A display apparatus and a method of manufacturing the same are provided. According to an embodiment, a display apparatus includes: a substrate; a thin-film transistor located on the substrate; and a buffer layer, a conductive layer, and an insulating layer sequentially located from the substrate between the substrate and the thin-film transistor, and a thickness of the insulating layer is less than a thickness of the buffer layer.

A display panel includes a base layer, a signal line which is disposed on the base layer and includes a first layer including aluminum and a second layer disposed directly on the first layer and consisting of niobium, a first thin film transistor connected to the signal line, a second thin film transistor disposed on the base layer, a capacitor electrically connected to the second thin film transistor, and a light emitting element electrically connected to the second thin film transistor.

A pixel structure and a manufacturing method therefor, an array substrate, and a display device are provided. The pixel structure includes a pixel electrode, an active layer, a source/drain electrode layer, and a common electrode which are located on a base substrate. The pixel electrode is located between the base substrate and the common electrode. The source/drain electrode layer includes a first electrode and a second electrode which are electrically connected to the active layer, and the second electrode is electrically connected to the pixel electrode. The active layer is located between the base substrate and the source/drain electrode layer. The active layer includes a first surface close to the source/drain electrode layer. The source/drain electrode layer includes a second surface close to the active layer. Partial edge of the first surface is aligned with partial edge of the second surface.

An array substrate includes a substrate, a protection layer, and a photodiode. The protection layer is disposed over the substrate, has a single layer-structure, and is provided with a through-hole therein. The photodiode includes a lower electrode, a PN junction and an upper electrode, which are sequentially over the substrate. The PN junction is within the through-hole. The protection layer and the PN junction of the photodiode have a substantially same thickness. The array substrate further includes a thin-film transistor over the substrate. An orthographic projection of an active layer of the thin-film transistor on the substrate does not overlap with an orthographic projection of the PN junction of the photodiode on the substrate.

Disclosed are a method and a device for manufacturing an array substrate, and an array substrate. The method includes: depositing and forming a gate insulation layer on a pre-formed base substrate and a pre-formed gate, the gate insulation layer covering the pre-formed gate; depositing and forming an amorphous silicon layer, a doped amorphous silicon layer including at least three doped layers, and a metal layer on the gate insulation layer in sequence, doping concentrations of the at least three doped layers of the doped amorphous silicon layer increasing from bottom to top; etching patterns of the amorphous silicon layer, the doped amorphous silicon layer and the metal layer to form the array substrate.

A glass substrate has a compaction of 0.1 to 100 ppm. An absolute value |Δα.sub.50/100| of a difference between an average coefficient of thermal expansion α.sub.50/100 of the glass substrate and an average coefficient of thermal expansion of single-crystal silicon at 50° C. to 100° C., an absolute value |Δα.sub.100/200| of a difference between an average coefficient of thermal expansion α.sub.100/200 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 100° C. to 200° C., and an absolute value |Δα.sub.200/300| of a difference between an average coefficient of thermal expansion α.sub.200/300 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 200° C. to 300° C. are 0.16 ppm/° C. or less.

A method of manufacturing a semiconductor nanowire semiconductor device is described. The method includes forming an amorphous channel material layer on a substrate, patterning the channel material layer to form semiconductor nanowires extending in a lateral direction on the substrate, and forming a cover layer covering an upper of the semiconductor nanowire. The cover layer and the nanowire are patterned to form a trench exposing a side section of an one end of the semiconductor nanowire and a catalyst material layer is formed in contact with a side surface of the semiconductor nanowire, and metal induced crystallization (MIC) by heat treatment is performed to crystallize the semiconductor nanowire in a length direction of the nanowire from the one end of the semiconductor nanowire in contact with the catalyst material.

A pixel includes a pixel circuit and an organic light emitting diode. The pixel circuit has first, second, third, and fourth transistors. The first transistor controls an amount of current flowing from a first driving power supply coupled to a first node to a second driving power supply through the organic light emitting diode. The turns on when a scan signal is supplied to a first scan line. The third transistor turns on when a scan signal is supplied to a second scan line. The fourth transistor turns on when a scan signal is supplied to a third scan line. The first transistor is a p-type Low Temperature Poly-Silicon thin film transistor and the third transistor and the fourth transistor are n-type oxide semiconductor thin film transistors.

It is an object of the present invention to connect a wiring, an electrode, or the like formed with two incompatible films (an ITO film and an aluminum film) without increasing the cross-sectional area of the wiring and to achieve lower power consumption even when the screen size becomes larger. The present invention provides a two-layer structure including an upper layer and a lower layer having a larger width than the upper layer. A first conductive layer is formed with Ti or Mo, and a second conductive layer is formed with aluminum (pure aluminum) having low electric resistance over the first conductive layer. A part of the lower layer projected from the end section of the upper layer is bonded with ITO.

A method of manufacturing, with high mass productivity, liquid crystal display devices having highly reliable thin film transistors with excellent electric characteristics is provided. In a liquid crystal display device having an inverted staggered thin film transistor, the inverted staggered thin film transistor is formed as follows: a gate insulating film is formed over a gate electrode; a microcrystalline semiconductor film which functions as a channel formation region is formed over the gate insulating film; a buffer layer is formed over the microcrystalline semiconductor film; a pair of source and drain regions are formed over the buffer layer; and a pair of source and drain electrodes are formed in contact with the source and drain regions so as to expose a part of the source and drain regions.