Resin card medium and manufacturing method therefor

Abstract

A resin card medium which has a substrate having electronic components mounted thereon and has sophisticated flatness and smoothness realized without providing any layer having holes for absorbing thicknesses of the electronic components; and a method for manufacturing a resin card medium. A resin card medium laminated body before pressing is prepared by laminating, on a first plastic finishing sheet, a substrate having one electronic component or two or more electronic components installed on one side of the substrate, with the one side, on which the electronic component or electronic components are installed, facing upward, and laminating, on the substrate, mixed paper constituted of plastic fibers and plant fibers, and by subjecting the resin card medium laminated body to hot pressing at a temperature which is a softening point or more of the plastic fibers and less than a melting point of the plastic fibers.

Claims

1. A resin card medium comprising: a substrate having one electronic component or two or more electronic components installed on and protruding out from one side of the substrate; a plant fiber-containing resin layer being laminated on a surface of the substrate on a side on which the electronic component or electronic components are installed and containing plant fibers, and said plant fiber-containing resin layer only partially covers at least one of the electronic component(s); a first finishing layer being laminated on a surface of the substrate on a side opposite to the side on which the electronic component or electronic components are installed, and a second finishing layer is further laminated on the plant fiber-containing resin layer such that the plant fiber-containing resin layer is between the substrate and the second finishing layer, wherein a percentage of a total of a thickness of the substrate and a thickness or thicknesses of the electronic component or electronic components to a thickness of the card medium is 80% or less.

2. The resin card medium according to claim 1, wherein the percentage of the total of the thickness of the substrate and the thickness or thicknesses of the electronic component or electronic components to the thickness of the card medium is 70% or less.

3. The resin card medium according to claim 1, wherein the substrate is disposed in such a way as to be displaced to a front side or a rear side from a middle position in a thickness direction of the resin card medium in a longitudinal cross sectional view.

4. The resin card medium according to claim 1, further comprising a display part and/or a fingerprint detection part being installed on the substrate and being exposed outside by providing an opening part for one part of the plant fiber-containing resin layer.

5. The resin card medium according to claim 1, wherein the first finishing layer and/or the second finishing layer are/is plant fiber-non-containing resin layers or a plant fiber-non-containing resin layer which contain/contains no plant fibers.

6. The resin card medium according to claim 5, wherein a resin material of the plant fiber-containing resin layer and/or the plant fiber-non-containing resin layer is copolymerized polyester resin.

7. The resin card medium according to claim 5, wherein a resin material of the plant fiber-containing resin layer and/or the plant fiber-non-containing resin layer is polyethylene terephthalate.

8. The resin card medium according to claim 1, wherein a shape and dimensions of the resin card medium are in conformity with an ISO/IEC 7810:2003 standard.

9. The resin card medium according to claim 8, wherein a warpage amount of the resin card medium in conformity with the ISO/IEC 7810:2003 standard is 1.5 mm or less and besides the ISO standard, a depth of a local depressed part of the resin card medium is less than 0.2 mm.

10. A method for manufacturing the resin card medium according to claim 1, which is flat and smooth, comprising the steps of: preparing a first plastic finishing sheet; laminating, on the first finishing sheet, a substrate having one electronic component or two or more electronic components installed on and protruding out from one side of the substrate, with the one side of the substrate, on which the electronic component or electronic components are installed, facing upward; laminating, on the substrate, mixed paper being constituted of plastic fibers and plant fibers, laminating a second plastic finishing sheet on the mixed paper, and hot pressing at a temperature which is a softening point or more of the plastic fibers and less than a melting point of the plastic fibers.

11. The method for manufacturing a resin card medium according to claim 10, wherein the resin card medium further comprises a display part and/or a fingerprint detection part being installed on the substrate and being exposed outside the resin card medium after hot pressing molding by providing an opening part for one part of the mixed paper.

12. The method for manufacturing a resin card medium according to claim 10, wherein the plastic fibers are copolymerized polyester resin (PET resin).

13. The method for manufacturing a resin card medium according to claim 10, wherein a thickness of the mixed paper, before pressing, being laminated on a surface of the substrate on a side on which the electronic component or electronic components are installed is thicker than a thickness of the first finishing sheet, before pressing, being laminated beneath a surface of the substrate on a side opposite to the side on which the electronic component or electronic components are installed.

14. The method for manufacturing a resin card medium according to claim 10, wherein a shape and dimensions of the obtained resin card medium are in conformity with an ISO/IEC 7810:2003 standard.

15. The method for manufacturing a resin card medium according to claim 10, wherein a warpage amount, of the obtained resin card medium, in conformity with the ISO/IEC 7810:2003 standard is 1.5 mm or less, and besides the ISO standard, a depth of a local depressed part of the resin card medium is less than 0.2 mm.

16. The method for manufacturing a resin card medium according to claim 10, wherein a percentage of a total of a thickness of the substrate and a thickness or thicknesses of the electronic component or electronic components to a thickness of the resin card medium after the hot pressing molding is adjusted to be 80% or less.

17. The method for manufacturing a resin card medium according to claim 16, wherein the percentage of the total of the thickness of the substrate and the thickness or the thicknesses of the electronic component or electronic components to the thickness of the resin card medium after the hot pressing molding is adjusted to be 70% or less.

18. A method for manufacturing manufacturing the resin card medium according to claim 1, which is flat and smooth, comprising the steps of: laminating mixed paper being constituted of plastic fibers and plant fibers; laminating, on the mixed paper, a substrate having one electronic component or two or more electronic components installed on and protruding out from one side of the substrate, with the one side of the substrate, on which the electronic component or electronic components are installed, facing downward; laminating a first plastic finishing sheet on the substrate, preparing a second plastic finishing sheet beneath the mixed paper; and hot pressing at a temperature which is a softening point or more of the plastic fibers and less than a melting point of the plastic fibers.

19. The method for manufacturing a resin card medium according to claim 18, wherein the resin card medium further comprises a display part and/or a fingerprint detection part being installed on the substrate and being exposed outside the resin card medium after hot pressing molding by providing an opening part for one part of the mixed paper.

20. A resin card medium according to claim 1, which has been prepared by laminating, on a first plastic finishing sheet, a substrate having one electronic component or two or more electronic components installed on and protruding out from one side of the substrate, with the one side, on which the electronic component or electronic components are installed, facing upward, and laminating, on the substrate, mixed paper being constituted of plastic fibers and plant fibers, laminating a second plastic finishing sheet on the mixed paper, wherein by subjecting the resin card medium laminated body to hot pressing at a temperature which is a softening point or more of the plastic fibers and less than a melting point of the plastic fibers, formed is the resin card medium whose card warpage amount in conformity with an ISO/IEC 7810:2003 standard is 1.5 mm or less and besides the ISO standard, whose depth of a local depressed part of the resin card medium is less than 0.2 mm.

21. The resin card medium according to claim 20, further comprising a display part and/or a fingerprint detection part being installed on the substrate and being exposed outside the resin card medium after hot pressing molding by providing an opening part for one part of the mixed paper.

22. The resin card medium according to claim 20, wherein a percentage of a total of a thickness of the substrate and a thickness or thicknesses of the electronic component or electronic components to a thickness of the resin card medium after the hot pressing molding is 80% or less.

23. The resin card medium according to claim 22, wherein the percentage of the total of the thickness of the substrate and the thickness or thicknesses of the electronic component or electronic components to the thickness of the resin card medium after the hot pressing molding is 70% or less.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a diagram schematically showing cross sections of a card medium in Example 1 before and after hot pressing molding

(2) FIG. 2 is a diagram schematically showing cross sections of a card medium in Example 2 before and after hot pressing molding.

(3) FIG. 3 is a diagram schematically showing cross sections of a card medium in Example 3 before and after hot pressing molding.

(4) FIG. 4 is a diagram schematically showing cross sections of a card medium in Example 4 before and after hot pressing molding.

(5) FIG. 5 is a diagram schematically showing cross sections of a card medium in Comparative Example 1 before and after hot pressing molding.

(6) FIG. 6 is a diagram schematically showing cross sections of a card medium in Comparative Example 2 before and after hot pressing molding.

(7) FIG. 7 is a diagram schematically showing cross sections of a card medium in Comparative Example 3 before and after hot pressing molding.

(8) FIG. 8 is a diagram schematically showing cross sections of a card medium in Comparative Example 4 before and after hot pressing molding.

(9) FIG. 9 is a diagram schematically showing cross sections of a card medium in Comparative Example 5 before and after hot pressing molding.

(10) FIG. 10 is a diagram schematically showing cross sections of a card medium in Reference Example 1 before and after hot pressing molding.

(11) FIG. 11 is a diagram schematically showing cross sections of a card medium in Reference Example 2 before and after hot pressing molding.

(12) FIG. 12 is a diagram schematically showing cross sections of a card medium in Reference Example 3 before and after hot pressing molding.

(13) FIG. 13 is a diagram schematically showing cross sections of a card medium in Reference Example 4 before and after hot pressing molding.

(14) FIG. 14 is a photograph of the card medium in Example 1 before and after the hot pressing molding.

(15) FIG. 15 is a photograph of the card medium in Comparative Example 1 before and after the hot pressing molding.

DESCRIPTION OF EMBODIMENTS

(16) Hereinafter, a resin card medium and a manufacturing method therefor according to one embodiment of the present invention will be described in detail with reference to the accompanying drawings. Note that the present invention is not limited to Examples shown below, and a variety of modifications can be made without departing from the scope of the technical ideas of the present invention.

1. Preparation of Resin Card Mediums

Example 1 (See FIG. 1)

(17) (1) Card Medium Laminated Body

(18) On a substrate 7 (with a product name “Polyimide Substrate”) having a size of 35 mm×78 mm and a thickness of 0.10 mm, one plastic pseudo chip A (8) having a 7-mm-square size and a thickness of 0.4 mm and two plastic pseudo chips B (9) each having a 7-mm-square size and a thickness of 0.25 mm were arranged in appropriate positions, thereby preparing a substrate 7 having the pseudo chips 8 and 9 installed thereon.

(19) Next, one first finishing sheet 4 (with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of polyethylene terephthalate glycol-modified (PETG) was prepared; on the first finishing sheet 4, the above-mentioned substrate 7 was laminated with a side, on which the pseudo chips 8 and 9 were installed, facing upward; three pieces of mixed paper 3 (with a product name “SC-01”, manufactured by TOMOEGAWA CO., LTD., having a thickness of 0.21 mm and a softening point of 130° C.) constituted of copolymerized polyester resin (PET resin) fibers and plant fibers were laminated thereon; and further, one second finishing sheet 5 (with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of the polyethylene terephthalate glycol-modified (PETG) was laminated thereon, thereby forming a card medium laminated body 2 in Example 1.

(20) (2) Hot Pressing Molding

(21) The card medium laminated body 2 in Example 1 was heated at a temperature of 160° C. by a hot pressing machine and was thereby softened; the card medium laminated body 2 was held under a pressure of 0.26 MPa for five minutes; thereafter, the card medium laminated body 2 was further pressurized under a pressure of 0.65 MPa and was held for seven minutes; thereafter, with the pressure of 0.65 MPa retained, cooling was conducted therefor up to a room temperature; and the obtained resin card medium molded body was singulated into pieces each having a card shape, thereby preparing a resin card medium 1 in Example 1 whose dimensions were in conformity with the ISO/IEC 7810:2003 standard (0.76 mm-thick×85.60 mm-wide×53.98 mm-high).

Example 2 (See FIG. 2)

(22) (1) Card Medium Laminated Body

(23) The same configuration as that in Example 1 except that three plastic pseudo chips C (10) each having a 7-mm-square size and a thickness of 0.2 mm were used and arranged in appropriate positions on a substrate 7 was employed, thereby forming a card medium laminated body 2 in Example 2.

(24) (2) Hot Pressing Molding

(25) The card medium laminated body 2 in Example 2 was subjected to hot pressing molding under the same conditions as those in Example 1, thereby preparing a resin card medium 1 in Example 2 whose shape and dimensions were in conformity with the ISO/IEC 7810:2003 standard.

Example 3 (See FIG. 3)

(26) (1) Card Medium Laminated Body

(27) The same configuration as that in Example 1 except that a substrate 7 (with a product name “Polyimide Substrate”) having a size of 35 mm×40 mm and a thickness of 0.10 mm was used was employed, thereby forming a card medium laminated body 2 in Example 3.

(28) (2) Hot Pressing Molding

(29) The card medium laminated body 2 in Example 3 was subjected to hot pressing molding under the same conditions as those in Example 1, thereby preparing a resin card medium 1 in Example 3 whose shape and dimensions were in conformity with the ISO/IEC 7810:2003 standard.

Example 4 (See FIG. 4)

(30) (1) Card Medium Laminated Body

(31) The same configuration as that in Example 1 except that three plastic pseudo chips A (8) each having a 7-mm-square size and a thickness of 0.4 mm were used and arranged at mutual narrow intervals on a substrate 7 was employed, thereby forming a card medium laminated body 2 in Example 4.

(32) (2) Hot Pressing Molding

(33) The card medium laminated body 2 in Example 4 was subjected to hot pressing molding under the same conditions as those in Example 1, thereby preparing a resin card medium 1 in Example 4 whose shape and dimensions were in conformity with the ISO/IEC 7810:2003 standard.

Comparative Example 1 (See FIG. 5)

(34) (1) Card Medium Laminated Body

(35) The same configuration as that in Example 1 except that instead of the three pieces of the mixed paper 3 (with the product name “SC-01”, manufactured by TOMOEGAWA CO., LTD., having the thickness of 0.21 mm and the softening point of 130° C.) constituted of copolymerized polyester resin (PET resin) fibers and plant fibers, three plastic laminated sheets 6 (each with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of the polyethylene terephthalate glycol-modified (PETG) were laminated and a second finishing sheet 5 (with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of the polyethylene terephthalate glycol-modified (PETG) was omitted was employed, thereby forming a card medium laminated body 2 in Comparative Example 1.

(36) (2) Hot Pressing Molding

(37) The card medium laminated body 2 in Comparative Example 1 was subjected to hot pressing molding under the same conditions as those in Example 1 except that the heating condition was changed from 160° C. to 130° C. and the plastic laminated sheets 6 formed of the PETG were melted by a hot pressing machine, thereby preparing a resin card medium 1 in Comparative Example 1 whose shape and dimensions were in conformity with the ISO/IEC 7810:2003 standard.

Comparative Example 2 (See FIG. 6)

(38) (1) Card Medium Laminated Body

(39) The same configuration as that in Example 2 except that instead of the three pieces of the mixed paper 3 (with the product name “SC-01”, manufactured by TOMOEGAWA CO., LTD., having the thickness of 0.21 mm and the softening point of 130° C.) constituted of the copolymerized polyester resin (PET resin) fibers and the plant fibers, three plastic laminated sheets 6 (each with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of the polyethylene terephthalate glycol-modified (PETG) were laminated and a second finishing sheet 5 (with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of the polyethylene terephthalate glycol-modified (PETG) was omitted was employed, thereby forming a card medium laminated body 2 in Comparative Example 2.

(40) (2) Hot Pressing Molding

(41) The card medium laminated body 2 in Comparative Example 2 was subjected to hot pressing molding under the same conditions as those in Example 2 except that the heating condition was changed from 160° C. to 130° C. and the plastic laminated sheets 6 formed of the PETG were melted by a hot pressing machine, thereby preparing a resin card medium 1 in Comparative Example 2 whose shape and dimensions were in conformity with the ISO/IEC 7810:2003 standard.

Comparative Example 3 (See FIG. 7)

(42) (1) Card Medium Laminated Body

(43) The same configuration as that in Example 3 except that instead of the three pieces of the mixed paper 3 (with the product name “SC-01”, manufactured by TOMOEGAWA CO., LTD., having the thickness of 0.21 mm and the softening point of 130° C.) constituted of the copolymerized polyester resin (PET resin) fibers and the plant fibers, two plastic laminated sheets 6 (with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of the polyethylene terephthalate glycol-modified (PETG) were laminated and a second finishing sheet 5 (with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of the polyethylene terephthalate glycol-modified (PETG) was omitted was employed, thereby forming a card medium laminated body 2 in Comparative Example 3.

(44) (2) Hot Pressing Molding

(45) The card medium laminated body 2 in Comparative Example 3 was subjected to hot pressing molding under the same conditions as those in Example 3 except that the heating condition was changed from 160° C. to 130° C. and the plastic laminated sheets 6 formed of the PETG were melted by a hot pressing machine, thereby preparing a resin card medium 1 in Comparative Example 3 whose shape and dimensions were in conformity with the ISO/IEC 7810:2003 standard.

Comparative Example 4 (See FIG. 8)

(46) (1) Card Medium Laminated Body

(47) On a substrate 7 (with a product name “Polyimide Substrate”) having a size of 35 mm×78 mm and a thickness of 0.10 mm, three plastic pseudo chips C (10) each having a 7-mm-square size and a thickness of 0.2 mm were arranged in appropriate positions, thereby preparing a substrate 7 having the pseudo chips 10 installed thereon.

(48) Next, two first finishing sheets 4 (each with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of polyethylene terephthalate glycol-modified (PETG) were prepared; and with a side of the above-mentioned substrate 7, on which the pseudo chips 10 were installed, facing upward, two plastic laminated sheets 6 (each with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of the polyethylene terephthalate glycol-modified (PETG) were laminated thereon, thereby forming a card medium laminated body 2 in Comparative Example 4.

(49) In other words, the card medium laminated body 2 in Comparative Example 4 has the same configuration as that of the card medium laminated body 2 in Comparative Example 2 except that the number of the first finishing sheets 4 laminated on a rear surface of the substrate 7 on which the pseudo chips 10 were installed and the number of the plastic laminated sheets 6 laminated on a front surface of the substrate 7 were both two.

(50) (2) Hot Pressing Molding

(51) Hot pressing molding conditions for the card medium laminated body 2 in Comparative Example 4 are the same as those for the card medium laminated body 2 in Comparative Example 2.

(52) In other words, the card medium laminated body 2 in Comparative Example 4 was subjected to hot pressing molding under the same conditions as those in Example 2 except that the heating condition was changed from 160° C. to 130° C. and the plastic laminated sheets 6 formed of the PETG were melted by a hot pressing machine, thereby preparing a resin card medium 1 in Comparative Example 4 whose shape and dimensions were in conformity with the ISO/IEC 7810:2003 standard.

Comparative Example 5 (See FIG. 9)

(53) (1) Card Medium Laminated Body

(54) The same configuration as that in Example 1 except that two plastic pseudo chips D (11) each having a 7-mm-square size and a thickness of 0.55 mm were used and arranged in appropriate positions on a substrate 7 was employed, thereby forming a card medium laminated body 2 in Comparative Example 5.

(55) (2) Hot Pressing Molding

(56) The card medium laminated body 2 in Comparative Example 5 was subjected to hot pressing molding under the same conditions as those in Example 1, thereby preparing a resin card medium 1 in Comparative Example 5 whose shape and dimensions were in conformity with the ISO/IEC 7810:2003 standard.

Reference Example 1 (See FIG. 10)

(57) (1) Card Medium Laminated Body

(58) The same configuration as that in Example 1 except that no plastic pseudo chips were arranged on a substrate 7 at all was employed, thereby forming a card medium laminated body 2 in Reference Example 1.

(59) (2) Hot Pressing Molding

(60) The card medium laminated body 2 in Reference Example 1 was subjected to hot pressing molding under the same conditions as those in Example 1, thereby preparing a resin card medium 1 in Reference Example 1 whose shape and dimensions were in conformity with the ISO/IEC 7810:2003 standard.

Reference Example 2 (See FIG. 11)

(61) (1) Card Medium Laminated Body

(62) The same configuration as that in Reference Example 1 except that instead of the three pieces of the mixed paper 3 (with a product name “SC-01”, manufactured by TOMOEGAWA CO., LTD., having a thickness of 0.21 mm and a softening point of 130° C.) constituted of the copolymerized polyester resin (PET resin) fibers and the plant fibers, three plastic laminated sheets 6 (each with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of polyethylene terephthalate glycol-modified (PETG) were laminated and a second finishing sheet 5 (with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of the polyethylene terephthalate glycol-modified (PETG) was omitted was employed, thereby forming a card medium laminated body 2 in Reference Example 2.

(63) (2) Hot Pressing Molding

(64) The card medium laminated body 2 in Reference Example 2 was subjected to hot pressing molding under the same conditions as those in Reference Example 1 except that the heating condition was changed from 160° C. to 130° C. and the plastic laminated sheets 6 formed of the PETG were melted by a hot pressing machine, thereby preparing a resin card medium 1 in Reference Example 2 whose shape and dimensions were in conformity with the ISO/IEC 7810:2003 standard.

Reference Example 3 (See FIG. 12)

(65) (1) Card Medium Laminated Body

(66) Two first finishing sheets 4 (each with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of polyethylene terephthalate glycol-modified (PETG) were prepared; a substrate 7 having no pseudo chips installed thereon at all was laminated thereon; and two plastic laminated sheets 6 (each with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of the polyethylene terephthalate glycol-modified (PETG) were laminated, thereby forming a card medium laminated body 2 in Reference Example 3.

(67) In other words, the card medium laminated body 2 in Reference Example 3 has the same configuration as that of the card medium laminated body 2 in Reference Example 2 except that the number of the first finishing sheets 4 laminated on a rear surface of the substrate 7 and the number of the plastic laminated sheets 6 laminated on a front surface of the substrate 7 were both two.

(68) (2) Hot Pressing Molding

(69) The card medium laminated body 2 in Reference Example 3 was subjected to hot pressing molding under the same conditions as those in Reference Example 2, thereby preparing a resin card medium 1 in Reference Example 3 whose shape and dimensions were in conformity with the ISO/IEC 7810:2003 standard.

Reference Example 4 (See FIG. 13)

(70) (1) Card Medium Laminated Body

(71) One first finishing sheet 4 (with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of polyethylene terephthalate glycol-modified (PETG) was prepared; one plastic pseudo chip A (8) having a 7-mm-square size and a thickness of 0.4 mm and two plastic pseudo chips B (9) having a 7-mm-square size and a thickness of 0.25 mm were arranged in appropriate positions thereon; and three plastic laminated sheets 6 (each with a product name “DIAFIX PG-WHI-FG”, manufactured by Mitsubishi Plastics, Inc., having a thickness of 0.20 mm and a melting point of 80° C.) formed of the polyethylene terephthalate glycol-modified (PETG) were laminated thereon, thereby forming a card medium laminated body 2 in Reference Example 4.

(72) In other words, the card medium laminated body 2 in Reference Example 4 has the same configuration as that of the card medium laminated body 2 in each of Comparative Examples 1 and 3 except that the card medium laminated body 2 has no substrate 7.

(73) (2) Hot Pressing Molding

(74) The card medium laminated body 2 in Reference Example 4 was subjected to hot pressing molding under the same conditions as those in each of Comparative Examples 1 and 3, thereby preparing a resin card medium 1 in Reference Example 4 whose shape and dimensions were in conformity with the ISO/IEC 7810:2003 standard.

2. Shape Evaluation of Resin Card Mediums

(75) (1) Warpage Amounts of Resin Card Mediums

(76) As to warpage amounts of the resin card mediums, maximum distances from a plane of a surface plate were measured on all portions of protruding surfaces in conformity with the ISO/IEC 7810:2003 standard by using a laser displacement sensor (LK-030, manufactured by KEYENCE CORPORATION).

(77) (2) Evaluation of Surface Depressions of Resin Card Mediums

(78) Surface depressions of the resin card mediums were measured by using the laser displacement sensor (LK-030, manufactured by KEYENCE CORPORATION) and were evaluated as follows.

(79) A mark “∘” indicates a case in which any depression such as a sink and a flaw whose depth was 0.2 mm or more was not present on a surface of a resin card medium (see FIG. 14).

(80) A mark “Δ” indicates a case in which one depression such as the sink and the flaw whose depth was 0.2 mm or more was present and one or more depressions such as the sink and the flaw whose each depth was 0.1 mm or more and less than 0.2 mm were also present on a surface of a resin card medium.

(81) A mark “x” indicates a case in which two or more depressions such as the sink and the flaw whose each depth was 0.2 mm or more were present on a surface of a resin card medium (see FIG. 15).

(82) Manufacturing conditions and test results of the resin card mediums in the above-described Examples 1 to 4, Comparative Examples 1 to 5, and Reference Examples 1 to 4 are shown in the following Table 1.

(83) TABLE-US-00001 TABLE 1 Manufacturing Conditions of Card Medium Maximum Height and Substrate Test Results of Card Medium Number of Thickness Maximum Laminate Area of 0.1 Chips with (Including Substrate Evaluation Material on mm-Thick 7-mm-Square Maximum Chip Thickness/Card of Warpage Evaluation of Comprehensive — Chip Side Substrate *1 Size Thickness) Thickness × 100 Amount *2 Depression Evaluation Example 1 PET Mixed 35 mm × 78 mm 0.4 mm × 1 0.5 mm 65.8% 0.89 mm ∘ ∘ Paper 0.25 mm × 2  ∘ Example 2 PET Mixed 35 mm × 78 mm 0.2 mm × 3 0.3 mm 39.5% 1.07 mm ∘ ∘ Paper ∘ Example 3 PET Mixed 35 mm × 40 mm 0.4 mm × 1 0.5 mm 65.8% 1.12 mm ∘ ∘ Paper 0.25 mm × 2  ∘ Example 4 PET Mixed 35 mm × 78 mm 0.4 mm × 3 0.5 mm 65.8% 0.98 mm ∘ ∘ Paper ∘ Comparative PETG 35 mm × 78 mm 0.4 mm × 1 0.5 mm 65.8% 2.72 mm x x Example 1 0.25 mm × 2  x Comparative PETG 35 mm × 78 mm 0.2 mm × 3 0.3 mm 39.5% 2.99 mm x x Example 2 x Comparative PETG 35 mm × 40 mm 0.4 mm × 1 0.5 mm 65.8% 2.30 mm x x Example 3 0.25 mm × 2  x Comparative PETG 35 mm × 78 mm 0.2 mm × 3 0.3 mm 39.5% 1.85 mm x x Example 4 x Comparative PET Mixed 35 mm × 78 mm 0.55 mm × 2  0.65 mm 85.5% 0.91 mm Δ x Example 5 Paper ∘ Reference PET Mixed 35 mm × 78 mm — 0.1 mm 13.2% 0.85 mm ∘ No Chip Example 1 Paper ∘ Reference PETG 35 mm × 78 mm — 0.1 mm 13.2%  2.8 mm Δ No Chip Example 2 x Reference PETG 35 mm × 78 mm — 0.1 mm 13.2% 0.91 mm Δ No Chip Example 3 ∘ Reference PETG — 0.4 mm × 1 0.4 mm 52.6% 0.84 mm x No Substrate Example 4 0.25 mm × 2  ∘ *1 Shape of Card Medium after Hot Press Molding: 0.76 mm-Thick × 85.60 mm-Wide × 53.98 mm-High *2 Permissible Range of Warpage Amount of Card Medium: Not Exceeding 1.5 mm (ISO/IEC 7810 Standard)

(84) By comparing Examples 1 to 4 and Comparative Examples 1 to 4, it has been found out from Table 1 that whereas when a total of thicknesses of each substrate and chips was changed by installing the pseudo chips having the different heights, in each of Comparative Examples 1 to 4 in which all of the substrate surface on the side on which the chips were installed was covered with the laminated sheets (plant fiber-non-containing resin layers not containing the plant fibers after the hot pressing molding) formed of the polyethylene terephthalate glycol-modified (PETG), the depressions due to the warpage, the sink, and the like whose each depth exceeded 1.5 mm were caused (see FIG. 15), in each of Examples 1 to 4 in which all of the substrate surface on the side on which the chips were installed was covered with the mixed paper (plant fiber-containing resin layer containing the plant fibers after the hot pressing molding) constituted of the copolymerized polyester resin (PET resin) fibers and the plant fibers, the depression due to the warpage, the sink, and the like whose depth exceeded 1.5 mm was not caused (see FIG. 14).

(85) Although the detailed mechanism of this is unknown, it is inferred that in the case of each of Comparative Examples 1 to 4, since the plant fibers which inhibit flowing of the molten resin and function as a cushion material absorbing the thicknesses of the chips upon hot pressing or function to inhibit or suppress deformation of the card medium are not contained in the laminated sheets (plant fiber-non-containing resin layers) formed of the PETG, the depressions or the flaws due to the sink and the like caused by solidification speed unevenness and flowing unevenness of the molten resin and the like are caused on the card surface or a residual stress in the card is caused, and the residual stress is released after molding, thereby resulting in the large warpage of the card medium.

(86) On the other hand, it is inferred that in the case of each of Examples 1 to 4, the plant fibers which inhibit flowing of the softened resin and function as a cushion material absorbing the thicknesses of the chips upon hot pressing or function to inhibit or suppress the deformation of the card medium are contained in the mixed paper (plant fiber-containing resin layers), generation of the sink due to curing speed unevenness and flowing unevenness of the softened resin and the like is suppressed, and further, even if a residual stress is caused in the card, the plant fibers serve as a reinforcing material, deformation of the card is thereby restrained, and as a result, the release of the residual stress is suppressed and the warpage or the deformation of the card is thereby prevented.

(87) Note that by comparing Example 1 and Example 3, by comparing Comparative Example 1, Comparative Example 3, and Reference Example 4, by comparing Example 1 and Comparative Example 3, or by comparing Comparative Example 1 and Example 3, it has been found out that a ratio of an occupancy area of the substrate to an area of the card medium hardly exerts an influence on flatness and smoothness of the card such as a magnitude of the warpage amount of the card and presence or absence of the generation of a local depressed part of the card.

(88) In addition, by comparing Examples 1, 2, and 4 and Comparative Example 5, it has been found out that in order to cause the mixed paper (plant fiber-containing resin layers containing the plant fibers after the hot pressing molding) constituted of the copolymerized polyester resin (PET resin) fibers and the plant fibers to surely absorb the thicknesses of the pseudo chips and the substrate, it is required to adjust a percentage of a total of the thickness of the substrate and the thicknesses of the chips to a thickness of the card medium after the hot pressing molding to 80% or less or more preferably, to 70% or less. As a result of this, in the card medium in each of Examples 1 to 4, extremely excellent flatness and smoothness in that the warpage amount of the card medium in conformity with the ISO/IEC 7810:2003 standard is 1.5 mm or less and besides the above-mentioned ISO standard, the depth of the local depressed part of the card is less than 0.2 mm can be obtained.

(89) By comparing Reference Example 2 and Reference Example 3, it has been found out that a position of the substrate in a thickness direction of the card medium is disposed in such a way as to be displaced to a front side or a rear side from a middle position, large warpage of the card medium is caused. It is inferred that since the thickness of the molten resin layer on the front side of the substrate and the thickness of the molten resin layer on the rear side thereof are different from each other, solidification speed unevenness, flowing unevenness, and the like are caused between the front side and the rear side of the substrate, and a residual stress caused in the card is released after molding, thereby resulting in the large warpage of the card medium.

(90) On the other hand, by comparing Reference Example 1 and Reference Example 2, it is inferred that in the case of Reference Example 1 in which the mixed paper (plant fiber-containing resin layers) constituted of the copolymerized polyester resin (PET resin) fibers and the plant fibers is used, since the plant fibers whose shapes, nature, and the like hardly change even if an influence of heat is exerted thereon are contained in the mixed paper, even if temperature unevenness, flowing unevenness, and curing speed unevenness of the copolymerized polyester resin (PET resin) fibers are caused due to the placement of the substrate displaced to the front side or the rear side, the plant fibers serve as a reinforcing material, deformation of the card is thereby restrained, and as a result, a release of the residual stress is prevented and the warpage and deformation of the card are thereby prevented.

(91) Therefore, in the case of Reference Example 1, regardless of presence or absence of the pseudo chips, even when the substrate is disposed in such a way as to be displace from the middle position in the thickness direction of the card medium to the front side or the rear side in a longitudinal cross sectional view, the warpage amount of the card in conformity with the ISO/IEC 7810:2003 standard is 1.5 mm or less and besides the above-mentioned ISO standard, extremely excellent flatness and smoothness in that the depth of the local depressed part of the card is less than 0.2 mm can be obtained.

REFERENCE SIGNS LIST

(92) 1 . . . Resin card medium 2 . . . Resin card medium laminated body 3 . . . Mixed paper (PET mixed paper with a thickness of 0.21 mm) 4 . . . First finishing sheet (PETG with a thickness 0.20 mm) 5 . . . Second finishing sheet (PETG with thickness of 0.20 mm) 6 . . . Plastic laminated sheet (PETG with a thickness of 0.20 mm) 7 . . . Substrate (with a thickness of 0.10 mm) 8 . . . Pseudo chip A (with a 7-mm-square size and a thickness of 0.4 mm) 9 . . . Pseudo chip B (with a 7-mm-square size and a thickness of 0.25 mm) 10 . . . Pseudo chip C (with a 7-mm-square size and a thickness of 0.2 mm) 11 . . . Pseudo chip D (with a 7-mm-square size and a thickness of 0.55 mm) 12 . . . Plant fiber-containing resin layer 13 . . . First finishing layer (fiber-non-containing resin layer) 14 . . . Second finishing layer (fiber-non-containing resin layer) 15 . . . Fiber-non-containing resin layer