Composite dielectric ceramic material having anti-reduction and high temperature stability characteristics and method for preparing same
10155697 ยท 2018-12-18
Assignee
Inventors
- Sea-Fue Wang (Taipei, TW)
- Jian-Hua LI (Taipei, TW)
- Yen-Po Hung (Taipei, TW)
- Yuan-Cheng Lai (Taoyuan County, TW)
Cpc classification
C04B35/63416
CHEMISTRY; METALLURGY
C04B2235/96
CHEMISTRY; METALLURGY
C04B2235/3201
CHEMISTRY; METALLURGY
C04B2235/3208
CHEMISTRY; METALLURGY
C04B2235/3251
CHEMISTRY; METALLURGY
C04B2235/3206
CHEMISTRY; METALLURGY
C04B2235/3203
CHEMISTRY; METALLURGY
C04B2235/3215
CHEMISTRY; METALLURGY
C04B2235/80
CHEMISTRY; METALLURGY
C04B2235/3231
CHEMISTRY; METALLURGY
C04B2235/3255
CHEMISTRY; METALLURGY
C04B2235/3436
CHEMISTRY; METALLURGY
H01G4/1254
ELECTRICITY
C04B2235/3418
CHEMISTRY; METALLURGY
C04B2235/3262
CHEMISTRY; METALLURGY
C04B2235/3232
CHEMISTRY; METALLURGY
C04B2235/3229
CHEMISTRY; METALLURGY
C04B35/495
CHEMISTRY; METALLURGY
International classification
C04B35/626
CHEMISTRY; METALLURGY
C04B35/495
CHEMISTRY; METALLURGY
Abstract
A composite dielectric ceramic material having anti-reduction and high temperature stability characteristics includes the main component of (1-x)(BaTiO.sub.3)-x(Ba.sub.2LiTa.sub.5O.sub.15) formulated in accordance with the relative molar ratio of up to 100 mole composite dielectric ceramics and a predetermined ratio of one or multiple oxide subcomponents corresponding to 100 moles of the main component. The oxide subcomponents of Li.sub.2TiO.sub.3, BaSiO.sub.3, (Ba.sub.0.6Ca.sub.0.4)SiO.sub.3 and SiO.sub.2 can be used as sintering aids to provide a sintering promotion effect. The oxide subcomponents of CaO, MnO, MgO can also be selected used to improve dielectric stability. More particularly, CaO has the advantages of improving the anti-reduction ability and increasing the coefficient of resistance. Therefore, with the adding of the oxide subcomponents and their interactions, the rate of change of the TCC curve of the composite dielectric ceramic material (1-x)(BaTiO.sub.3)-x(Ba.sub.2LiTa.sub.5O.sub.15) in the temperature range of 55 C.200 C. is significantly inhibited, and its dielectric constant (k-values) is also well improved.
Claims
1. A composite dielectric ceramic material comprising: main components of BaTiO.sub.3 and Ba.sub.2LiTa.sub.5O.sub.15; and Li.sub.2TiO.sub.3 to improve the dielectric characteristics of said main components, an amount of said Li.sub.2TiO.sub.3 is in the range of 0.130 moles corresponding to 100 moles of said main components.
2. The composite dielectric ceramic material as claimed in claim 1, further comprising a unary oxide selected from the group of MnO, MgO, CaO, SiO.sub.2 and their combinations, the added amount of said unary oxide is in the range of 0.110.0 moles.
3. The composite dielectric ceramic material as claimed in claim 2, wherein the rate of change of the TCC curve in the temperature range of 150200 C. is between 15.0%.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1)
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(3)
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(8)
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
(9) Referring to
(10) Referring to
(11) The well mixed dielectric ceramic powder is then dried at 80 C. Thereafter, prepare a ceramic embryogenic tablet by: adding 5 wt % polyvinyl alcohol (PVA) aqueous binder (water solution prepared by 15 wt % PVA and 85 wt % pure water) to the prepared dielectric ceramic powder, and then well mixing the applied materials to enhance powder formability, and then using a 80 mesh stainless steel screen prepared subject to the specifications of American Society for Testing and Materials (ASTM) to screen the powder material, and then taking 0.4 g of the screened powder to cast a round embryogenic tablet of diameter 10 mm using an uniaxial molding method, and then heating the round embryogenic tablet under the atmosphere environment at 550 C. for 4 hours (at the heating rate of 5 C./min) to burn out polyvinyl alcohol (PVA) aqueous binder, and then sintering the round embryogenic tablet under a reducing atmosphere composed of 98% N.sub.2-2% H.sub.2 and 35 C. saturated water vapor at 1000 C.1400 C. (at the heating rate of 5 C./min) for 2 hours, and then applying an reoxidation heat treatment to the sintered ceramic body under 60 ppm150 ppm or the atmospheric environment at 900 C.1050 C. (at the heating rate of 5 C./min), and then using a screen-printing technique to print Ag, Cu or Ni on the sintered ceramic body so as to form an electrode on each of two opposite parallel sides of the sintered ceramic body. Tablet type capacitor samples (see
(12) TABLE-US-00002 TABLE 2 Formula & Dielectric Characteristic Table EIA Sample Spec. BaTiO.sub.3 Ba.sub.2LiTa.sub.5O.sub.15 Li.sub.2TiO.sub.3 BaSiO.sub.3 (Ba.sub.0.6Ca.sub.0.4)SiO.sub.3 MgO MnO 1 X8S 97.00 3.00 2 X8R 95.00 5.00 3 X9R 90.00 10.00 4 X9R 87.50 12.50 5 X9R 85.00 15.00 6 X9R 80.00 20.00 7 X9S 74.00 26.00 8 X9T 70.00 30.00 9 X9T 60.00 40.00 10 X9T 50.00 50.00 11 X8R 97.73 2.27 4.55 12 X8R 96.34 3.66 7.32 13 X8R 94.74 5.26 1.00 14 X8R 94.74 5.26 3.00 15 X8R 94.74 5.26 5.00 16 X8R 94.74 5.26 7.00 17 X8R 94.74 5.26 10.53 18 X9R 92.86 7.14 14.29 19 X9R 92.01 7.99 15.98 20 X9R 87.93 12.07 24.14 21 X8R 94.74 5.26 2.31 22 X7R 94.74 5.26 4.62 23 X8R 94.74 5.26 2.25 24 X8R 94.74 5.26 4.50 25 X8R 97.73 2.27 1.70 26 X8R 94.74 5.26 3.95 27 X9R 92.01 7.99 15.98 28 X9R 92.01 7.99 15.98 29 X8R 92.01 7.99 15.98 30 X8R 90.62 9.38 7.04 31 X8R 92.86 7.14 4.28 1.00 32 X8R 92.86 7.14 4.28 1.50 33 X9R 92.01 7.99 15.98 2.00 34 X9R 92.01 7.99 15.98 4.00 35 X9R 96.34 3.66 7.32 1.00 36 X9S 96.34 3.66 7.32 2.00 37 X9S 92.86 7.14 4.28 0.50 38 X9R 92.86 7.14 14.29 0.25 39 X9R 92.86 7.14 14.29 0.50 40 X8R 92.86 7.14 4.50 0.50 41 X8R 92.86 7.14 4.50 1.00 42 X8R 92.86 7.14 4.50 1.50 43 X8R 94.74 5.26 3.95 0.50 44 X9S 94.74 5.26 1.00 45 X9R 94.74 5.26 3.29 1.00 46 X9R 94.74 5.26 6.58 1.00 47 X9R 94.74 5.26 10.53 1.00 48 X9S 94.74 5.26 10.53 1.00 49 X8R 94.74 5.26 10.53 1.00 50 X9R 92.86 7.14 4.28 0.50 51 X9R 92.86 7.14 4.28 1.00 0.20 55 C. 125 C. 150 C. 200 C. Sample CaO K 25 C. DF TCC TCC TCC TCC 1 1076 0.5% 4.2% 13.2% 20.3% 47.5% 2 571 0.4% 4.6% 10.6% 13.5% 35.5% 3 150 0.2% 7.1% 6.8% 8.9% 14.9% 4 116 0.7% 5.4% 6.9% 9.0% 14.4% 5 312 0.5% 5.8% 3.1% 3.1% 7.3% 6 252 0.3% 9.2% 8.6% 5.6% 8.6% 7 206 0.2% 12.3% 11.5% 12.5% 16.3% 8 192 0.1% 16.3% 13.3% 16.1% 21.6% 9 219 0.6% 17.4% 13.6% 16.5% 21.9% 10 212 1.0% 17.7% 16.7% 18.6% 25.5% 11 1665 1.5% 11.8% 12.0% 1.3% 34.4% 12 1346 1.2% 6.7% 4.2% 4.9% 27.6% 13 569 0.4% 3.1% 2.0% 9.9% 36.4% 14 755 0.5% 3.8% 2.5% 5.2% 32.1% 15 870 0.6% 1.0% 0.4% 2.6% 34.3% 16 903 1.0% 2.0% 2.6% 3.9% 32.8% 17 1088 1.1% 6.8% 5.5% 7.2% 22.5% 18 895 1.0% 3.0% 3.7% 6.0% 14.8% 19 831 0.9% 1.9% 0.3% 3.0% 13.0% 20 554 1.0% 4.5% 4.2% 0.4% 0.9% 21 961 2.2% 11.1% 3.5% 2.5% 27.4% 22 1304 1.8% 10.5% 2.3% 44.0% 24.6% 23 933 0.5% 7.0% 0.7% 2.0% 29.2% 24 1040 0.7% 7.9% 0.8% 2.8% 33.2% 25 2.00 1609 1.0% 8.7% 3.9% 3.9% 46.6% 26 2.00 1116 0.8% 7.9% 1.0% 3.5% 36.6% 27 2.00 803 0.8% 3.0% 1.4% 4.2% 11.9% 28 4.00 776 0.6% 1.6% 0.7% 1.9% 14.5% 29 10.00 659 0.5% 1.2% 4.8% 5.0% 21.3% 30 2.00 554 0.6% 0.7% 5.4% 6.9% 26.5% 31 754 0.7% 3.1% 1.9% 0.8% 19.4% 32 672 0.5% 3.7% 4.8% 3.8% 15.9% 33 709 0.8% 1.5% 0.6% 2.7% 7.1% 34 532 1.0% 1.3% 0.4% 3.0% 0.4% 35 940 1.6% 3.5% 11.6% 13.2% 11.0% 36 785 2.0% 2.2% 13.6% 18.0% 5.9% 37 705 0.7% 3.0% 2.9% 2.2% 18.0% 38 720 1.0% 1.9% 0.5% 3.2% 13.0% 39 698 1.3% 1.2% 5.1% 8.7% 7.3% 40 652 0.6% 7.2% 1.1% 0.6% 27.1% 41 677 0.7% 7.1% 0.4% 3.4% 28.7% 42 638 0.5% 6.5% 0.1% 2.0% 27.4% 43 2.00 1049 0.6% 3.6% 5.8% 2.3% 26.7% 44 2.00 4720 5.4% 15.8% 9.2% 9.2% 14.6% 45 2.00 912 0.5% 2.2% 4.2% 5.9% 18.6% 46 2.00 851 0.7% 0.1% 8.6% 10.1% 11.6% 47 2.00 952 1.1% 4.4% 7.5% 9.3% 9.0% 48 4.00 891 0.5% 5.3% 6.1% 6.3% 16.7% 49 8.00 771 0.5% 2.9% 1.7% 0.3% 24.0% 50 2.00 730 0.9% 1.2% 5.2% 5.6% 13.1% 51 789 1.0% 0.1% 5.9% 4.4% 12.7%
(13) TABLE-US-00003 TABLE 3 Formula & Dielectric Characteristic Table EIA 55 C. 150 C. 200 C. Resistivity Sample Spec. BaTiO.sub.3 Ba.sub.2LiTa.sub.5O.sub.15 Li.sub.2CO.sub.3 SiO.sub.2 CaO K 25 C. DF TCC TCC TCC (-cm) 19 X9R 92.01 7.99 15.98 831 0.9% 1.9% 3.0% 13.0% 0.62 10.sup.10 27 X9R 92.01 7.99 15.98 2.00 803 0.8% 3.0% 4.2% 11.9% 3.6 10.sup.10 28 X9R 92.01 7.99 15.98 4.00 776 0.6% 1.6% 1.9% 14.5% 5.9 10.sup.10 29 X8R 92.01 7.99 15.98 10.00 659 0.5% 1.2% 5.0% 21.3% 16.0 10.sup.10 52 X8R 94.74 5.26 3.00 2.00 1044 0.4% 5.2% 6.2% 34.8% 1.5 10.sup.10 53 X8R 94.74 5.26 3.00 1.00 2.00 1123 0.6% 6.58% 4.8% 33.3% 1.9 10.sup.10 54 X8R 94.74 5.26 3.00 1.50 2.00 1128 0.6% 5.7% 5.7% 33.5% 4.0 10.sup.10
(14) Referring to
(15) Referring to
(16) From the dielectric ceramic material samples numbers 16 illustrated in
(17) Referring to Table 2 and
(18) Further, in the example of 100 moles composite dielectric ceramic material with 94.74 moles BaTiO.sub.3 and 5.26 moles Ba.sub.2LiTa.sub.5O.sub.15 where BaSiO.sub.3 was used as oxide subcomponent, as indicated in Table 2, sample numbers 2122, when the ratio of the oxide subcomponent BaSiO.sub.3 was increased from 2.31 moles to 4.62 moles, the dielectric constant (k-value) was relatively increased from 961 to 1304 and the temperature coefficient of capacitance (TCC) value at 200 C. was relatively increased with the increase in the added amount. Although increasing the amount of the oxide subcomponent BaSiO.sub.3 can effectively promote the low temperature sintering densification, the temperature coefficient of capacitance (TCC) value at 150 C. surpassed over +15% when 4.62 moles BaSiO.sub.3 was added, the overall TCC curve simply falls within the norms of the EIA-X7R specification.
(19) Similarly, when (Ba.sub.0.6Ca.sub.0.4)SiO.sub.3 was used as an oxide subcomponent, as indicated in Table 2, sample numbers 2324, it achieved the same effect of lifting the dielectric constant (k-value). When the added amount of oxide subcomponent (Ba.sub.0.6Ca.sub.0.4)SiO.sub.3 was increased from 2.25 moles to 4.50 moles, the dielectric constant (k-value) simply lifted from 933 to 1040; unlike the adding of BaSiO.sub.3, increasing the added amount of (Ba.sub.0.6Ca.sub.0.4)SiO.sub.3 still enabled the overall TCC curve to fall within the norms of the EIA-X8R specification while the dielectric loss factor (DF) value was maintained below 1.0%. In short, selecting (Ba.sub.0.6Ca.sub.0.4)SiO.sub.3 as oxide subcomponent is better than BaSiO.sub.3 in dielectric temperature stability.
(20) In the samples illustrated in Table 2, first, second and third oxide subcomponents were used to define each subcomponent, i.e., except the use of one unary oxide subcomponent, a second oxide subcomponent or two or more than two other oxide subcomponents can be added. For example, samples 12, 18, 19, 3336 and 3839 illustrated in Table 2 and
(21) Referring to Table 2 and
(22) Referring to Table 2 and
(23) Further, as indicated by samples 19 and 2729 shown in Table 2 and
(24) Further, according to samples 19 and 2729 as illustrated in Table 3, an increase in the added amount of the second oxide subcomponent CaO, we can observed a continuous increase in the resistivity. Samples 2729 were based on sample 19 with 2 moles, 4 moles and 10 moles second oxide subcomponent CaO respectively added. With the adding of the said different amounts of the second oxide subcomponent CaO, the resistivity was increased from 0.6210.sup.10 -cm to 3.610.sup.10 -cm, 5.910.sup.10 -cm and 16.010.sup.10 -cm respectively. However, to avoid a large decline in dielectric constant (k-value), the amount of CaO should be between 0.1 to 10.0 moles and should not exceed 10.0 moles.
(25) Further, according to samples 52, 53 and 54 illustrated in Table 3, using SiO.sub.2 as oxide subcomponent can also achieve the effects of maintaining the dielectric constant (k-value) and increasing the coefficient of resistance. Sample 52 contained main components 94.74 moles BaTiO.sub.3-5.26 moles Ba.sub.2LiTa.sub.5O.sub.15, a first oxide subcomponent 3 moles Li.sub.2TiO.sub.3 and a second oxide subcomponent 2 moles CaO. Samples 5354 were based on sample 52 with 1 mole and 1.5 moles third oxide subcomponent SiO.sub.2 respectively added. With the adding of the said different amounts of the third oxide subcomponent SiO.sub.2, the resistivity was increased from 1.510.sup.10 -cm to 1.910.sup.10 -cm and 4.010.sup.10 -cm respectively, achieving the effects of promoting sintering densification, improving the anti-reduction ability, enhancing dielectric temperature stability and avoiding deterioration and failure due to dielectric loss.
(26) Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims.