after any of the numerous standardized accelerated life tests, moisture tests, and electrical stress tests.

[0028] Another embodiment of the invention is a method for stabilizing leads in wire-bonded semiconductor devices, summarized in FIG. 4. The method starts with process 401 by providing a heater block suitable to mechanically support the leadframe during the bonding processes and provide the heat to bring the leadframe to the prescribed temperature.

[0029] In the next process 402, pieces of a sheet-like, heat-tolerant, non-adhesive, and compliant polymeric material are positioned on the heater block so that the pieces can support the end-portions of half-etched leads of a leadframe. The pieces are tailored to fit under groups of the half-etched leads while keeping a gap to the leadframe pad with the attached semiconductor chip. In its position as lead supporter, the material is compliant enough to compensate for any overetching or underetching of the leads and thus bring about, under the pressure of the bonder capillary, the necessary resistive strength coupled with co-planarity between the surfaces of the leads and the chip pad.

[0030] In process 403, the leadframe is placed on the heater block so that the half-etched leads are resting on the compliant compensator and obtain the support necessary to compensate any over- or under-etching of the leads. Some heater blocks offer the support for half-etched leads partially as a hard support, such as a step of the heater block, and partially as the compliant compensator.

[0031] In process 404, stitch bond are formed by attaching bonding wires to the half-etched lead surfaces opposite the compensator. As stated, under the pressure on the wire and the leads by the capillary, the surfaces of the leads and the pad (311a and 101a respectively in FIG. 3) become substantially co-planar. It should be pointed out, however, that in other leadframes the surfaces of leads and pad may be in different planes, intentionally separated by a step in order to guarantee uphill bonding for preventing wire shorts to the semiconductor chip.

[0032] While this invention has been described in reference to illustrative embodiments, this description is not intended to be construed in a limiting sense. Various modifications and combinations of the illustrative embodiments, as well as other embodiments of the invention, will be apparent to persons skilled in the art upon reference to the description. As an example, the invention applies not only to active semiconductor devices with low and high pin counts, such as transistors and integrated circuits, but also to combinations of active and passive components on a leadframe pad.

[0033] As another example, the invention applies not only to silicon-based semiconductor devices, but also to devices using gallium arsenide, gallium nitride, silicon germanium, and any other semiconductor material employed in industry. The invention applies to QFN and SON type leadframes and to leadframes with cantilevered leads.

[0034] As another example, the invention applies to leadframes, laminated substrates, and any other substrate or support structure, which includes a conductor with a locally reduced thickness such as a cantilevered lead and a metallurgical surface configuration suitable for metal interdiffusion and welding.

[0035] It is therefore intended that the appended claims encompass any such modifications or embodiments.