SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPOUND SN/SB

Abstract

A semiconductor device and method is disclosed. In one embodiment, the semiconductor device comprises a semiconductor die comprising a first surface and a second surface opposite to the first surface, a first metallization layer disposed on the first surface of the semiconductor die, a first solder layer disposed on the first metallization layer, wherein the first solder layer contains the compound Sn/Sb, and a first contact member comprising a Cu-based base body and a Ni-based layer disposed on a main surface of the Cu-based base body, wherein the first contact member is connected with the Ni-based layer to the first solder layer.

Claims

1. A semiconductor device, comprising: a semiconductor die comprising a first surface and a second surface opposite to the first surface; a first metallization layer disposed on the first surface of the semiconductor die; a first solder layer disposed on the first metallization layer, wherein the first solder layer contains the compound Sn/Sb; and a first contact member comprising a Cu-based base body and a Ni-based layer disposed on a main surface of the Cu-based base body; wherein the first contact member is connected with the Ni-based layer to the first solder layer.

2. The semiconductor device according to claim 1, wherein the solder layer further comprises an Ni/Sb phase.

3. The semiconductor device according to claim 1, wherein the compound Sn/Sb of the solder layer is Pb free.

4. The semiconductor device according to claim 1, wherein the material composition of the compound Sn/Sb is such that the ratio of Sb in the compound is in a range from 17% to 90%.

5. The semiconductor device according to claim 4, wherein besides the ratio of Sb, the material composition is comprised of Sn or Sn with other materials, wherein Sn is predominant.

6. The semiconductor device according to claim 5, wherein the other materials comprise one or more Ag, Au, Pt, Cu, Ni, and Pd.

7. The semiconductor device according to claim 1, wherein the material composition of the compound Sn/Sb is such that the melting point of the compound Sn/Sb is higher than 270 C.

8. The semiconductor device according to claim 1, wherein a thickness of the Ni-based layer is in a range from 100 nm to 7 m.

9. The semiconductor device according to claim 1, wherein the contact member is comprised of a leadframe or a clip.

10. The semiconductor device according to claim 1, wherein a thickness of the contact member is in a range from 100 m to 5 mm.

11. The semiconductor device according to claim 1, wherein the first metallization layer comprises a stack of two or more layers.

12. The semiconductor device according to claim 1, wherein the semiconductor die is one or more of a power die, a transistor die, a power transistor die, a vertical transistor die, an IGBT die, or a diode die.

13. The semiconductor device according to claim 1, further comprising: a second metallization layer disposed on the second surface of the semiconductor die; a second solder layer disposed on the second metallization layer, the second solder layer containing a compound Sn/Sb; and a second contact member comprising a Cu-based base body and a Ni-based layer disposed on a main surface of the Cu-based base body; wherein the second contact member is connected with the Ni-based layer to the second solder layer.

14. The semiconductor device according to claim 13, wherein the second contact member is one or more of a clip, a direct bonded copper, an active metal braze, or a heat spreader.

15. The semiconductor device according to claim 13, wherein the first contact member is a leadframe and the second contact member is a clip.

16. A semiconductor device, comprising: a semiconductor chip comprising a first main surface and a second main surface opposite to the first main surface; a first contact member comprising a Cu-based base body and a Ni-based layer disposed on a main surface of the Cu-based base body; and a solder compound containing the compound Sn/Sb and being disposed between the semiconductor chip and the Ni-based layer.

17. An electronic device, comprising: an electronic component comprising a base body and a first metallization layer disposed on a main surface of the base body; a first solder layer disposed on the first metallization layer, the first solder layer containing an Ni/Sb phase; and a first contact member comprising a Cu-based base body and a Ni-based layer disposed on a main surface of the Cu-based base body; wherein the first contact member is connected with the Ni-based to the first solder layer.

18. A method for fabricating a semiconductor device, the method comprising: providing a contact member comprising a Cu-based base body and a Ni-based layer disposed on a main surface of the Cu-based base body; providing a semiconductor die comprising a first surface and a second surface opposite to the first surface and a metallization layer disposed on the first surface of the semiconductor die; applying a solder material on one or more of the metallization layer of the semiconductor die or the Ni-based layer of the contact member, the solder material being based on a compound Sn/Sb; and arranging the semiconductor die onto the contact member so that the soldering material is disposed between them; and performing a solder process and thereby transforming the solder material into a solder layer and connecting the contact member with the semiconductor die.

19. The method according to claim 18, wherein performing the reflow process comprises generating a Ni/Sb phase.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings are included to provide a further understanding of aspects and are incorporated in and constitute a part of this specification. The drawings illustrate aspects and together with the description serve to explain principles of aspects. Other aspects and many of the intended advantages of aspects will be readily appreciated as they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference signs may designate corresponding similar parts.

[0032] FIG. 1 shows a schematic cross-section of an example of a semiconductor device according to one or more of the first to third aspects, the semiconductor device being connected with one of its main surfaces to a contact element via a solder layer containing the compound Sn/Sb.

[0033] FIG. 2 shows a schematic cross-section of an example of a semiconductor device according to one or more of the first to third aspects, the semiconductor device being connected with a first one of its main surfaces to a leadframe element via a solder layer containing the compound Sn/Sb, and with a second one of its main surfaces to a clip via a solder layer containing the compound Sn/Sb.

[0034] FIG. 3 shows an example of a flow diagram of a method for fabricating a semiconductor device according to the forth aspect, the method comprising in particular the disposing of solder material on a semiconductor die, the solder material being based on the compound Sn/Sb.

[0035] FIG. 4 comprises FIG. 4A to 4F show schematic cross-sectional representations of intermediate products and an end product to illustrate an example of a method of fabricating a semiconductor device according to the forth aspect, wherein the method shows the fabrication of a semiconductor device as shown in FIG. 2.

[0036] FIG. 5 shows an example of a liquid phase projection of a ternary alloy phase diagram of Sn, Sb, and Ni.

[0037] FIG. 6 comprises FIGS. 6A and 6B and shows an SEM-EDX measurement in real (A) and in a schematic representation (B), the measurement illustrating the formation of the intermetallic Ni/Sb phase in the solder layer.

DETAILED DESCRIPTION OF THE DRAWINGS

[0038] In the following detailed description, reference is made to the accompanying drawings, in which are shown by way of illustration specific aspects in which the disclosure may be practiced. In this regard, directional terminology, such as top, bottom, front, back, etc. may be used with reference to the orientation of the figures being described. Since components of described devices may be positioned in a number of different orientations, the directional terminology may be used for purposes of illustration and is in no way limiting. Other aspects may be utilized and structural or logical changes may be made without departing from the concept of the present disclosure. Hence, the following detailed description is not to be taken in a limiting sense, and the concept of the present disclosure is defined by the appended claims.

[0039] FIG. 1 shows an example of a semiconductor device according to one or more of the first to third aspects. The semiconductor device 10 of FIG. 1 comprises a semiconductor die 1 comprising a first lower main surface and a second upper main surface opposite to the first surface. The semiconductor device 10 comprises a metallization layer 2 which is disposed on the first surface of the semiconductor die 1. The metallization layer 2 may be connected with an electronic device or circuitry disposed in the semiconductor die and may comprise one or more metallic layers.

[0040] The semiconductor device 10 of FIG. 1 further comprises a solder layer 3 disposed on the metallization layer 2, wherein the solder layer 3 contains the compound Sn/Sb. The solder layer 3 may further contain an Ni/Sb phase and possibly further phases, in particular Ni/Sn phases, wherein the Ni/Sb is dominant.

[0041] The semiconductor device 10 of FIG. 1 further comprises a contact member 4 comprising a Cu-based base body 4a and a Ni-based layer 4b disposed on a main surface of the Cu-based base body 4a, wherein the contact member 4 is connected with the Ni-based layer 4b to the solder layer 3.

[0042] FIG. 2 shows an example of a semiconductor device according to one or more of the first to third aspects. The semiconductor device 20 of FIG. 2 comprises a semiconductor die 11 comprising a first surface and a second surface opposite to the first surface and a first metallization layer 12 disposed on the first surface of the semiconductor die 11, and a second metallization layer 22 disposed on the second surface of the semiconductor die 11. The semiconductor device 20 furthermore comprises a first solder layer 13 disposed on the first metallization layer 12, and a second solder layer 23 disposed on the second metallization layer 22, wherein both the first and second solder layer 13 and 23 contain a compound Sn/Sb. The semiconductor device 20 furthermore comprises a first contact member 4 comprising a Cu-based base body 4a and a Ni-based layer 4b disposed on a main surface of the Cu-based base body 4a, wherein the first contact member 4 is connected with the Ni-based layer 4b to the first solder layer 3. The semiconductor device 20 furthermore comprises a second contact member 24 comprising a Cu-based base body 24a and a Ni-based layer 24b disposed on a main surface of the Cu-based base body 24a, wherein the second contact member 24 is connected with the Ni-based layer 24b to the second solder layer 23.

[0043] FIG. 3 shows a flow diagram for illustrating a method for fabricating a semiconductor device according to the forth aspect of the present disclosure.

[0044] As shown in FIG. 3, the method 30 comprises providing a contact member comprising a Cu-based base body and a Ni-based layer disposed on a main surface of the Cu-based base body (31), providing a semiconductor die comprising a first surface and a second surface opposite to the first surface and a metallization layer disposed on the first surface of the semiconductor die (32), applying a solder material on one or more of the metallization layer of the semiconductor die or the Ni-based layer of the contact member, the solder material being based on a compound Sn/Sb (33), arranging the semiconductor die onto the contact member so that the soldering material is disposed between them (34), and performing a solder process, in particular a reflow process, and thereby transforming the solder material into a solder layer and connecting the contact member with the semiconductor die (35).

[0045] As indicated above, it is possible to apply the solder material onto one or both of the semiconductor die and the contact member. The solder material can be applied in the form of a solder paste by dispensing or printing.

[0046] After placement of the semiconductor die onto the contact member, the reflow process may be performed by heating the stack in a reflow or box oven with a specific temperature profile which fits to the mentioned materials and thicknesses. Afterwards the standard production flow is followed.

[0047] FIG. 4 comprises FIG. 4A to 4F and shows cross-sectional representations of intermediate products for illustrating an exemplary method for fabricating a semiconductor according to a forth aspect.

[0048] As shown FIG. 4A, a leadframe 44 is provided, the leadframe 44 comprising a Cu-based base body 44A and a Ni-based layer 44B disposed on a main surface of the base body 44A. The Cu-based base body 44A might be comprised of pure Cu, or an alloy of Cu and another metal, and it may also comprise some dopings.

[0049] As shown FIG. 4B, a semiconductor chip 41 is provided comprising a semiconductor die 41A, a first metallization layer 41B disposed on a first main surface of the semiconductor die 41A, and a second metallization layer 41C disposed on a second main surface of the semiconductor die 41A. The semiconductor die 41A may comprise one or more of a power die, a transistor die, a power transistor die, a vertical transistor die, an IGBT die, a diode die, or any other die which comprises a vertical structure and comprises contact pads on both opposing main surfaces.

[0050] As shown FIG. 4C, a first solder material 43 is applied onto the first metallization layer 41B of the semiconductor die 41A by dispensing or printing.

[0051] As shown FIG. 4D, the semiconductor chip 41 is placed onto the leadframe 44, i.e. onto the Ni based layer 44B of the leadframe 44 so that the first solder material 43 is disposed between them.

[0052] As shown FIG. 4E, a second solder material 46 is applied onto the semiconductor chip 41, i.e. onto the second metallization layer 41C. The second solder material 46 can be dispensed or printed onto the upper surface of the equal or different to the first solder material 43.

[0053] As shown FIG. 4F, a Cu based clip 47 is placed onto the second solder material 46. The clip 47 might be comprised of pure Cu, or an alloy of Cu and another metal, and it may also comprise some dopings.

[0054] Thereafter a reflow process is performed by heating the stack in a reflow or box oven with a specific temperature profile fitting to the solder materials and their thicknesses. Thereby the solder materials are transformed into respective solder layers and the semiconductor chip 41 is connected to the leadframe 44 and the clip 47.

[0055] FIG. 5 shows an example of a liquid phase projection diagram of a ternary alloy phase of Sn, Sb, and Ni.

[0056] It can be seen in the diagram that without the Sb the Sn would at least partially form a Ni.sub.3Sn.sub.4 phase in contact with the Ni, which phase is known to be rather brittle. The Sb content avoids the formation of this brittle phase. As can be derived from the diagram, a minimum amount of Sb is required to force the formation of the hexagonal Ni/Sb-phase instead of the monoclinic Ni.sub.3Sn.sub.4 phase. From experimental evidence, it is found that the Sb has to exceed a certain amount, as has already been stated above. The intersection line can also be seen in the ternary alloy phase diagram, but as this was calculated for the equilibrium state and the soldering process is usually in a non-equilibrium state, the required amount of Sb in a solder material is higher than can be derived from thermodynamic calculations.

[0057] The details of the diagram of FIG. 5 are as follows.

[0058] From a minimum temperature T(min)=673 K to a maximum temperature T(max)=2561.7 K one can recognize the following four-phase intersection points with the liquid:

1: Ni3Sn2_solid(s)/Ni3Sn_solid(s)/NiSb_solid(s)

2: FCC_Al/Ni3Sn_solid(s)/NiSb_solid(s)

3: Ni3Sn2_solid(s)/Ni3Sn4_solid(s)/Sn|1(liq)

4: Ni3Sn2_solid(s)/Ni3Sn4_solid(s)/NiSb_solid(s)

Wherein

A=Sn, B=Ni, C=Sb

[0059] and

TABLE-US-00001 X(A) X(B) X(C) K 1: 0.36452 0.58003 0.05545 1933.13 2: 0.01766 0.97116 0.0119 1703.77 3: 0.98099 0.01260 0.00642 1258.32 4: 0.95337 0.01172 0.03491 1245.56

[0060] FIG. 6 shows an SEM-EDX measurement which illustrates the formation of the intermetallic Ni/Sb phase in the solder layer.

[0061] As can further be seen, none of the brittle Ni.sub.3Sn.sub.4 phase is formed even in direct vicinity of the Ni layers in accordance with the alloy phase diagram.

[0062] Although the disclosure has been shown and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art based at least in part upon a reading and understanding of this specification and the annexed drawings. The disclosure includes all such modifications and alterations and is limited only by the concept of the following claims. In particular regard to the various functions performed by the above described components (e.g., elements, resources, etc.), the terms used to describe such components are intended to correspond, unless otherwise indicated, to any component which performs the specified function of the described component (e.g., that is functionally equivalent), even though not structurally equivalent to the disclosed structure which performs the function in the herein illustrated exemplary implementations of the disclosure. In addition, while a particular feature of the disclosure may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application.