Monitoring System for Injection Molding

Abstract

A data monitoring system for injection moulds is provided, for collecting and transmitting data produced and collected during injection processes, which includes a monitoring device (13) for monitoring a mould (1), which is provided with an integrated circuit (12), the system being provided with: a computer (17) for storing various signals from respective sensors (8) situated in the mould (1), mould-holder or the machine itself; a memory (16) for saving the data; a communication device (18) for communication the data to external reading means; a housing (11) on the mould for housing the monitoring device; a data module (10) of the mould (1), which has an integrated circuit (4) and is provided with an editable memory (5) for storing historical information concerning the mould; and a communication module (6) for communicating between the integrated circuit and an external computer for editing and reading the information.

Claims

1. A data monitoring system for injection moulds, namely of thermoplastics, for the collection and transmission of the data produced and collected during the injection processes, characterized in that it comprises a monitoring device (13) of a mould (1), that possesses an integrated circuit (12), provided with: a computer (17) for the storage of different signals coming from respective sensors (8) located in the mould (1), in the mould-carrier or in the machine itself; a memory (16) to keep the said data; a communication device (18) to communicate the said data to external reading means; and with a recess (11) in the mould (1), to arrange the monitoring device (13).

2. The data monitoring system, according to the claim 1, characterized in that it comprises, in addition: a data module (10) of the mould (1) that possesses an integrated circuit (4), provided with: an editable memory (5) for the storage of the historic information relative to the mould; and with a communication module (6) between the integrated circuit and an external computer for editing and reading the said information.

3. The data monitoring system, according to claim 1, characterized in that the said data modules (10) of the mould (1) and/or the said monitoring device (13), are provided each with connectors (2, 3) of electrical-electronic connection, having a size virtually equal to the size of the corresponding integrated circuits (4, 12).

4. The data monitoring system, according to the claim 1, characterized in that the said sensors (8) pertain to the group formed by: T, P, speed, distance, number of parts, output of servomotors.

5. The data monitoring system, according to the claim 1, characterized in that the said recess (11) is a cavity (9) in the mould (1).

6. The data monitoring system, according to the claim 1, characterized in that the said recess (11) is a mounting surface (14) arranged on the mould (1).

7. The data monitoring system, according to the claim 1, characterized in that the said integrated circuits (4, 12) are encapsulated within a protecting casing (15).

8. The data monitoring system, according to the claim 7, characterized in that the said protecting casing (15) is cylindrical.

9. The data monitoring system, according to the claim 7, characterized in that the said protecting casing (15) is parallelepipedal.

10. The data monitoring system, according to claim 2, characterized in that the said data modules (10) of the mould (1) and/or the said monitoring device (13), are provided each with connectors (2, 3) of electrical-electronic connection, having a size virtually equal to the size of the corresponding integrated circuits (4, 12).

11. The data monitoring system, according to the claim 2, characterized in that the said integrated circuits (4, 12) are encapsulated within a protecting casing (15).

Description

SHORT DESCRIPTION OF THE DRAWINGS

[0012] Thereafter, a detailed description of ways of preferred although not exclusive embodiments are given, of the data monitoring system for injection moulds, object of this invention, for a best understanding of which a set of drawings is attached in which are illustrated, for non-limiting example purpose, embodiments of this invention. In the said drawings:

[0013] The FIG. 1 is a view in perspective that illustrates a first embodiment of the system of this invention, in which the monitoring device is enclosed in a cylindrical casing;

[0014] The FIG. 2 is a variant of the monitoring device of the FIG. 1, that comprises in addition a module of data of the mould and/or of the injection machine, enclosed in the mentioned cylindrical casing;

[0015] The FIG. 3 is a view in perspective that illustrates the second embodiment of the monitoring device in a parallelepiped-shaped of the protecting casing;

[0016] The FIG. 4 illustrates the monitoring system according to this invention, in a variant of the parallelepipedal shape of the casing, in which the monitoring device, the casing and, eventually, the module of data of the mould are superficially mounted on the injection mould; and

[0017] the FIG. 5 represents the monitoring system of this invention, in a variant of the parallelepipedal shape of the casing, in which this later, is arranged in a rectangular section recess made in the injection mould itself.

DETAILED DESCRIPTION OF THE DRAWINGS

[0018] In the said drawings are shown the structure and the operating mode of the data monitoring system for injection moulds, namely of thermoplastics, for the collection and transmission of the data produced and collected during the injection processes, of the type they comprise.

[0019] The system comprises a monitoring device (13) encapsulated and arranged in an ad hoc recess provided in the mould (1), counter-mould or in the injection machine itself in which the process that is sought to be monitored is carried out.

[0020] In the FIG. 1, it can be clearly seen that the monitoring device (13) of the system, is based in an integrated circuit (12), provided with a computer (17) for the storage of different signals coming from respective sensors (8) located in the mould (1), in the mould-carrier or in the machine itself; a memory (16) to keep the said data; and a communication device (18) to communicate the said data to external reading means.

[0021] Among these sensors (8) they can be T, P, speed, distance, number of parts, servomotors output, etc. sensors.

[0022] The measures of the signals coming from the sensors (8) have access to the monitoring devices through each respective cables (7), through a connector (3). The communication of the sensors (8) with the monitoring device (13) can also be carried out wireless provided that the technical conditions allow it.

[0023] Preferably the monitoring device (13) of the system is completed with a data module (10) of the mould (1), and/or the machine, that comprises an integrated circuit (12), provided with: [0024] an editable memory for the storage of historic information (“tracking”) relating to the mould (1), including key dates, results of operations of injection, drawings, history of failures or incidents, data and locations of the machines in which it has worked, types and quantity of units produced associated to dates and locations, defects, etc.; and with [0025] a module of communications between the integrated circuit (12) and an external computer for editing and reading the said information.

[0026] The data module device (10) of the mould (1) can comprise a connector (2) of electrical-electronic connections.

[0027] The size of the above-mentioned connector (3), is preferably a size practically the same as the size of the integrated circuit (13). In the example appearing in the FIGS. 1 and 2, the connector (3) is cylindrical, and the transversal dimension of the monitoring device (13) is ranging from 1 to 0.8 times the diameter of the connector (3), although in general it can be ranging from 1.2 to 0.8 times.

[0028] The integrated circuits (4, 12) can be arranged within a protecting casing (15), including the possibility to be encapsulated and embedded in a plastic material, for concealing them. In the FIGS. 1 and 2 examples of embodiment of the casing (15) are shown, in which this later is cylindrical, while in the FIGS. 3 to 5 examples are illustrated in which the casing (15) is pallelepiped-shaped. The casing (15) can have any size and it can be used to protect the integrated circuits (4, 12) as well mechanically as from the high temperatures that can exist in the recess (11).

[0029] As for the casing (11) in the mould (1), in the FIG. 5 an example is shown in which the said recess (11) is constituted by a cavity (9) produced to that effect in the moulds (1) themselves. In the FIG. 4 a variant is shown in which, on the contrary, the recess (11) is a mounting area or surface (14) arranged on the surface of the mould (1). In this case, it corresponds to the embodiment of the FIG. 3. It shall be understood that the monitoring device (13) and, eventually, the data module (10) of the mould, can also be housed in the counter-mould or in some of the mould or counter-mould platens.

[0030] The nature of this invention being sufficiently disclosed as well as the way of implementing it, it is stated that anything that provided it does not alter, change or modify its main principle, it can be subject to variations of details.