NERVE STIMULATOR AND MANUFACTURING METHOD THEREOF

Abstract

A nerve stimulator and a manufacturing method thereof. The nerve stimulator includes a glass substrate, and a plurality of metal pins provided on the substrate, wherein the metal pins form stimulation portions on one side of the substrate, and the density of the metal pins is greater than 15 Pin/mm.sup.2. The stimulation portions in the present nerve stimulator have a high density and a good stimulation effect. The processing method thereof is to cut out a high-density metal pin array first by using a metal underlayer, then the manufacturing method overcomes the deficiency in the prior art that it is rather difficult to manufacture a high density of nerve stimulation electrodes by using other substrates such as ceramics and the like.

Claims

1. A nerve stimulator, comprising a substrate, a plurality of metal pins provided on the substrate, the metal pins form stimulation portions on one side of the substrate, the substrate is made of a glass material, and a pad structure made of a metal material further provided on the glass substrate.

2. The nerve stimulator according to claim 1, wherein a density of the metal pins is greater than 15 Pin/mm.sup.2.

3. The nerve stimulator according to claim 1, wherein a height of the stimulation portions is 1 m to 100 m.

4. The nerve stimulator according to claim 1, wherein the stimulation portion has a shape of an elongated pyramid.

5. The nerve stimulator according to claim 1, wherein the pad structure is provided on the substrate on the side opposite to the stimulation portions.

6. The nerve stimulator according to claim 1, wherein a processing chip is connected onto the substrate, and the processing chip and the substrate are connected through flip-chip bonding.

7. A method for manufacturing a nerve stimulator, comprising the following steps: S1: providing a metal underlayer, and cutting out a plurality of metal pins on the metal underlayer; S2: performing glass filling between the metal pins cut out on the metal underlayer, so that the cut-out metal pins are completely covered with glass; S3: performing double-sided thinning on the metal underlayer subjected to the glass filling, wherein the glass covering layer on the cutting side of the metal underlayer is thinned until the metal pins are exposed, and the metal underlayer on the other side of the metal underlayer is thinned and removed until all exposed to the glass substrate side; and S4: processing one side of the product obtained by the above step, so that the metal pins in the glass substrate form stimulation portions on the glass plane, and stimulation electrodes with the glass substrate are integrally formed.

8. The method for manufacturing the nerve stimulator according to claim 7, wherein the cutting manner in the step S1 is laser cutting or mechanical cutting.

9. The method for manufacturing the nerve stimulator according to claim 7, wherein the metal pins cut out in the step S1 are arranged in an array.

10. The method for manufacturing the nerve stimulator according to claim 7, wherein a pad structure for wiring is also cut out in the step S1.

11. The method for manufacturing the nerve stimulator according to claim 7, wherein the metal underlayer in the step S1 is made of a metal material with biocompatibility, such as titanium, platinum, iridium, tantalum, gold or an alloy thereof.

12. The method for manufacturing the nerve stimulator according to claim 7, wherein a thermal expansion coefficient of the filling glass matches a thermal expansion coefficient of the metal underlayer.

13. The method for manufacturing the nerve stimulator according to claim 7, wherein a thickness of the metal underlayer is between 0.3 mm and 1.5 mm, a depth of the cut-out metal pin is 200 m to 1000 m, and a diameter or a side length of the cut-out metal pin is 50 m to 150 m.

14. The method for manufacturing the nerve stimulator according to claim 7, wherein the specific method for performing glass filling between metal pins in the step S2 is as follows: A. selecting a glass substrate, and heating the glass substrate until the material thereof is softened; B. squeezing and embedding the metal pin side of the metal underlayer from which a plurality of metal pins is cut out into the softened glass substrate, so that the metal pins are completely wrapped by the glass substrate; and C. cooling and molding.

15. The method for manufacturing the nerve stimulator according to claim 7, wherein the specific method for performing glass filling between metal pins in the step S2 is as follows: A. heating glass into a melt in a molten state; B. pouring the molten glass on the metal pin side of the metal underlayer, so that the liquid glass completely covers the metal pins; and C. cooling and molding.

16. The method for manufacturing the nerve stimulator according to claim 7, wherein the specific method for performing glass filling between metal pins in the step S2 is as follows: A. filling the side of the metal underlayer on which metal pins are cut out with glass powder; B. heating the metal underlayer and the glass powder on the metal underlayer, so that the glass powder is in a molten state and forms a molten glass layer on the metal underlayer; and C. cooling and molding.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0037] FIG. 1 is a side view of the nerve stimulator in the present invention;

[0038] FIG. 2 is a plan view of the nerve stimulator in the present invention;

[0039] FIG. 3 is a flowchart of the method for manufacturing a nerve stimulator in the present invention;

[0040] FIG. 4 is a flowchart of the method for manufacturing a nerve stimulator in the present invention.

[0041] Wherein 1 is a glass substrate, 2 is a metal pin, 3 is a stimulation portion, 4 is a pad structure, and 5 is a processing chip.

DETAILED DESCRIPTION

[0042] For the purposes of promoting an understanding of the present invention, the principle of the present invention will now be further described with reference to the attached drawings.

[0043] The present invention firstly shows a nerve stimulator, which comprises a substrate a wherein the substrate is made of a glass material, and a plurality of metal pins provided on the substrate, wherein stimulation portions are formed on one side of the metal pins, and those stimulation portions are used for stimulating human tissues.

[0044] A pad structure made of a metal material is further provided on the glass substrate, and is generally used for connecting with a chip to control the stimulation electrodes. When the nerve stimulator is used, since the pad structure needs to be in signal connection with the outside, the pad structure is generally provided on the substrate on the side opposite to the stimulation portions, which can avoid interference with the stimulation portions during wiring or packaging, and also prevent the signal connection joint from being in long-term contact with the body fluid, thereby improving the reliability thereof.

[0045] In general, the density of micro-electrodes of a nerve stimulator manufactured by using a ceramic substrate hardly exceeds 5 Pin/mm.sup.2, while in the present invention, in order to make the stimulation effect better, the density of the cut-out metal pins is greater than 15 Pin/mm.sup.2.

[0046] The stimulation portions formed by the metal pins protruding from the glass substrate are generally distributed in an array, and the shape of the array may be changed according to actual needs. The height of the stimulation portion is 1 to 100 and the stimulation portion generally has the shape of an elongated pyramid.

[0047] As another aspect of the present invention, a method for manufacturing a nerve stimulator is also claimed, by which the above nerve stimulator having a high density of stimulation electrodes can be manufactured. The specific method is described as follows.

[0048] A method for manufacturing a nerve stimulator, comprising the following steps:

[0049] Step 1: providing a metal underlayer, and cutting out a plurality of metal pins on the metal underlayer,

[0050] wherein this cutting manner may be laser cutting or mechanical cutting, the cut-out metal pins are arranged in an array, and generally a pad structure is also cut out during the cutting;

[0051] Step 2: performing glass filling between the cut-out metal pins, wherein the glass is filled on the metal pins, so that the cut-out metal pins are completely covered with glass;

[0052] Step 3: after the filled glass layer is cooled and molded, performing double-sided thinning on the metal underlayer that has been subjected to glass filling, wherein the glass covering layer on the cutting side of the metal underlayer is thinned until the metal pins are exposed, and the metal underlayer on the other side of the metal underlayer is thinned and removed, until a glass substrate side formed by pouring is completely exposed, in which way, the metal layer can be completely removed, leaving a nerve stimulator with a glass substrate and a plurality of stimulation electrodes integrally formed thereon; and

[0053] Step 4: after the above steps are completed, further processing one side of the product obtained by the above step, that is, removing the glass substrate around the metal pins on one side by cutting, so that the metal pins in the glass substrate protrude out of the glass plane to form stimulation portions, and stimulation electrodes with the glass substrate are integrally formed.

[0054] In the above step 2, there may be three examples below for the specific method of conducting molten glass pouring.

Example 1

[0055] Step 1: selecting a glass substrate, and heating it until the material thereof is softened;

[0056] Step 2: squeezing and embedding the metal pin side of the metal underlayer from which a plurality of metal pins is cut out into the softened glass substrate, so that the metal pins are completely wrapped by the glass substrate; and

[0057] Step 3: cooling and molding.

Example 2

[0058] Step 1: heating glass into a melt in a molten state;

[0059] Step 2: pouring the molten glass on the metal pin side of the metal underlayer, so that the liquid glass completely covers the metal pins; and

[0060] Step 3: cooling and molding.

Example 3

[0061] Step 1: filling the side of the metal underlayer on which metal pins are cut out with glass powder;

[0062] Step 2: heating the metal underlayer and the glass powder thereon, so that the glass powder is deposited in a molten state on the metal underlayer and forms a molten glass layer; and

[0063] Step 3: cooling and molding.

[0064] After the above steps, it is generally necessary to further heat and squeeze the glass to reduce the gap between the glass and the metal pins.

[0065] Since the nerve stimulator needs to be implanted into a body, there are strict requirements for biocompatibility of the materials used in the nerve stimulator, and thus the metal underlayer processed to form the metal pins and the pad structure is generally made of a metal material with biocompatibility, such as titanium, platinum, iridium, tantalum, gold or an alloy thereof.

[0066] The thickness of the metal underlayer is generally between 0.3 mm and 1.5 mm, so that a proper length of the cut-out metal pin can be guaranteed, and meanwhile, the processing efficiency in the subsequent process of double-sided thinning would not be reduced, due to a too thick metal layer. Furthermore, in order to guarantee a proper thickness of the glass substrate and a proper stimulation length of the stimulation portion, the depth of the cut-out metal pin is generally 200 m to 1000 m, the diameter or the side length of the cut-out metal pin is 50 m to 150 m, and the specific numerical values thereof may vary according to actual needs.

[0067] In the subsequent operation process, since signal connection needs to be established on the nerve stimulator or the nerve stimulator needs to be bonded with a chip, the substrate needs to be heated. In order to avoid a gap formed between the glass substrate and the metal pins due to heating, the thermal expansion coefficient of the molten and poured glass needs to match the thermal expansion coefficient of the metal underlayer.

[0068] The above Examples are merely preferred examples of the present invention and are not intended to limit the present invention. It should be noted that any modifications, equivalent substitutions, or improvements made without departing from the spirit and principles of the present invention shall be included in the protection scope of the present invention.