FILM CAPACITOR

Abstract

A film capacitor includes first and second contact layers and a metallized dielectric film with first and second end faces and with first and second film sides. The first end face of the metallized dielectric film is connected to the first contact layer and the second end face is connected to the second contact layer. The metallized dielectric film has first, second and third metallization layers, with at least two of the metallization layers applied on the first film side of the metallized dielectric film and at least a further of the metallization layers applied on the second film side. The metallization layers are arranged on the film sides in such a manner that a first overlap with a first partial capacitance and a second overlap with a second partial capacitance are embodied between the metallization layers on the film sides, with the partial capacitances forming a series connection.

Claims

1.-15. (canceled)

6. A film capacitor, comprising: first and second contact layers; first and second metallized dielectric films arranged in succession, each said metallized dielectric film having first end face connected to the first contact layer, a second end face connected to the second contact layer, and first and second film sides; and first, second and third metallization layers, with at least two of the first, second and third metallization layers being applied on the first film side of the metallized dielectric film and a further one of the first, second and third metallization layers being applied on the second film side of the metallized dielectric film, said first, second and third metallization layers being arranged on the first and second film sides of the metallized dielectric film in such a manner that a first overlap with a first partial capacitance and a second overlap with a second partial capacitance are embodied between the first, second and third metallization layers on the first and second film sides, with the first and second partial capacitances forming a series connection, wherein the first metallization layer is electrically contacted with the first contact layer, the second metallization layer is electrically contacted with the second contact layer, and the third metallization layer is embodied as electrical contactless in relation to the first and second contact layers, wherein the at least two of the first, second and third metallization layers of the first and second metallized dielectric films are embodied in such a manner that one of the at least two of the first, second and third metallization layers of the first metallized dielectric film lies opposite in relation to the one of the at least two of the first, second and third metallization layers of the second metallized dielectric film, and the other one of the at least two of the first, second and third metallization layers of the first metallized dielectric film lies opposite in relation to the other one of the at least two of the first, second and third metallization layers of the second metallized dielectric film, and wherein the further one of the first, second and third metallization layers of the first and second metallized dielectric films have thicknesses which taper in a direction toward the first and second contact layers, respectively, along a length over which they are applied.

17. The film capacitor of claim 16, wherein the first and second metallization layers are applied on the first film side of the metallized dielectric film and the third metallization layer is applied on the second film side of the metallized dielectric film, with the first overlap being embodied between the first and third metallization layers of the first and second film sides of the metallized dielectric film, and with the second overlap being embodied between the second and third metallization layers of the first and second film sides of the metallized dielectric film.

18. The film capacitor of claim 16, further comprising a fourth metallization layer applied on one of the first or second film sides of the metallized dielectric film and embodied as electrical contactless in relation to the first, second and third metallization layers, wherein the fourth metallization layer is arranged such as to form a third overlap with a third partial capacitance between the first, second, third and fourth metallization layers on the first and second film sides of the metallized dielectric film, with the series connection of first and second partial capacitances being expanded by the third partial capacitance.

19. The film capacitor of claim 18, wherein the first and the fourth metallization layers are applied on the first film side of the metallized dielectric film, wherein the second and third metallization layers are applied on the second film side of the metallized dielectric film, with the second overlap embodied between the third and fourth metallization layers of the first and second film sides of the metallized dielectric film, and with the third overlap embodied between the second and fourth metallization layers of the first and second film skies of the metallized dielectric film.

20. The film capacitor of claim 16, wherein the first contact layer includes a first electrical terminal and the second contact layer includes a second electrical terminal.

21. The film capacitor of claim 16, wherein the third metallization layers of the first and second metallized dielectric films are embodied in such a manner that the third metallization layer of the first metallized dielectric film lies opposite in relation to the third metallization layer of the second metallized dielectric film.

22. The film capacitor of claim 18, wherein the fourth metallization layer of the first metallized dielectric film lies opposite in relation to the fourth metallization layer of the second metallized dielectric film.

23. The film capacitor of claim 16, wherein the first metallization layer of the first and second metallized dielectric films or the second metallization layer of the first and second metallized dielectric films tapers away from a respective one of the contacting first and second contact layers along a length over which it is applied.

24. The film capacitor of claim 18, wherein the fourth metallization layers of the first and second metallized dielectric films have thicknesses which taper respectively in a direction toward the first and second contact layers along a length over which they are applied.

25. The film capacitor of claim 16, wherein at least one of the first metallization layers of the first and second metallized dielectric films arranged in succession has, on the first end face thereof, at least one first recess for connecting to the first contact layer and/or at least one of the second metallization layers of the first and second metallized dielectric films arranged in succession has, on the second end face thereof, at least one second recess for connecting to the first contact layer.

26. The film capacitor of claim 25, wherein at least one of the first and second metallized dielectric films arranged in succession has, on the first end face thereof, at least one third recess for connecting to the first contact layer and/or at least one of the first and second metallized dielectric films arranged in succession has, on the second end face thereof, at least one fourth recess for connecting to the second contact layer.

27. The film capacitor of claim 16, further comprising a non-metallized dielectric film arranged between the two metallized dielectric films, said non-metallized dielectric film having third and fourth end faces, with the third end face of the non-metallized dielectric film connected to the first contact layer and the fourth end face of the non-metallized dielectric film connected to the second contact layer.

28. A filter, comprising a film capacitor, said film comprising first and second contact layers, first and second metallized dielectric films arranged in succession, each said metallized dielectric film having a first end face connected to the first contact layer, a second end face connected to the second contact layer, and first and second film sides, and first, second and third metallization layers, with at least two of the first, second and third metallization layers being applied on the first film side of the metallized dielectric film and a further one of the first, second and third metallization layers being applied on the second film side of the metallized dielectric film, said first, second and third metallization layers being arranged on the first and second film sides of the metallized dielectric film in such a manner that a first overlap with a first partial capacitance and a second overlap with a second partial capacitance are embodied between the first, second and third metallization layers on the first and second film sides, with the first and second partial capacitances forming a series connection, wherein the first metallization layer is electrically contacted with the first contact layer, the second metallization layer is electrically contacted with the second contact layer, and the third metallization layer is embodied as electrical contactless in relation to the first and second contact layers, wherein the at least two of the first, second and third metallization layers of the first and second metallized dielectric films are embodied in such a manner that one of the at least two of the first, second and third metallization layers of the first metallized dielectric film lies opposite in relation to the one of the at least two of the first, second and third metallization layers of the second metallized dielectric film, and the other one of the at least two of the first, second and third metallization layers of the first metallized dielectric film lies opposite in relation to the other one of the at least two of the first, second and third metallization layers of the second metallized dielectric film, and wherein the further one of the first, second and third metallization layers of the first and second metallized dielectric films have thicknesses which taper in a direction toward the first and second contact layers, respectively, along a length over which they are applied.

29. A converter, comprising a filter as set forth in claim 28 for operating an electric machine on an electrical network.

Description

[0051] The above-described characteristics, features and advantages of this invention, as well as the manner in which these are achieved, will become clearer and more readily understandable in connection with the following description of the exemplary embodiments, which are explained in more detail in conjunction with the figures, in which:

[0052] FIG. 1 shows a first schematic representation of a film capacitor according to the invention,

[0053] FIG. 2 shows a second schematic representation with a first exemplary embodiment of the film capacitor according to FIG. 1,

[0054] FIG. 3 shows a third schematic representation with a second exemplary embodiment of the film capacitor on the basis of FIG. 1,

[0055] FIG. 4 shows a fourth schematic representation with a third exemplary embodiment of the film capacitor according to FIG. 1, wherein various viewing levels are set on a second metallized dielectric film of the film capacitor,

[0056] FIG. 5 shows a fifth schematic representation with a fourth exemplary embodiment of the film capacitor according to FIG. 1, wherein various viewing levels are set on a first metallized dielectric film of the film capacitor and

[0057] FIG. 6 shows a sixth schematic representation of a converter, which has a filter with the film capacitor according to the invention.

[0058] FIG. 1 shows a first schematic representation of a film capacitor 1 according to the invention.

[0059] Four metallized dielectric films 3 are shown, which are at least mechanically connected to a first contact layer 7 in each case by means of their first end faces 9 and to a second contact layer 8 in each case by means of their second end faces 10. To this end, the first contact layer 7 has a first electrical terminal 13 and the second contact layer 8 has a second electrical terminal 14.

[0060] The four metallized dielectric films 3 in each case have a first and second metallization layer 45 on a first film side 11 and a third metallization layer 6 on a second film side 12.

[0061] The first metallization layer 4 of the four metallized dielectric films 3 is in each case electrically connected to the first contact layer 7 and the second metallization layer 5 of the four metallized dielectric films 3 is in each case electrically connected to the second contact layer 8.

[0062] The third metallization layer 6 of the four metallized dielectric films 3 is in each case arranged in a contactless manner in relation to the first and second contact layer 7,8.

[0063] Three pairs are shown, with a first and second metallized dielectric film 3a,3b in each case, wherein the first and second metallized dielectric films 3a,3b of the three pairs are arranged in succession and in each case are embodied as metallized dielectric films 3.

[0064] Of the three pairs, in two pairs in each case two third metallization layers 6 lie opposite one another, and in the third pair in each case two first and second metallization layers 4,5 lie opposite one another.

[0065] In each case, an air gap 16 is embodied between the first and second metallized dielectric film 3a,3b of the three pairs.

[0066] The thicknesses of the first and second metallization layers 4,5 of the three pairs of the first and second metallized dielectric films 3a,3b taper away from the contact layers 7,8 contacted with them along the length over which they are applied.

[0067] The thickness of the third metallization layers 6 of the three pairs of the first and second metallized dielectric films 3a,3b taper in the direction of the contact layers 7,8 in each case along the length over which they are applied.

[0068] By way of example, on one of the first metallized dielectric films 3a, a first overlap 33 with a first partial capacitance 35 is embodied between the first metallization layer 4 and the third metallization layer 6 and a second overlap 34 is embodied between the second metallization layer 5 and the third metallization layer 6 with a second partial capacitance 36, wherein the two partial capacitances 35,36 form a series connection.

[0069] A second schematic representation with a first exemplary embodiment of the film capacitor 1 according to FIG. 1 is shown in FIG. 2.

[0070] FIG. 2 corresponds to FIG. 1, wherein a non-metallized dielectric film 2 is arranged between each of the metallized dielectric films 3.

[0071] The non-metallized dielectric films 2 are at least mechanically connected on their third end face 17 to the first contact layer 7 and with their fourth end face 18 to the second contact layer 8.

[0072] By means of FIG. 3, a second exemplary embodiment of the film capacitor 1 on the basis of FIG. 1 is shown in a third schematic representation.

[0073] Four metallized dielectric films 3 are also shown in FIG. 3, which are at least mechanically connected to a first contact layer 7 in each case by means of their first end faces 9 and to a second contact layer 8 in each case by means of their second end faces 10. To this end, the first contact layer 7 has a first electrical terminal 13 and the second contact layer 8 has a second electrical terminal 14.

[0074] The four metallized dielectric films 3 in each case have a first and fourth metallization layer 4,15 on a first film side 11 and a second and third metallization layer 5,6 on a second film side 12.

[0075] The first metallization layer 4 of the four metallized dielectric films 3 is in each case electrically connected to the first contact layer 7 and the second metallization layer 5 of the four metallized dielectric films 3 is in each case electrically connected to the second contact layer 8.

[0076] The third and fourth metallization layer 6,15 of the four metallized dielectric films 3 are in each case arranged in a contactless manner in relation to the first and second contact layer 7,8.

[0077] Three pairs are shown, with a first and second metallized dielectric film 3a,3b in each case, wherein the first and second metallized dielectric films 3a,3b of the three pairs are arranged in succession and in each case are embodied as metallized dielectric films 3.

[0078] Of the three pairs, in two pairs in each case two second and third metallization layers 5,6 lie opposite one another, and in the third pair in each case two first and fourth metallization layers 4,15 lie opposite one another.

[0079] In each case, an air gap 16 is embodied between the first and second metallized dielectric film 3a,3b of the three pairs.

[0080] A tapered representation of the metallization layers 4,5,6,15 of the four metallized dielectric films 3 is dispensed with in FIG. 3, which does not mean that they may not exist in this exemplary embodiment.

[0081] By way of example, on one of the first metallized dielectric films 3a, a first overlap 33 with a first partial capacitance 35 is embodied between the first metallization layer 4 and the third metallization layer 6, a second overlap 340 is embodied between the third metallization layer 6 and the fourth metallization layer 15 with a second partial capacitance 360 and a third overlap 37 is embodied between the fourth metallization layer 15 and the second metallization layer 5 with a third partial capacitance 38, wherein the three partial capacitances 35,360,38 form a series connection.

[0082] In a fourth schematic representation, FIG. 4 visualizes a third exemplary embodiment of the film capacitor 1 according to FIG. 1, wherein various viewing levels are set on a second metallized dielectric film 3b of the film capacitor 1.

[0083] Shown in a cross-sectional view are a first and a second metallized dielectric film 3a,3b, which are arranged in succession and in each case are embodied as metallized dielectric films 3.

[0084] The first and second metallized dielectric film 3a,3b are at least mechanically connected to a first contact layer 7 in each case by means of their first end faces 9 and to a second contact layer 8 in each case by means of their second end faces 10.

[0085] The two dielectric films 3a,3b in each case have a first and second metallization layer 45 on a first film side 11 and a third metallization layer 6 on a second film side 12.

[0086] The first metallization layer 4 of the two dielectric films 3a,3b is in each case electrically connected to the first contact layer 7 and the second metallization layer 5 of the two dielectric films 3a,3b is in each case electrically connected to the second contact layer 8.

[0087] The third metallization layer 6 of the two dielectric films 3a,3b is in each case arranged in a contactless manner in relation to the first and second contact layer 7,8.

[0088] The two first and second metallization layers 4,5 in each case of the two dielectric films 3a,3b lie opposite one another.

[0089] The thicknesses of the first and second metallization layers 4,5 of the first and second metallized dielectric films 3a,3b taper away from the contact layers 7,8 contacted with them along the length over which they are applied.

[0090] The thicknesses of the third metallization layers 6 of the first and second metallized dielectric films 3a,3b taper in the direction of the contact layers 7,8 in each case along the length over which they are applied.

[0091] Looking at the second metallized dielectric film 3b, a first overall view 29 has been chosen, which in addition to the cross-sectional view of the second metallized dielectric film 3b also shows a top view of the second metallized dielectric film 3b in a first view 27 and a bottom view of the second metallized dielectric film 3b in a second view 28. These two views 27,28 are also visualized on the cross-sectional view of the second metallized dielectric film 3b by means of an arrow for the first view 27 as top view and a further arrow for the second view 28 as bottom view.

[0092] The first view 27 as top view of the second metallized dielectric film 3b shows the first metallization layer 4, which is electrically and mechanically connected to the first contact layer 7 by means of two first recesses 19.

[0093] The second metallized dielectric film 3b, at the location of the two first recesses 19 of the first metallization layer 4, likewise has recesses, which however are hidden behind the two first recesses 19 of the first metallization layer 4.

[0094] The second metallization layer 5 is electrically and mechanically connected to the second contact layer 8 and in this exemplary embodiment has no recesses.

[0095] The second view 28 as bottom view of the second metallized dielectric film 3b shows the third metallization layer 6, which is arranged in an electrical contactless manner in relation to the first and second contact layer 7,8.

[0096] The second metallized dielectric film 3b is at least mechanically connected to the first contact layer 7 by means of two third recesses 21.

[0097] The recesses of the first metallization layer, at the location of the two third recesses 21 of the second metallized dielectric film 3b, likewise have recesses, which however are hidden behind the two third recesses 21 of the second metallized dielectric film 3b.

[0098] The second metallized dielectric film 3b is at least mechanically connected to the second contact layer 8 and in this exemplary embodiment has no recesses.

[0099] In a fifth schematic representation, FIG. 5 visualizes a fourth exemplary embodiment of the film capacitor 1 according to FIG. 1 and FIG. 4, wherein various viewing levels are set on a first metallized dielectric film 3a of the film capacitor 1.

[0100] FIG. 5 shows the same representation of the first and second metallized dielectric films 3a,3b as in FIG. 4, but in a different perspective.

[0101] Shown in the cross-sectional view are the first and second metallized dielectric film 3a,3b, which are arranged in succession and in each case are embodied as metallized dielectric films 3.

[0102] The first and second metallized dielectric film 3a,3b are at least mechanically connected to the first contact layer 7 in each case by means of their first end faces 9 and to the second contact layer 8 in each case by means of their second end faces 10.

[0103] The two dielectric films 3a,3b in each case have the first and second metallization layer 4,5 on the first film side 11 and the third metallization layer 6 on the second film side 12.

[0104] The first metallization layer 4 of the two dielectric films 3a,3b is in each case electrically connected to the first contact layer 7 and the second metallization layer 5 of the two dielectric films 3a,3b is in each case electrically connected to the second contact layer 8.

[0105] The third metallization layer 6 of the two dielectric films 3a,3b is in each case arranged in a contactless manner in relation to the first and second contact layer 7,8.

[0106] The two first and second metallization layers 4,5 in each case of the two dielectric films 3a,3b lie opposite one another.

[0107] The thicknesses of the first and second metallization layers 4,5 of the first and second metallized dielectric films 3a,3b taper away from the contact layers 7,8 contacted with them along the length over which they are applied.

[0108] The thicknesses of the third metallization layers 6 of the first and second metallized dielectric films 3a,3b taper in the direction of the contact layers 7,8 in each case along the length over which they are applied.

[0109] Looking at the first metallized dielectric film 3a, a second overall view 32 has been chosen, which in addition to the cross-sectional view of the first metallized dielectric film 3a also shows a top view of the first metallized dielectric film 3a in a third view 30 and a bottom view of the first metallized dielectric film 3a in a fourth view 31. These two views 30,31 are also visualized on the cross-sectional view of the first metallized dielectric film 3a by means of an arrow for the third view 30 as top view and a further arrow for the fourth view 31 as bottom view.

[0110] The third view 30 as bottom view of the first metallized dielectric film 3a shows the third metallization layer 6, which is arranged in an electrical contactless manner in relation to the first and second contact layer 7,8.

[0111] The first metallized dielectric film 3a is at least mechanically connected to the second contact layer 8 by means of two fourth recesses 22.

[0112] The recesses of the second metallization layer, at the location of the two fourth recesses 22 of the first metallized dielectric film 3a, likewise have recesses, which however are hidden behind the two fourth recesses 22 of the first metallized dielectric film 3a.

[0113] The first metallized dielectric film 3a is at least mechanically connected to the second contact layer 7 and in this exemplary embodiment has no recesses.

[0114] The fourth view 31 as bottom view of the first metallized dielectric film 3a shows the second metallization layer 5, which is electrically and mechanically connected to the second contact layer 8 by means of two second recesses 20.

[0115] The first metallized dielectric film 3a, at the location of the two second recesses 20 of the second metallization layer 5, likewise has recesses, which however are hidden behind the two second recesses 20 of the second metallization layer 5.

[0116] The first metallization layer 4 is electrically and mechanically connected to the second contact layer 8 and in this exemplary embodiment has no recesses.

[0117] In a sixth schematic representation, FIG. 6 shows a converter 24, which has a filter 23 with the film capacitor 1 according to the invention.

[0118] The filter 23 may be integrated in the converter 24 or, for example, also may be electrically interconnected between the electrical network 26 and the converter 24 or the electric machine 25 and the converter 24. In FIG. 6, it is interconnected in a three-phase system, by way of example.

[0119] The converter 24 is connected to an electrical network 26 and operates electric machine 25.