Scalable graphene nanoribbon arrays for digital transistors

Abstract

Methods for fabricating a graphene nanoribbon array in accordance with several embodiments of the present invention can include the steps of depositing PMMA dots on a substrate in an mn grid, to selectively seed graphene flakes on the substrate by controlling the growth of the graphene flakes on the substrate during the graphene deposition. The methods can further include the steps of masking the graphene flake edges with an insulator layer, at a very low deposition time or at a lower precursor concentration, to ensure there are not enough insulator molecules to form a complete layer over the flakes, but only enough insulator to form around the flakes edges. Once the graphene flake edges are masked, the bulk graphene can be etched, and the masking insulator can be removed to expose the resulting graphene nanoribbon.

Claims

1. A method for fabricating a graphene nanoribbon array, comprising the steps of: A) selectively seeding the growth of graphene flakes on a substrate, including; A1) depositing PMMA dots on said substrate in an mn grid, wherein a periodicity of the grid is controlled by an initial spacing of said PMMA dots on said substrate; A2) depositing said graphene on said PMMA dots and said substrate, wherein a size of said graphene flakes is controlled by controlling a growth time of said graphene flakes on said PMMA dots; B) masking said graphene flake edges with a layer of insulator; C) etching said graphene flakes; D) removing said insulator to expose an mn array of said graphene nanoribbons, said nanoribbons having a plurality of facets when viewed in top plan; E) etching at least one electrode in each of said facets; and, F) providing a back plane to establish a graphene nanotransistor in each said facet of each said graphene nanoribbon.

2. The method of claim 1, wherein said step A2) is accomplished using a gas selected from the group consisting of Ar, H.sub.2 or CH.sub.4 at about 1050 C.

3. The method of claim 1, wherein said step A2) is accomplished using a process selected from the group consisting of CVD growth, epitaxial growth or RF inductive growth.

4. The method of claim 1, wherein said insulator is selected from the group consisting of Al.sub.2O.sub.3 or HfO.sub.2.

5. The method of claim 1, wherein said substrate is a copper catalyst foil.

6. The method of claim 1, where said step C) is accomplished using an oxygen plasma etch at 30 W for 30 seconds.

7. The method of claim 1, wherein said step D) is accomplished using KOH.

8. A method for manufacturing a graphene nanotransistor grid, said method comprising the steps of: A) seeding the growth of graphene flakes on a substrate in an mn array, including; A1) depositing PMMA dots on said substrate in an mn grid, wherein a periodicity of said grid is controlled by an initial spacing of said PMMA dots on said substrate; A2) depositing said graphene on said PMMA dots and said substrate, wherein a size of said graphene flakes is controlled by controlling a growth time of said graphene flakes on said PMMA dots; B) masking said graphene flake edges with a layer of insulator; C) etching said graphene flakes; D) removing said insulator to expose an mn array of said graphene nanoribbons, said nanoribbons having a plurality of facets when viewed in top plan; E) etching at least one electrode in each of said facets; and, F) providing a back plane to establish a graphene nanotransistor in each said facet of each said graphene nanoribbon.

9. The method of claim 8, wherein said step A2) is accomplished using a gas selected from the group consisting of Ar, H.sub.2 or CH.sub.4 at about 1050 C.

10. The method of claim 8, wherein said step A2) is accomplished using a process selected from the group consisting of CVD growth, epitaxial growth or RF inductive growth.

11. The method of claim 8, wherein said insulator is selected from the group consisting of Al.sub.2O.sub.3 or HfO.sub.2.

12. The method of claim 8, wherein said substrate is a copper catalyst foil.

13. The method of claim 8, where said step C) is accomplished using an oxygen plasma etch at 30 W for 30 seconds.

14. The method of claim 8, wherein said step D) is accomplished using KOH.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The novel features of the present invention will be best understood from the accompanying drawings, taken in conjunction with the accompanying description, in which similarly-referenced characters refer to similarly-referenced parts, and in which:

(2) FIG. 1 is a block diagram of steps that can be taken to practice some of the methods of the present invention according to several embodiments;

(3) FIG. 2 is a cross-sectional view of the substrate once polymethyl methacrylate (PMMA) dots have been placed on a substrate using the methods of FIG. 1;

(4) FIG. 3 is a top plan photograph of the substrate after the initial step of seeding graphene flakes shown in FIG. 2 has begun;

(5) FIG. 4 is a cross-sectional view of the substrate of FIG. 2 once graphene has been deposited onto the substrate and flakes have begun to form.

(6) FIG. 5 is a top plan photograph of the flakes shown in FIG. 4, after graphene has been deposited and flakes have been given time to form;

(7) FIG. 6 is the same photograph as FIG. 5, but with the graphene flakes being given more time to grow;

(8) FIG. 7 is a much smaller scale photograph of FIG. 6, which illustrates the random, disorderly graphene deposition process that can occur, when compared to the methods of FIG. 1 that include the seeding step to control the graphene deposition;

(9) FIG. 8 is a cross-sectional view of the substrate of FIG. 4, after an insulator has been deposited on the flake edges;

(10) FIG. 9 is a cross-sectional view of the substrate of FIG. 8 after the bulk graphene has been etched away;

(11) FIG. 10 a cross-sectional view of the substrate of FIG. 9 after the insulator has been etched away to expose the resulting graphene nanoribbon;

(12) FIG. 11 is a top plan representation of a single hexagonal graphene flake;

(13) FIG. 12 is a top plan representation of the flake of FIG. 11 once the insulator has been deposited;

(14) FIG. 13 is a top plan representation of the flake of FIG. 12 once the bulk graphene has been etched;

(15) FIG. 14 is a top plan representation of the flake of FIG. 13 once the insulator has been removed; and,

(16) FIG. 15 is a top plan representation of the nanoribbon of FIG. 14, which has been converted to a nanotransistor.

DETAILED DESCRIPTION OF THE WRITTEN EMBODIMENTS

(17) Referring initially to FIGS. 1-3, a method for fabricating a graphene nanoribbon (GNR) can be shown and can be designated using reference character 100. As shown, method 100 can include the initial step 102 of seeding the growth of graphene flakes on a substrate. To do this, and as shown in FIGS. 1-2, the first part of step 102 in seeding the graphene flakes to create a high yield process can be to control placement location of the GNR on a substrate 10 (see FIG. 2). To this effect, one must control the seeding of initial graphene growth, by placing polymethyl methacrylate (PMMA) dots 12 on substrate 10. Different polymers could also be used. Alternatively, defects in the growth foil substrate 10 can be induced at the locations with graphene growth is desired.

(18) The placement of PMMA dots (step 104 in method 100), can be done with PMMA lithographic deposition at known locations in an mn grid on a copper growth catalyst foil substrate 10, as perhaps best seen in FIG. 3. Once the PMMA dots are in place, the methods according to several embodiments can include the step of deposition of graphene onto the substrate, as shown by step 106 in FIG. 1. When the foil substrate 10 is placed in a furnace under Ar/H.sub.2/CH.sub.4 at 1050 C. (around 1000 C. to 1100 C.), growth of graphene flakes 14 can be nucleated on the substrate 10 at the locations of the PMMA sites 12, as shown in FIG. 4. The deposition step 106 can be accomplished by chemical vapor deposition (CVD) growth, epitaxial growth, RF inductive growth, or any other catalytic process for deposition of graphene known in the art.

(19) The graphene flakes 14 can also be seen in FIGS. 5 and 6. As shown in FIGS. 5 and 6, the size of the graphene flakes 14 can be controlled by the growth time, while the periodicity of the mn array can be controlled by the initial spacing of the PMMA dots. These graphene crystals 14 can serve as the template for GNR harvesting, as described in more detail below. FIG. 7 illustrates how the graphene flake process can occur if no seeding step is taken. As shown in portions of FIG. 7, the graphene growth can be asymmetrical and uneven, which can a disadvantage if scalable, reproducible methods are desired. When the methods of the present invention are used, graphene flakes can be grown in the dense symmetrical scalable pattern, as also shown in small scale in FIG. 7.

(20) With graphene crystal flakes 14 at known grid locations, one must selectively etch away most of the crystal flake 14 and leave only a narrow ribbon. Since conventional lithography tends to contaminate the samples, alternative methods of masking the crystal edges must be employed. To do this, the methods according to several embodiments can include the step 108 of masking the graphene flake edges with an insulator 16, as shown in FIGS. 1 and 8. To accomplish step 108, one can use atomic layer deposition of an insulator (Al.sub.2O.sub.3 or HfO.sub.2 for example) at very low deposition times or low precursor concentrations. Under these conditions, there are not enough insulator molecules to form a complete atomic layer. Instead, molecules accumulate only at the graphene edges (FIG. 8). Other insulators could be used, provided the corresponding deposition time and/or precursor concentrations are sufficiently brief, or low in the case of precursor concentrations, to only allow enough insulator to deposit around the edges of the flakes.

(21) With the insulator layer 16 now covering the edges of the graphene flakes 14, the methods according to several embodiments can include the step of etching away the bulk graphene, as shown by step 110 in FIG. 1. The etching step 108 can be accomplished with a gentle oxygen plasma etch (30 W for 30 sec). As shown in FIG. 9, once the bulk of the graphene flake 14 has been etched, all that remains in the portion of the flake 14 (the edge) that was covered by insulator 16 (the back edge of flake 14 is shown in phantom in FIG. 9).

(22) As shown in FIG. 1, the next step in method 100 can be the subsequent removal of the protective oxide layer, as shown by step 112. Step 112 can be accomplished with a gentle KOH wash. The result can be a GNR 20, which can be the shape of a hexagon when viewed in top plan (other geometries are possible, depending on the geometry of the PMMA dots 12 used in depositing step 104, as part of seeding step 102 and other factors. The GNR 20 is shown in cross-section in FIG. 10.

(23) FIGS. 11-14 are top plan representations of a single graphene flake, which can be used to better understand the methods according to several embodiments. FIG. 11 is a single graphene flake 14 after step 102 has been taken. FIG. 12 illustrates the presence of insulator 16 after step 108 has been taken. FIG. 13 illustrates the insulator, which is in the shape of a hexagonal ribbon, and which is all that can be seen in top plan after the bulk graphene has been etched away, step 110, while FIG. 14 shows the desired GNR 20 after insulator has been removed, as shown in step 112 of FIG. 1.

(24) Referring now to FIG. 15, electrode deposition can be accomplished to measure the conduction of the GNR. Three terminal transistors can be fabricated by etching electrodes 18 in each facet of the GNR 20 using electron beam lithography or photolithography, with a silicon back plane serving as a global back gate. In this manner, each graphene hexagon will form at least one GNR transistor. In fact, several transistors could be made from a single hexagon using the different facets of the GNR 20 since electronic conduction around a vertex would be minimal outside the ballistic regime. More generally, the number of nanotransistors that can be formed can be based on the number of facets, which can be further based on the geometric profile of the flake, e.g., six nanotransistors can be made from a hexagonal GNR, either nanotransistors for an octagonal GNR, and so on. The width of the final graphene channel corresponds to the lateral dimension of the oxide nanoparticles, typically 2-3 nanometers. In this manner, one can fabricate an arbitrarily large array of GNR transistors with expected ON/OFF ratios >1000.

(25) This method is an improvement over current silicon CMOS processing because it can scale down to smaller dimensions. With smaller digital transistors we can increase the packing density in next generation processors, malting them faster and less expensive. Though experiments have demonstrated this concept with graphene previously, there is as of yet no method for making millions of transistors reproducibly as required for industrial scale up. This method provides a pathway for large scale manufacturing of graphene transistors with an intrinsic band gap for digital computing.

(26) The use of the terms a and an and the and similar references in the context of describing the invention (especially in the context of the following claims) is to be construed to cover both the singular and the plural, unless otherwise indicated herein or clearly contradicted by context. The terms comprising, having, including, and containing are to be construed as open-ended terms (i.e., meaning including, but not limited to,) unless otherwise noted. Recitation of ranges of values herein are merely intended to serve as a shorthand method of referring individually to each separate value falling within the range, unless otherwise indicated herein, and each separate value is incorporated into the specification as if it were individually recited herein. All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. The use of any and all examples, or exemplary language (e.g., such as) provided herein, is intended merely to better illuminate the invention and does not pose a limitation on the scope of the invention unless otherwise claimed. No language in the specification should be construed as indicating any non-claimed element as essential to the practice of the invention.

(27) Preferred embodiments of this invention are described herein, including the best mode known to the inventors for carrying out the invention. Variations of those preferred embodiments may become apparent to those of ordinary skill in the art upon reading the foregoing description. The inventors expect skilled artisans to employ such variations as appropriate, and the inventors intend for the invention to be practiced otherwise than as specifically described herein. Accordingly, this invention includes all modifications and equivalents of the subject matter recited in the claims appended hereto as permitted by applicable law. Moreover, any combination of the above-described elements in all possible variations thereof is encompassed by the invention unless otherwise indicated herein or otherwise clearly contradicted by context.