Molded plastic film article, manufacturing method, and blister
11059643 ยท 2021-07-13
Assignee
Inventors
Cpc classification
B32B3/266
PERFORMING OPERATIONS; TRANSPORTING
B32B27/322
PERFORMING OPERATIONS; TRANSPORTING
B32B2255/28
PERFORMING OPERATIONS; TRANSPORTING
B32B27/304
PERFORMING OPERATIONS; TRANSPORTING
B32B2255/10
PERFORMING OPERATIONS; TRANSPORTING
B32B2250/242
PERFORMING OPERATIONS; TRANSPORTING
B65D75/327
PERFORMING OPERATIONS; TRANSPORTING
B32B2307/40
PERFORMING OPERATIONS; TRANSPORTING
B32B3/30
PERFORMING OPERATIONS; TRANSPORTING
B32B7/12
PERFORMING OPERATIONS; TRANSPORTING
B32B27/306
PERFORMING OPERATIONS; TRANSPORTING
B32B2250/246
PERFORMING OPERATIONS; TRANSPORTING
International classification
B65D75/32
PERFORMING OPERATIONS; TRANSPORTING
B32B7/12
PERFORMING OPERATIONS; TRANSPORTING
B32B27/30
PERFORMING OPERATIONS; TRANSPORTING
B32B3/30
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A plastic foil molded part for a blister, in particular a tablet blister, comprises a transparent carrier substrate having a semitransparent function layer. The semitransparent function layer is constituted such that the plastic foil molded part has a first, visually recognizable color upon viewing in incident light and has a second, visually recognizable color upon viewing in transmitted light.
Claims
1. A plastic foil molded part for a blister comprising a transparent carrier substrate having a semitransparent function layer, wherein the plastic foil molded part includes a plurality of cavities or depressions, each of the cavities or depressions being configured to respectively receive an object to be packed, wherein the semitransparent function layer is constituted such that the plastic foil molded part has a first, visually recognizable color upon viewing in incident light and has a second, visually recognizable color upon viewing in transmitted light, and wherein the semitransparent function layer has a multi-layer structure including two semitransparent metallic layers and a dielectric layer arranged between the two semitransparent metallic layers.
2. The plastic foil molded part according to claim 1, wherein the plastic foil molded part is constituted such that in the case of the presence of packaged objects, tablets, and the presence of an opaque cover foil closing the plastic foil molded part, a packaged object removed by the consumer is recognizable in the form of a motif formed by the first, visually recognizable color and the second, visually recognizable color upon viewing the plastic foil molded part from the side opposing the cover foil in transmitted light due to the absence of the opaque cover foil in the region of the removed object.
3. The plastic foil molded part according to claim 1, wherein the two semitransparent metallic layers are formed independently of each other from a metal and the metal is respectively chosen from the group consisting of Al, Ag, Ni, Cr, Cu, Au and an alloy of one or several of the hereinabove mentioned elements and the dielectric layer is an SiO.sub.2 layer, a ZnO layer, an Al.sub.2O.sub.3 layer, a TiO.sub.2 layer, a layer made of a nitride or oxynitride of one of the elements Si, Zn, Al or Ti, or an MgF.sub.2 layer, or a nitrocellulose layer obtainable.
4. The plastic foil molded part according to claim 3, wherein the two semitransparent metallic layers are chosen from Al or Ag and the dielectric layer is an SiO.sub.2 layer.
5. The plastic foil molded part according to claim 1, wherein the plastic foil molded part appears golden upon viewing in incident light and has a blue color tone upon viewing in transmitted light.
6. The plastic foil molded part according to claim 1, wherein the semitransparent function layer is obtainable by printing technology by means of an effect pigment composition.
7. A blister or blister packaging comprising a plastic foil molded part according to claim 1 and an opaque cover foil, wherein the plastic foil molded part defines the front side of the blister and the cover foil defines the back side of the blister.
8. The blister or blister packaging according to claim 7, wherein the cover foil is opaque and the blister is constituted such that the region of a packaged object, removed from the blister by the consumer, is recognizable in the form of a motif formed by the first, visually recognizable color and the second, visually recognizable color upon viewing the front side of the blister in transmitted light as a result of the part of the opaque cover foil no longer being present in this region.
9. The blister or blister packaging according to claim 7, wherein the blister is a blister for pharmaceutical products, a tablet packaging, or a tablet blister.
10. A method for manufacturing a plastic foil molded part according to claim 1, comprising: a) supplying a transparent carrier substrate; b) forming the transparent carrier substrate, by means of thermoforming; and c) providing the formed transparent carrier substrate with a semitransparent function layer.
11. The method according to claim 10, wherein in step c) the semitransparent function layer is applied by means of vapor deposition or by printing technology.
12. The method according to claim 10, wherein step c) is effected such that c1) a separate transparent carrier substrate which has a semitransparent function layer is supplied; and c2) the separate transparent carrier substrate having the semitransparent function layer is applied onto the formed transparent carrier substrate by means of HPF (high-pressure forming method) or by means of an adhesive layer.
13. A method for manufacturing a plastic foil molded part according to claim 1, comprising: a) supplying a transparent carrier substrate; or in the case that the transparent carrier substrate is based on a multi-layer arrangement, the step of supplying at least one layer of the multi-layer arrangement forming the transparent carrier substrate; b) providing of the transparent carrier substrate with a semitransparent function layer; or in the case that the transparent carrier substrate is based on a multi-layer arrangement, the providing of the at least one layer of the multi-layer arrangement forming the transparent carrier substrate with a semitransparent function layer; c) forming the transparent carrier substrate having the semitransparent function layer, obtained after the step b), by means of thermoforming.
14. The method according to claim 13, wherein in step b) the semitransparent function layer is applied by means of vapor deposition or by printing technology.
15. The plastic foil molded part according to claim 1, further comprising a plurality of perforations, cutting grooves, or thinned regions, wherein at least one of said perforations, cutting grooves, or thinned regions is arranged between each of the plurality of cavities or depressions.
16. A plastic foil molded part for a blister comprising a transparent carrier substrate having a semitransparent function layer, wherein the semitransparent function layer is constituted such that the plastic foil molded part has a first, visually recognizable color upon viewing in incident light and has a second, visually recognizable color upon viewing in transmitted light, wherein the transparent carrier substrate of the plastic foil molded part is based on a multi-layer arrangement with at least two layers and the semitransparent function layer is arranged between the two layers, or the transparent carrier substrate of the plastic foil molded part is based on a multi-layer arrangement with at least one interior layer and two cover layers and the semitransparent function layer is arranged between the interior layer and one of the two cover layers, wherein the multi-layer arrangement includes one or more of the following: PVC/PVDC multi-layer arrangement, PVC/PE/PVDC multi-layer arrangement, PVC/poly-chloro-trifluoroethylene multi-layer arrangement, COC/COC multi-layer arrangement, PP/COC/PP multi-layer arrangement, PP/COC/EVOH/PP multi-layer arrangement, PETG/COC/PETG multi-layer arrangement, PVC/COC/PVC multi-layer arrangement, COC coated with PVDC, PETG/PCTFE multi-layer arrangement, PETG/EVOH/PCTFE multi-layer arrangement, PVC/PCTFE multi-layer arrangement, PVC/PE/PCTFE multi-layer arrangement, PVC/PCTFE/PVC multi-layer arrangement, or PVC/EVOH/PCTFE-multi-layer arrangement.
17. The plastic foil molded part according to claim 16, wherein the transparent carrier substrate of the plastic foil molded part is based on a multi-layer arrangement with at least one interior layer and two cover layers and the semitransparent function layer is arranged between the interior layer and one of the two cover layers, wherein the interior layer is a COC layer and the two cover layers respectively are a PP layer.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) There are shown:
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DETAILED DESCRIPTION OF VARIOUS EMBODIMENTS
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First Embodiment Example
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Second Embodiment Example
(10) The second embodiment example is based on the first embodiment example. The plastic foil molded part is based on a thermo-formed plastic foil whose total thickness is 250 micrometers and which has the following structure: polypropylene layer; adhesive layer; semitransparent function layer (20 nm Ag/240 nm SiO.sub.2/20 nm Ag) with gold/blue color change upon viewing in incident light/transmitted light, which is obtainable by means of vapor deposition onto the following COC layer; COC layer with a thickness of 75 micrometers; adhesive layer; polypropylene layer.
Third Embodiment Example
(11) The third embodiment example is based on the first embodiment example. The plastic foil molded part was varied to the effect that the thermo-formed plastic foil has a total thickness of 250 micrometers and the COC core layer of the PP/COC/PP structure has a thickness of 190 micrometers.
Fourth Embodiment Example
(12) The fourth embodiment example is based on the second embodiment example. The plastic foil molded part was varied to the effect that the thermo-formed plastic foil has a total thickness of 250 micrometers and the COC core layer of the PP/COC/PP structure has a thickness of 190 micrometers.
Fifth Embodiment Example
(13) The fifth embodiment example is based on the first embodiment example. The plastic foil molded part was varied to the effect that the thermo-formed plastic foil has a total thickness of 250 micrometers and the COC core layer of the PP/COC/PP structure has a thickness of 125 micrometers.
Sixth Embodiment Example
(14) The sixth embodiment example is based on the second embodiment example. The plastic foil molded part was varied to the effect that the thermo-formed plastic foil has a total thickness of 250 micrometers and the COC core layer of the PP/COC/PP structure has a thickness of 125 micrometers.
Seventh Embodiment Example
(15) The seventh embodiment example is based on the first embodiment example. The plastic foil molded part is based on a thermo-formed plastic foil which has the following structure: polypropylene layer with a thickness of 250 micrometers; semitransparent function layer (20 nm Ag/240 nm SiO.sub.2/20 nm Ag) with gold/blue color change upon viewing in incident light/transmitted light, which is obtainable by means of vapor deposition onto the preceding polypropylene layer; optionally present polymeric thermal protection layer which is chosen, e.g., from the group consisting of COC, COP, polypropylene, polyamide and polyethylene terephthalate.
Eighth Embodiment Example
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Ninth Embodiment Example
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(24) The interply 21 is based on a transparent carrier substrate, namely on a polyethylene terephthalate foil which is provided with a semitransparent function layer (20 nm Ag/240 nm SiO.sub.2/20 nm Ag) with gold/blue color change upon viewing in incident light/transmitted light. The semitransparent function layer is obtainable by means of vapor deposition onto the polyethylene terephthalate foil. The interply 21 has recesses which are congruent with the cavities of the plastic foil molded part 20. The interply 21 is bonded by means of (heat seal) adhesive layers to the plastic foil molded part 20, on the one hand, and to the cover foil 22, on the other hand.
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