Artificial Solid-Electrolyte Interphase Layer Material and Uses Thereof
20240106010 ยท 2024-03-28
Inventors
Cpc classification
Y02P70/50
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01M4/133
ELECTRICITY
B82Y40/00
PERFORMING OPERATIONS; TRANSPORTING
H01M4/0471
ELECTRICITY
Y02E60/10
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01M4/0445
ELECTRICITY
H01M10/4235
ELECTRICITY
H01M4/663
ELECTRICITY
H01M10/056
ELECTRICITY
International classification
H01M10/42
ELECTRICITY
H01M10/054
ELECTRICITY
Abstract
Li or Na based battery having an anode (or current collector) at least partially covered on its side facing the electrolyte by at least one artificial solid-electrolyte interphase layer with at least one layer of porous graphene of a thickness of less than 25 nm with pores having an average characteristic width in the range of 1-1000 nm.
Claims
1. A Li or Na based battery comprising an anode at least partially covered on its side facing the electrolyte by at least one artificial solid-electrolyte interphase layer with at least one layer of porous graphene of a thickness of less than 25 nm with pores having an average characteristic width in the range of 1-1000 nm.
2. The battery according to claim 1, wherein the artificial solid-electrolyte interphase layer has a thickness in the range of 1-15 nm, and/or wherein the porous graphene layer has an areal porosity in the range of at least 10%, and/or wherein said porous graphene has pores having an average characteristic width in the range of 5-900 nm, and/or wherein the battery is a solid-state battery and the electrolyte is a solid electrolyte.
3. The battery according to claim 1, wherein the artificial solid-electrolyte interphase layer comprises or consists of said at least one porous graphene layer and at least one additional selective graphene layer.
4. The battery according to claim 3, wherein the selective graphene layer is a defective graphene layer.
5. The battery according to claim 1, wherein the anode is an elemental metal layer.
6. The battery according to claim 1, wherein the at least one layer of porous graphene is a layer grown directly on an elemental metal layer forming the anode.
7. The battery according to claim 1, wherein said at least one layer of porous graphene is at least partially N-doped.
8. A layer of porous graphene as an artificial solid-electrolyte interphase layer for a battery, the layer of porous graphene comprising a thickness of less than 25 nm with pores having an average characteristic width in the range of 1-1000 nm.
9. The layer of porous graphene according to claim 8, wherein the layer of porous graphene has a thickness in the range of 1-15 nm, and/or wherein the porous graphene layer has an areal porosity in the range of at least 10%, and/or wherein said porous graphene has pores having an average characteristic width in the range of 5-900 nm.
10. A method for making a battery according to claim 1, wherein a catalytically active substrate is provided to catalyse the graphene formation under chemical vapour deposition conditions, said catalytically active substrate on its surface being provided with a plurality of catalytically inactive domains having a nanostructure essentially corresponding to the shape of the pores in the resultant porous graphene layer; chemical vapour deposition using a carbon source in the gas phase and formation of the porous graphene layer on the surface of the catalytically active substrate, the pores in the porous graphene layer being formed in situ due to the presence of the catalytically inactive domains, and wherein the catalytically active substrate with said porous graphene layer is used as an anode with an artificial solid-electrolyte interphase layer in the form of said porous graphene layer.
11. The method according to claim 10, wherein, before use of the catalytically active substrate with said porous graphene layer as the anode of the solid-state battery, said porous graphene layer is N-doped by subjecting the graphene layer to treatment with non-inert nitrogen-containing gas.
12. The method according to claim 10, wherein, before use of the catalytically active substrate with said porous graphene layer as the anode of the battery, on top of said porous graphene layer an additional selective, non-porous graphene layer is deposited.
13. The method according to claim 10, wherein the catalytically active substrate has a nickel content in the range of 0.06-1% by weight or 0.08-0.8% by weight complemented to 100% by weight by the copper content, and/or wherein the catalytically active substrate is prepared by applying a nickel film of a thickness in the range of 10 nm to 2.2 ?m on a pure copper foil, and by annealing.
14. The method according to claim 10, wherein the catalytically active substrate is provided on its surface with a plurality of catalytically inactive domains by applying, essentially contiguous tungsten layer, and by subsequently annealing at a pressure below normal pressure, to convert the tungsten film into a plurality of catalytically inactive domains.
15. The method according to claim 10, wherein the catalytically inactive domains have an average characteristic width in the range of 1-1000 nm.
16. The battery according to claim 1, wherein the artificial solid-electrolyte interphase layer in the form of a porous graphene layer has a thickness in the range of 1-15 nm or in the range of 5-10 nm, and/or wherein the porous graphene layer has an areal porosity in the range of at least 15%, or of at least 20% or at least 25% or at least 30% or at least 40%.
17. The battery according to claim 1, wherein the artificial solid-electrolyte interphase layer comprises or consists of said at least one porous graphene layer and at least one additional selective graphene layer, and wherein said at least one porous graphene layer is facing said anode and the at least one additional selective graphene layer is facing said electrolyte.
18. The battery according to claim 3, wherein the selective graphene layer is a defective graphene layer, having atomic defects, and wherein the selective graphene layer is a non-porous layer, or wherein said selective graphene layer has a thickness in the range of 0.34-5 nm, or in the range of 0.34-1 nm.
19. The battery according to claim 1, wherein the anode is an elemental metal layer, wherein the metal is selected from the group consisting of lithium, copper, nickel, gold, silver, aluminium, or an alloy or layered composite thereof, including where the anode is an elemental metal layer of a nickel copper alloy or a ternary or quaternary alloy of nickel copper and at least one further metal selected from the group consisting of gold, silver and/or aluminium.
20. The battery according to claim 1, wherein the at least one layer of porous graphene is a layer grown directly on an elemental metal layer forming the anode, wherein the metal of said anode is selected from copper or copper nickel alloy or layered structure or an alloy or layered structure based on copper and/or nickel and at least one further metal selected from the group consisting of gold, silver and/or aluminium.
21. The battery according to claim 1, wherein said at least one layer of porous graphene is at least partially N-doped, wherein the N-doping is in the form of at least one surficial N-doping and/or in the form of an N-doping of the pore boundaries.
22. The method according to claim 8, wherein the porous graphene is used as an artificial solid-electrolyte interphase layer for a lithium-based or sodium-based battery, or a solid-state battery.
23. The method according to claim 8, wherein the porous graphene layer has a thickness in the range of 1 5-10 nm, and/or wherein the porous graphene layer has an areal porosity in the range of at least 15%, or of at least 20% or at least 25% or at least 30% or at least 40%.
24. The method according to claim 10, wherein the catalytically active substrate is a copper-nickel alloy substrate with a copper content in the range of 98 to less than 99.96% by weight and a nickel content in the range of more than 0.04 to 2% by weight, the copper and nickel contents complementing to 100% by weight of the catalytically active substrate.
25. The method according to claim 10, wherein, before use of the catalytically active substrate with said porous graphene layer as the anode of the solid-state battery, said porous graphene layer is N-doped by subjecting the graphene layer to treatment with non-inert nitrogen-containing gas, including in the form of ammonia gas.
26. The method according to claim 10, wherein, before use of the catalytically active substrate with said porous graphene layer as the anode of the battery on top of said porous graphene layer an additional selective, non-porous graphene layer is deposited, in the form of a contiguous graphene layer having atomic defects.
27. The method according to claim 10, wherein the catalytically active substrate is prepared by applying, using electrochemical plating, e-beam evaporation, PVD or sputtering, a nickel film of a thickness in the range of 10 nm to 2.2 ?m or in the range of 25-300 or 20-500 nm, or in the range of 50-300 nm on a pure copper foil, including the pure copper foil having a thickness in the range of 0.01-0.10 mm, or in the range of 0.02-0.04 mm, and/or having a purity of more than 99.5%, and by annealing, at a temperature in the range of 800-1200? C., or in the range of 900-1100? C., during a time span of 10 minutes-120 minutes, or during a time span in the range of 30 minutes-90 minutes.
28. The method according to claim 10, wherein the catalytically active substrate is provided on its surface with a plurality of catalytically inactive domains by applying, using sputtering, e-beam evaporation or PVD, an essentially contiguous tungsten layer, with a thickness in the range of more than 1 nm, or more than 3 nm, or more than 5 nm, or in the range of 1-10 nm, or in the range of 5-10 nm, and by subsequently annealing at a pressure below normal pressure, or of less than 100 mTorr, under a reducing atmosphere, including in the presence of an inert gas such as argon or nitrogen gas, combined with hydrogen gas, to convert the tungsten film into a plurality of catalytically inactive domains, wherein the annealing takes place at a temperature in the range of 700-1100? C., or in the range of 750-950? C. or 800-900? C., during a time span in the range of 10-180 minutes, or in the range of 50-100 minutes.
29. The method according to claim 10, wherein the catalytically inactive domains have an average characteristic width in the range of 10-100 nm, or in the range of 10-50 nm, or having an average characteristic width in the range between 5-900 nm, or in the range of 10-200 nm, or in the range of 10-100 nm
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0084] Preferred embodiments of the invention are described in the following with reference to the drawings, which are for the purpose of illustrating the present preferred embodiments of the invention and not for the purpose of limiting the same. In the drawings,
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DESCRIPTION OF THE INVENTION
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[0103] As detailed above, the anode of a battery according to this invention can take the form of a lithium layer but also of another metal layer (anode free solid-state battery). In particular for the case where the anode metal layer is non-lithium and at the same time is used as the catalytic substrate for the making of the porous graphene layer, several possibilities are given for such a catalytic substrate layer which then also forms the metal anode (or current collector) of the final battery.
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Experimental Section
[0109] Aas-Grown Highly Porous Graphene
[0110] 1. Preparation of CuNi Alloy: [0111] a. A metal catalyst (e.g. Copper foil, 0.035 mm, 99.9%, JX Nippon mining & metals) is used; a Ni film with a varied thickness from 10 nm to 2.2 ?m or 50 to 300 nm is deposited on as-received Cu catalyst by E-beam evaporator or sputtering in vacuum (e.g. FHR, Pentaco 100, Ni purity 99.95%, 3?10.sup.?3 mbar); pressure of the sputtering is about 0.006 mbar with 200 sccm of Ar; a bi-layered structure of Ni/Cu catalyst is annealed at e.g. 1000? C. for e.g. 1 hour to convert to a binary metal alloy (CuNi alloy) under low pressure (e.g. 200 mTorr) with e.g. 50 sccm of H.sub.2 in a chemical vapor deposition (CVD) system (e.g. Graphene Square. Inc, TCVD-RF100CA). [0112] b. The concentration of Ni is more than 0.04% to 10% or preferably in the range of more than 0.04 to 2% by weight, or also in the range of 0.1-10% preferably in the range of 0.2-8% or 0.3-5%, typically in the range of 0.4-3%. Particularly preferably, the catalytically active substrate has a nickel content in the range of 0.06-1% by weight or 0.08-0.8% by weight complemented to 100% by weight by the copper content. The balance is Cu (for the broadest range it is thus 99.96-90%, for a typical range it is 99.94 less than 99% or 99.6-97%, the balance does not include very minor impurities which can be present in the starting Cu foil or in the starting Ni, and which in the final substrate make up less than 0.05% or less than 0.02% by weight in total). The range of Ni content depends on the initial Ni thickness. The typical working content of Ni is preferably in the range of 0.5-2%.
[0113] 2. Conversion of W Thin Film into W Nanostructures: [0114] a. A thin film of W (thickness 1-10 nm) is deposited on the CuNi alloy according to the preceding paragraph by sputtering or E-beam evaporator in vacuum (e.g. FHR, Pentaco 100, W purity 99.95%) with e.g. E-beam evaporator or sputtering in vacuum (e.g. 3?10.sup.?3 mbar); the pressure of the sputtering is e.g. 0.003 mbar with e.g. 100 sccm of Ar; the thin film of W is deposited from 1 to 10 nm with e.g. 0.25 kW of DC plasma; a W/CuNi alloy is mounted in the center of a 4-inch quartz tube chamber positioned in the furnace of the CVD system (e.g. Graphene Square. Inc, TCVD-RF100CA); the chamber is evacuated to reach a pressure of e.g. 45 mTorr and then purged with inert gas, e.g. N.sub.2 (e.g. 100 sccm) for e.g. 5 min normally at room temperature; after purging, the chamber is put under vacuum (e.g. 45 mTorr) again and then the pressure is increased e.g. with a gas mixture of Ar and H.sub.2 (800 sccm and 40 sccm, respectively); to convert the W thin film into W nanostructures. The nanostructures are based variously on symmetric W nanoparticles and asymmetric W nanowalls with various degrees of interparticle agglomeration. The W/CuNi alloy is carefully annealed at elevated temperature (e.g. 750-950? C. or 800-900? C.) for an extended period of time, e.g. 1 hour including ramping with the continuous supply of e.g. 800 sccm of Ar and 40 sccm of H.sub.2 under 4 Torr.
[0115] 3. Synthesis of Highly Porous Graphene [0116] a. Once W nanostructures appear in the process according to the preceding paragraph, a hydrocarbon source for example 40 sccm of CH.sub.4 is introduced in the chamber with e.g. 300 sccm of Ar and 40 sccm of H.sub.2 under 4 Torr in the low-pressure CVD system; depending on the desired level of porosity or thickness, a growth duration is carefully controlled from e.g. 5 to 60 min; afterwards, the furnace is programmed to cool to room temperature under flow of Ar and H.sub.2. Under these conditions, a total CVD time of 60 minutes leads to a graphene layer thickness of approximately 10 nm. CVD time of 5 minutes leads to a graphene layer thickness of approximately below 1 nm, but this may also depend on further parameters.
[0117] BSelective Layer on Highly Porous Graphene [0118] 1. Selective graphene layer is defined as top-most graphene layer, covering porous structure in highly porous graphene, yet including point and/or line defects, for example, grain boundaries. [0119] 2. A synthesis of selective layer of graphene on highly porous graphene is performed in the CVD system. A bi-layered W/CuNi alloy is annealed at an elevated temperature with e.g., 800 sccm of Ar and 40 sccm of H.sub.2, in which a thin film of W is converted into W nanostructure according to the preceding paragraph. Once the temperature is reached (750-950? C.) and W nanostructures appear on the surface of the alloy, a hydrocarbon source, for example 40 sccm of CH.sub.4, is introduced in the chamber with e.g. 300 sccm of Ar and 40 sccm of H.sub.2 under 4 Torr in the low-pressure CVD system; unlike the synthesis of highly porous graphene, a growth duration is slightly prolonged, for example, for 60 min to obtain highly porous graphene plus additional 10 min to acquire a selective layer of graphene atop, but this may also depend on other parameters.
[0120] CN-Doped Highly Porous Graphene
[0121] 1. Post-TreatmentHeat Treatment [0122] a. After the synthesis of highly porous graphene, a removal of W nanostructure is required by a pre-leaching process because W nanostructures can etch the graphene during elevated temperature annealing. The pre-leaching process is such that the as-grown sample is dipped in 0.1 M NaOH at 40? C. for 10-20 min to remove W nanostructures. Required duration of the process depends on an initial thickness of W thin film. [0123] b. After rinsing in deionized water and drying with N.sub.2, the pre-leached sample is re-inserted in the CVD system (e.g. Graphene Square. Inc, TCVD-RF100CA); the chamber is evacuated to reach a pressure of e.g. 45 mTorr and then purged with inert gas, e.g. N.sub.2 (e.g. 100 sccm) for e.g. 5 min normally at room temperature; after purging, the chamber is put under vacuum (e.g. 45 mTorr) again and then the pressure is increased with H.sub.2 (e.g. 50 sccm). The sample is carefully annealed at elevated temperature (500-1000? C.) with H.sub.2 (e.g. 10-100 sccm) for an extended period of time, e.g. 1 hour including ramping, in which the slightly oxidized CuNi surface is reduced. [0124] c. Nitrogen-containing gas, e.g. ammonia gas (NH.sub.3, 10-100 sccm), is introduced into the CVD system. A duration of doping step can vary depending on the amount of N-doping in highly porous graphene from 10 to 60 min. Afterwards, the furnace is programmed to cool to room temperature under flow of H.sub.2.
[0125] 2. Post TreatmentPlasma Treatment [0126] a. After the synthesis of highly porous graphene, as-grown highly porous graphene or pre-leached highly porous graphene sample according to the preceding paragraph is placed in a plasma-equipped CVD system. The chamber is evacuated to reach a pressure of e.g. 45 mTorr and then purged with inert gas, e.g. N.sub.2 (e.g. 100 sccm) for e.g. 5 min normally at room temperature; after purging, the chamber is put under vacuum (e.g. 45 mTorr) again and then the pressure is increased with H.sub.2 (e.g. 50 sccm). [0127] b. N-doped highly porous graphene can be prepared as following; 1. As-grown highly porous graphene is directly treated by nitrogen plasma, or 2. As-grown sample is treated by a combination of heat and plasma. [0128] i. The plasma equipped CVD system is employed in which highly porous graphene is placed in an induced coupled plasma (ICP) system; nitrogen-containing gas, for example, N.sub.2 gas or NH.sub.3 gas e.g., 10-100 sccm is introduced with plasma (RF power from 10 to 200 W). A duration of doping step can vary depending on the amount of N-doping in highly porous graphene from 10 to 60 min. [0129] ii. In order to increase the amount of N-doping level, heat and plasma treatment, which can expedite a doping process, are applied, simultaneously. The plasma equipped CVD system is employed in which an induced coupled plasma (ICP) system and a furnace are set side by side. As-grown highly porous graphene is placed in the furnace and annealed at an elevated temperature (300-1000? C.). Once the furnace is heated up, plasma is turned on (RF power from 10 to 200 W). A duration of doping step can vary depending on the amount of N-doping in highly porous graphene from 10 to 60 min. Afterwards, the furnace is programmed to cool to room temperature under flow of H.sub.2.
[0130] 3. In-Situ Treatment [0131] a. In-situ treatment of nitrogen doping is carried out in the CVD system. A bi-layered W/CuNi alloy is annealed at an elevated temperature with e.g., 800 sccm of Ar and 40 sccm of H.sub.2, in which a thin film of W is converted into W nanostructures according to the preceding paragraph. Once the temperature is reached (750-950? C.), methane (e.g., 10-40 sccm) and ammonia (e.g., 5-40 sccm) as carbon and nitrogen source, respectively, are introduced in the chamber with e.g. 300 sccm of Ar and 40 sccm of H.sub.2 under 4 Torr in the low-pressure CVD system; depending on the desired level of porosity, thickness, or N-doping, a growth duration and a flow rate of ammonia gas are carefully controlled from e.g. 10 to 60 min; afterwards, the furnace is programmed to cool to room temperature under flow of Ar and H.sub.2.
[0132] D. Ternary Metal Alloy [0133] 1. Cu catalyst (e.g. Copper foil, 0.035 mm, 99.9%, JX Nippon mining & metals) is used; a Ni film with a varied thickness from 10 nm to 2.2 ?m or 50 to 300 nm is deposited on as-received commercial Cu catalyst by E-beam evaporator or sputtering in vacuum (e.g. FHR, Pentaco 100, Ni purity 99.95%, 3?10.sup.?3 mbar); pressure of the sputtering is about 0.006 mbar with 200 sccm of Ar; the resulting film of Ni is deposited from 10 nm to 2.2 ?m or 50 to 300 nm with DC plasma whose power is 0.25 kW; a Ag (or Ag, or Al) thin film with a varied thickness from 1 to 100 nm or 3.5 to 35 nm is deposited on top of the bi-layer Ni/Cu or in between Ni and Cu; the resulting film of Ag is deposited from 1 to 100 nm or 3.5 to 35 nm with E-beam evaporator (e.g. Ag purity 99.95%, 2?10.sup.?6 mbar); a tri-layered structure of Ag/Ni/Cu catalyst is annealed at e.g. 1000? C. for e.g. 1 hour to convert to a ternary metal alloy (CuNiAg alloy) under low pressure (e.g. 200 mTorr) with e.g. 50 sccm of H.sub.2 in a chemical vapor deposition (CVD) system (e.g. Graphene Square. Inc, TCVD-RF100CA). [0134] 2. A thin film of W (thickness 1-10 nm) is deposited on the CuNiAg alloy according to the preceding paragraph by sputtering or E-b earn evaporator in vacuum (e.g. FHR, Pentaco 100, W purity 99.95%) with e.g. E-beam evaporator or sputtering in vacuum (e.g. 3?10.sup.?3 mbar); the pressure of the sputtering is e.g. 0.003 mbar with e.g. 100 sccm of Ar; the thin film of W is deposited from 1 to 10 nm with e.g. 0.25 kW of DC plasma; a W/CuNiAg alloy is mounted in the center of a 4-inch quartz tube chamber positioned in the furnace of the CVD system (e.g. Graphene Square. Inc, TCVD-RF100CA); the chamber is evacuated to reach a pressure of e.g. 45 mTorr and then purged with inert gas, e.g. N.sub.2 (e.g. 100 sccm) for e.g. 5 min normally at room temperature; after purging, the chamber is put under vacuum (e.g. 45 mTorr) again and then the pressure is increased e.g. with a gas mixture of Ar and H.sub.2 (800 sccm and 40 sccm, respectively); to convert the W thin film into W nanostructures. The nanostructures are based variously on symmetric W nanoparticles and asymmetric W nanowalls with various degrees of interparticle agglomeration. The W/CuNiAg alloy is carefully annealed at elevated temperature (e.g. 750-950? C. or 800-900? C.) for an extended period of time, e.g. 1 hour including ramping with the continuous supply of e.g. 800 sccm of Ar and 40 sccm of H.sub.2 under 4 Torr. [0135] 3. Once W nanostructures appear in the process according to the preceding paragraph, a hydrocarbon source for example 40 sccm of methane is introduced in the chamber with e.g. 300 sccm of Ar and 40 sccm of H.sub.2 under 4 Torr in the low-pressure CVD system; depending on the desired level of porosity or thickness, a growth duration is carefully controlled from e.g. 5 to 60 min; afterwards, the furnace is programmed to cool to room temperature under flow of Ar and H.sub.2. Under these conditions, a total CVD time of 60 minutes leads to a graphene layer thickness of approximately 10 nm. CVD time of 5 minutes leads to a graphene layer thickness of approximately below 1 nm, but this may also depend on further parameters.
FURTHER EXAMPLES
[0136] Catalyst Substrate Preparation:
[0137] A CuNi alloy catalyst substrate was prepared to synthesize highly porous graphene. A thin film of Ni (70 nm thickness) on bare Cu foil (JX Nippon Mining & Metals) without any treatment was deposited by sputtering (FHR, Pentaco 100, Ni purity 99.95%). The deposition of Ni thin film was performed with 0.25 kW of DC power and 200 sccm of Ar under 6?10.sup.?3 mbar for 10 mins. The bi-layered Ni/Cu was then annealed by chemical vapor deposition (CVD) to convert it into a binary CuNi alloy. The annealing process was as follows: (1) The CVD system was ramped up to 1000? C. for 60 mins with 50 sccm of H.sub.2, (2) The temperature was sustained at 1000? C. for 15 min to complete converting the Ni/Cu into the binary metal alloy (CuNi) in the presence of 50 sccm of H.sub.2, and (3) the whole system was cooled down to room temperature at a cooling rate of 50? C./min with the same level of H.sub.2. Subsequently, a thin film of W (6 nm) was deposited on the CuNi alloy by sputtering (FHR, Pentaco 100, W purity 99.95%). The deposition of W thin film was carried out with 0.25 kW of DC power and 100 sccm of Ar under 3?10.sup.?3 mbar for 45 secs. The as-prepared sample including a thin film of W atop CuNi alloy was inserted in the CVD system. The reactor chamber was pumped out until 45 mTorr to remove residual gases. After the pressure arrived at the base pressure, the chamber was purged out with 100 sccm of N.sub.2 for 2 min and vacuumed down to 45 mTorr for 2 min.
[0138] Highly Porous Graphene Synthesis:
[0139] The growth process falls into two parts: (1) the W annealing step and (2) the growth step. In the annealing process, the furnace was ramped up at 750? C. for 50 mins with the continuous supply of 800 sccm of Ar and 40 sccm of H.sub.2 under 4 Torr, followed by an additional 15-min annealing step, resulting in the conversion of W thin film into desired W nanostructures due to solid-state dewetting behavior. In the second phase of the process, the synthesis of highly porous graphene took place. Hydrocarbon precursors, such as CH.sub.4 (40 sccm) were issued into the CVD system for 30 mins, along with 40 sccm of H.sub.2 and 300 sccm of Ar under the same level of the process pressure. Afterward, the furnace was immediately shifted to rapidly cool down the CVD system at a cooling rate of 50? C./min in the presence of 40 sccm of H.sub.2.
[0140] Transfer of Highly Porous Graphene onto Test Substrates:
[0141] For the preparation of highly porous graphene on various substrates (SiNx, SiO.sub.2, and Cu foil), highly porous graphene was transferred onto a substrate of interest with the help of PMMA (950k, AR-P 672.03). A PMMA was spin-coated on the as-synthesized highly porous graphene at 4000 rpm for 60 secs. Afterward, the sample was baked at 110? C. to evaporate the solvent in the PMMA film for 1 min. The sample was then floated onto a solution of ammonium persulfate (0.5 M APS) for 3 hours to remove the metal alloy substrate, followed by a rinsing process with deionized water. The highly porous graphene supported by PMMA film was transferred onto the desired substrate and dried at room temperature. Finally, the PMMA layer was dissolved in acetone for 1 hour and the highly porous graphene on the substrate underwent a heat treatment at 350? C. for 1 hour under H.sub.2 to remove residual PMMA and residual water molecules which can cause parasitic reactions during a battery operation. In the case of highly porous graphene transferred on SiNx membrane, the PMMA film was directly removed by a heat treatment at 400? C. in the presence of 100 sccm of H.sub.2 and 900 sccm of Ar for 2 hours.
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[0144] Battery Cell Characterization:
[0145] Li?highly porous graphene/Cu asymmetric cells (coin cell, diameter 13 mm) were assembled, consisting of lithium metal as a reference and counter electrode and highly porous graphene/Cu foil as a working electrode.
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[0148] As shown in
[0149] For the cell with the highly porous graphene/Cu, remarkably low overpotential (9 mV) remained stable over the cycles (compared to 41 mV for the bare Cu cell, shown in
[0150] The zoomed-in plots (at 300-500, 1000-1200, and 2400-2600 hours, respectively) of Li?Cu cell, implementing the highly porous graphene/Cu electrode, reveal negligibly increased overpotential from 7 mV to 9 mV over 2600 hours (