Heat transfer plate

Abstract

The invention relates to a method for producing an assembly (1), in particular a power electronics unit, comprising the following steps: providing a component (2) to be cooled having a first surface (4), providing a cooling device (3) having a second surface (5) opposite the first surface (4), arranging a 3-dimensional heat transfer plate (6) between the two surfaces (4, 5), wherein the heat transfer plate (6) extends in a plate plane (11) parallel to the two surfaces (4, 5) and in the initial state a plurality of contact extensions (9) which extend outwards with respect to said plate plane (11), and bracing the component (2) and the cooling device (3) relative to one another, such that the contact extensions (9) are deformed in the direction of the metal sheet.

Claims

1. A method for producing an assembly (1), comprising the following steps: providing a component (2) that is to be cooled and has a first surface (4), providing a cooling device (3) having a second surface (5) that lies opposite the first surface (4), forming a 3-dimensional, one-piece heat transfer plate (6) that extends in a plate plane (11) and that has, in an initial state, a plurality of contact protrusions (9) that extend out of the plate plane (11), wherein the heat transfer plate (6) comprises a multiplicity of apertures (10), wherein edges of the apertures (10) form the contact protrusions (9), and wherein the apertures are x-shaped or star-shaped, arranging the 3-dimensional heat transfer plate (6) between the first and second surfaces (4, 5) so that the plate plane (11) is in parallel with the first and second surfaces (4, 5), bracing the component (2) and the cooling device (3) with respect to one another, as a consequence of which the contact protrusions (9) are deformed in the direction of the plate plane, and fastening a contact pressure spring (7) to the cooling device (3), such that the component (2) to be cooled is positioned between the contact pressure spring (7) and the heat transfer plate (6).

2. The method as claimed in claim 1, wherein the assembly (1) is an electronic power unit.

3. The method as claimed in claim 1, characterized in that the contact protrusions (9) are produced by deforming the heat transfer plate (6).

4. The method as claimed in claim 1, characterized in that the apertures (10) are produced by deformation.

5. The method as claimed in claim 3, characterized in that the contact protrusions (9) are re-shaped elevations.

6. The method as claimed in claim 1, characterized in that the apertures (10) are x-shaped.

7. The method as claimed in claim 1, characterized in that the apertures (10) are star-shaped.

8. The method of claim 1, wherein the component (2) to be cooled is a first component to be cooled and the heat transfer plate (6) is a first heat transfer plate, wherein the method further includes providing a second component (2) to be cooled and a second heat transfer plate (6), wherein the contact pressure spring (7) is fixed to the cooling device (3) such that the second component (2) to be cooled is positioned between the contact pressure spring (7) and the second heat transfer plate (6).

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Exemplary embodiments of the invention are described in detail hereinunder with reference to the accompany drawing, in which:

(2) FIG. 1 illustrates a method in accordance with the invention for producing an assembly in accordance with the invention for all exemplary embodiments,

(3) FIGS. 2 and 3 illustrate a heat transfer plate in accordance with the invention according to a first exemplary embodiment,

(4) FIG. 4 illustrates a heat transfer plate in accordance with the invention according to a second exemplary embodiment, and

(5) FIG. 5 illustrates a heat transfer plate in accordance with the invention according to a third exemplary embodiment.

DETAILED DESCRIPTION

(6) FIG. 1 illustrates hereinunder a method in accordance with the invention and also an assembly 1 in accordance with the invention for all exemplary embodiments. FIGS. 2 to 5 illustrate heat transfer plates 6 of different exemplary embodiments. Like components or like-functioning components are provided in all exemplary embodiments with identical reference numerals.

(7) FIG. 1 illustrates the assembly 1 in an exploded view and an assembled view. The assembly 1 comprises components 2 that are to be cooled, a cooling device 3 and also a contact pressure spring 7 for fastening the components 2 that are to be cooled to the cooling device 3.

(8) The components 2 that are to be cooled can also be described as power modules. These power modules are by way of example invertors for hybrid vehicles or electric vehicles, for photovoltaic installations or for wind power installations or converters.

(9) The cooling device 3 is embodied by way of example from aluminum and comprises advantageous ducts in which cooling water flows.

(10) In accordance with the illustration in FIG. 1, the respective component 2 that is to be cooled comprises a first surface 4 that faces the cooling device 3. A second surface 5 that lies opposite the first surface 4 is defined on the cooling device 3. One heat transfer plate 6 per component 2 is arranged between these two surfaces 4, 5. As is still to be described in detail, the heat transfer plates 6 comprise a 3-dimensional structure. During the procedure of assembling the assembly 1, the components 2 that are to be cooled are braced with respect to the cooling device 3 by means of the contact pressure spring 7. For this purpose, the contact pressure spring 7 is fastened to the cooling device 3 by means of screws 8 (or rivets).

(11) As the components 2 are braced with respect to the cooling device 3, the 3-dimensional heat transfer plates 6 are deformed to the greatest extent possible and this renders it possible on the one hand to compensate for evenness tolerances between the two surfaces 4, 5 and also to produce a greatest possible contact surface for the transfer of heat. It is provided in particular that heat conducting pastes, heat conducting sheets inter alia are omitted between the two surfaces 4, 5.

(12) FIG. 2 illustrates a detail of the heat transfer plate 6 according to the first exemplary embodiment. The components 2 are by way of example 50 mm50 mm in size. Accordingly, the heat transfer plate 6 comprises also approximately a width B of 50 mm and a length L of 50 mm. The width B and the length L of the heat transfer plate 6 define the so-called plate plane 11. A multiplicity of contact protrusions 9, as are evident in FIG. 3, extend from the plate plane 11.

(13) In the first exemplary embodiment, the contact protrusions 9 are formed by means of stamping an originally 2-dimensional plate. In so doing, star-shaped apertures 10 are stamped. The deformed edges of these apertures 10 form the contact protrusions 9. As a result of the star shape of the apertures 10, four triangular contact protrusions 9 are produced per aperture 10.

(14) As an alternative to the illustrated exemplary embodiment, it is also possible to stamp in both directions so that the contact protrusions 9 would be elevated in both directions, by way of example in an alternating manner.

(15) In lieu of the illustrated star-shaped apertures 10, it is also provided to stamp in this case any other random shape.

(16) FIG. 3 illustrates how a height H is defined. The contact protrusions 9 are elevated to this height H. Moreover, FIG. 3 illustrates the plate thickness S of the originally 2-dimensional plate.

(17) The stamped apertures 10 comprise in each case approximately a size of 10 S. By way of example in the case of a plate thickness S of 0.1 mm, the apertures 10 extend in each case on to an area of a square millimeter. By virtue of a smallest possible spacing between the apertures 10, it is possible to form as many contact protrusions 9 as possible in the smallest space.

(18) FIG. 4 illustrates a section through the heat transfer plate 6 according to the second exemplary embodiment. In the second exemplary embodiment, the contact protrusions 9 are not formed in the plate by means of holes that have been stamped through but rather are formed by means of deformed elevations.

(19) FIG. 5 illustrates the heat transfer plate 6 according to the third exemplary embodiment. In the third exemplary embodiment, the plate is curved in the shape of waves so that the contact protrusions 9 are formed by means of the wave hills and valleys.

(20) The three exemplary embodiments illustrate only three examples of the geometric shape of the 3-dimensional heat transfer plate 6. However, the invention includes the most different geometric shapes of these heat transfer plates 6. In each case, it is crucial that the contact protrusions 9 extend out of the plate plane 11 and comprise corresponding material characteristics so as during the procedure of assembling the assembly said contact protrusions are correspondingly deformed between the two surfaces 4, 5.