METHOD OF MANUFACTURING A FIN STRUCTURE FOR HEAT EXCHANGER
20200094324 ยท 2020-03-26
Assignee
Inventors
- Dattu G.V. Jonnalagadda (Bengaluru, IN)
- Srinivasan Swaminathan (Bengaluru, IN)
- Yanzhe Yang (Beavercreek, OH, US)
- Ramana Reddy Kollam (Bengaluru, IN)
- Merin Sebastian (Bengaluru, IN)
- Emily Phelps (Dayton, OH, US)
Cpc classification
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
F28F21/081
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B33Y70/00
PERFORMING OPERATIONS; TRANSPORTING
H01L23/36
ELECTRICITY
F28F21/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F1/16
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B22F2998/10
PERFORMING OPERATIONS; TRANSPORTING
B33Y80/00
PERFORMING OPERATIONS; TRANSPORTING
B22F3/24
PERFORMING OPERATIONS; TRANSPORTING
B22F2003/247
PERFORMING OPERATIONS; TRANSPORTING
F28F3/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F21/08
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F28F21/084
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B22F5/10
PERFORMING OPERATIONS; TRANSPORTING
F28F3/048
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B22F2998/10
PERFORMING OPERATIONS; TRANSPORTING
B33Y40/00
PERFORMING OPERATIONS; TRANSPORTING
F28F1/022
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B22F10/50
PERFORMING OPERATIONS; TRANSPORTING
Y02P10/25
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
International classification
B22F3/24
PERFORMING OPERATIONS; TRANSPORTING
B33Y80/00
PERFORMING OPERATIONS; TRANSPORTING
B22F3/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y40/00
PERFORMING OPERATIONS; TRANSPORTING
B33Y70/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
The present disclosure discloses a method of manufacturing a structure with a wall, comprising manufacturing a structure with a wall by using additive manufacturing technology, and dissolving a surface of the wall for reducing thickness of the wall.
Claims
1. A method of manufacturing a structure with a wall, comprising: manufacturing a structure with a wall by using additive manufacturing technology; and dissolving a surface of the wall for reducing thickness of the wall comprising conducting an etching process on the wall and baking the wall.
2. The method of manufacturing a structure with a wall of claim 1, wherein the structure is made of aluminum alloy.
3. (canceled)
4. (canceled)
5. The method of manufacturing a structure with a wall of claim 1, wherein dissolving a surface of the wall for reducing the thickness of the wall further comprises neutralizing the surface of the wall with acid.
6. The method of manufacturing a structure with a wall of claim 1, wherein dissolving a surface of the wall for reducing the thickness of the wall comprises conducting a corrosion process on the wall.
7. The method of manufacturing a structure with a wall of claim 1, wherein dissolving a surface of the wall for reducing the thickness of the wall comprises conducting an electropolishing process on the wall.
8. A method of manufacturing a fin structure with a wall, comprising: manufacturing a fin structure with a wall by using additive manufacturing technology; and dissolving a surface of the wall of the fin structure for reducing thickness of the wall comprising conducting an etching process on the wall and baking the wall.
9. The method of manufacturing a fin structure with a wall of claim 8, wherein the fin structure is made of aluminum alloy.
10. (canceled)
11. (canceled)
12. The method of manufacturing a fin structure with a wall of claim 8, wherein dissolving a surface of the wall for reducing the thickness of the wall further comprises neutralizing the surface of the wall or the structure with acid.
13. The method of manufacturing a fin structure with a wall of claim 8, wherein dissolving a surface of the wall for reducing the thickness of the wall comprises conducting a corrosion process on the wall.
14. The method of manufacturing a fin structure with a wall of claim 8, wherein dissolving a surface of the wall for reducing the thickness of the wall comprises conducting an electropolishing process on the wall.
15. A method of manufacturing a heat exchanger comprising a fin structure with a wall, comprising: manufacturing the heat exchanger by using additive manufacturing technology; and dissolving a surface of the wall of the fin structure for reducing thickness of the wall comprising conducting an etching process on the wall and baking the wall.
16. The method of manufacturing a structure with a wall of claim 15, further comprising dissolving a surface of a surrounding wall of a passage in a core of the heat exchanger.
17. The method of manufacturing a structure with a wall of claim 15, wherein the fin structure is made of aluminum alloy.
18. (canceled)
19. The method of manufacturing a fin structure with a wall of claim 15, wherein dissolving a surface of the wall for reducing the thickness of the wall comprises conducting a corrosion process on the wall.
20. The method of manufacturing a fin structure with a wall of claim 15, wherein dissolving a surface of the wall for reducing the thickness of the wall comprises conducting an electropolishing process on the wall.
Description
DRAWINGS
[0007] These and other features, aspects, and advantages of the present disclosure will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:
[0008]
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DETAILED DESCRIPTION
[0016] Embodiments of the present disclosure will be described herein below with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail to avoid obscuring the disclosure in unnecessary detail.
[0017] Unless defined otherwise, technical and scientific terms used herein have the same meaning as is commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terms first, second, and the like, as used herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the terms a and an do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced items. The terms such as front, back, bottom, and/or top, unless otherwise noted, are merely used for convenience of description, and are not limited to any one position or spatial orientation. The term or is meant to be inclusive and mean either or all of the listed items. The use of including, comprising, or having and variations thereof herein are meant to encompass the items listed thereafter and equivalents thereof as well as additional items. The terms connected and coupled are not restricted to physical or mechanical connections or couplings, and can include electrical connections or couplings, whether direct or indirect.
[0018] In the present disclosure, additive manufactured heat exchangers are used to replace conventional heat exchangers. However, the limitation of current additive manufacturing process is the minimum thickness of the fin structure. The minimum thickness that can be printed with current technology is more than 9 mils which is double the conventional fin thickness. As fins are major elements of heat exchanger this thickness limitation will substantially increase the overall heat exchanger weight. The present disclosure a method of manufacturing a fin structure or a heat exchanger, which can address the limitation of the thickness problem in additive manufacturing process.
[0019] Referring to
[0020] Referring to
[0021] In one embodiment, the step of 102) dissolving a surface of the wall for reducing the overall thickness of the wall comprises dissolving by 103) conducting an etching process applied to the wall or the structure. Before the etching process, the part that does not need to be etched can be covered with a protective layer, such as the bottom wall 122 of the fin structure in
[0022] During the etching process, acidic and alkaline solutions are used to dissolve the surface of the wall or the structure made of metal and form appropriate salt. Then, the salt is removed by using running water or other solvents. Therefore, a wall with reduced uniform thickness is produced. For example, aluminum is the material of the wall or the structure, and aluminum can be easily dissolved by NaOH or KOH solutions. Implementing NaOH or KOH solutions for etching the aluminum wall or structure to reduce the thickness of the wall is cost effective and can be scaled to any requirements. In this embodiment, dry etching process or wet etching process may be used.
[0023] Hydrogen embrittlement may occur, when the hydrogen gas is evolved during the etching process. If hydrogen is not going to penetrate, the step of 102) dissolving a surface of the wall for reducing the thickness of the wall further comprises 104) baking the wall or the structure after step 103) of conducting an etching process applied to the wall or the structure, so that the hydrogen gas can be removed that would prevent hydrogen embrittlement. The baking temperature may be from 200500 C., and the duration is 0-4 hours.
[0024] If hydrogen embrittlement occurs, the step of 102) dissolving a surface of the wall for reducing the thickness of the wall further comprises 105) neutralizing the surface of the wall or the structure with vinegar, acetic acid or other acids that would cause aluminum hydroxide formation by using alkaline material, and cleaning the products of neutralization by water or other solvents.
[0025] In another embodiment, the step of 102) dissolving a surface of the wall for reducing the thickness of the wall comprises 106) conducting a corrosion process to the wall or the structure.
[0026] During the corrosion process, acidic and alkaline solutions are used to dissolve the surface of the wall or the structure made of metal and form appropriate salt. For example, aluminum is the material of the wall or the structure, and NaOH or KOH solutions are used to corrode aluminum wall or structure to uniformly reduce the thickness of the wall, which is cost effective and can be scaled to any requirements.
[0027] During a corrosion process, the wall, on the order of nano-meters, gets corroded and forms an oxide layers on the surface of the metal wall. These oxide layers are then dissolved or washed away with some suitable solvents that would not form hydrogen gas and prevent embrittlement problem. Further, by baking process the hydrogen embrittlement can be prevented as discussed above.
[0028] In another embodiment, the step of 102) dissolving a surface of the wall for reducing the overall thickness of the wall comprises 107) conducting an electropolishing process to the wall or the structure.
[0029] Electropolishing with electrolyte solution can remove the surface of the wall or structure made of metal at a reasonable rate and result in formation of oxide layer that prevent hydrogen embrittlement. Salts formed by the electropolishing processes are washed by fluid circulation mechanisms. Continuous flow of etching solution washes away the formed salts from the critical location thus reducing the probability of forming thick salt deposits.
[0030] In one example, the electrolyte solution for electropolishing process may be a solution containing phosphoric acid 65-75 ml/L, sulfuric acid 5-10 ml/L, glycerin 1-15 ml/L, melamine 1-10 wt %, and hydrofluoric acid 1-5 ml/L. The parameters used in the electropolishing process are shown below. The temperature is 85 C., the voltage is 20V, the duration time is 5 minutes, the anode material is stainless steel, and the anode current is 25 A/dm.sup.2.
[0031] In the experiments, commercially available aluminum alloy is used for a fin structure with three upright walls 121 and one bottom wall 122 as shown in
[0032] Experiment 1: Commercially available NaOH solution is used for the etching process. The etching process is uniform throughout the length of the walls. After 13 hours, the thickness of upright walls is from 6.5 to 7.5 mils.
[0033] Experiment 2: The NaOH solution is diluted by half from the experiment 1. The etching process is uniform throughout the length of the walls. After 17 hours, the thickness of upright walls is from 2.5 to 3.5 mils.
[0034] Experiment 3: The NaOH solution is diluted by half from the experiment 1. The etching process is uniform throughout the length of the walls. After 16 hours, the thickness of upright walls is from 9.5 to 11 mils.
[0035] Referring to
[0036] Referring to
[0037] Referring to
[0038] While the disclosure has been illustrated and described in typical embodiments, it is not intended to be limited to the details shown, since various modifications and substitutions can be made without departing in any way from the spirit of the present disclosure. As such, further modifications and equivalents of the disclosure herein disclosed may occur to persons skilled in the art using no more than routine experimentation, and all such modifications and equivalents are believed to be within the spirit and scope of the disclosure as defined by the following claims.