A dielectric composition that contains a first complex oxide represented by (Bi.sub.xNa.sub.1−x)TiO.sub.3—CaTiO.sub.3 and having a perovskite structure as a main component; and at least one second complex oxide having a perovskite structure selected from the group consisting of BaZrO.sub.3, SrZrO.sub.3, CaZrO.sub.3, NaNbO.sub.3, and NaTaO.sub.3 as an auxiliary component. A tolerance factor t when the at least one second complex oxide is BaZrO.sub.3, NaNbO.sub.3, or NaTaO.sub.3 is 0.9016≤t≤0.9035, a tolerance factor t when the at least one second complex oxide is SrZrO.sub.3 is 0.9005≤t≤0.9025, and a tolerance factor t when the at least one second complex oxide is CaZrO.sub.3 is 0.9000 t<0.9020.

A ceramic electronic device includes a dielectric layer and an internal electrode layer that are alternately stacked, wherein the dielectric layer contains yttria-stabilized zirconia and (Ca.sub.x1Ba.sub.x2Sr.sub.1-x1-x2)(Ti.sub.yZr.sub.1-y)O.sub.3 (0.6≤x1≤0.9, 0≤x2≤0.1, 0≤y≤0.1) as a main component, and wherein, in the dielectric layer, a concentration of the yttria-stabilized zirconia when a total amount of Ti and Zr is 100 mol % is 0.5 mol % or more and 5.0 mol % or less.

A multilayer ceramic capacitor includes a multilayer body including dielectric layers, inner-electrode layers, and outer electrodes coupled to the inner-electrode layers. The multilayer body includes Ba, Ti, Ca, Mg, Zr, and R, and when the Ti content is defined as 100 parts by mole, the relative amounts are as follows: Ca, 0.03 parts by mole or more and 0.15 parts by mole or less, Mg, 0.01 parts by mole or more and 0.09 parts by mole or less, R, 2.5 parts by mole or more and 8.4 parts by mole or less; Zr, 0.05 parts by mole or more and 3.00 parts by mole or less: Si, 0.5 parts by mole or more and 4.0 parts by mole or less; and P, 0.005 parts by mole or more and 0.500 parts by mole or less. Ca is in a vicinity of the center of crystal grains contained in the dielectric layers.

A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, the internal electrode layers being alternately exposed to two edge faces of the multilayer chip facing each other, and a pair of external electrodes respectively formed on the two edge faces so as to be connected to the internal electrode layers exposed on the respective edge faces, each external electrode extending to at least one side face of the multilayer chip, wherein in the multilayer chip, oxides including Zn and Ni are present around the internal electrode layer in a vicinity of a connection part connecting the internal electrode layer to the external electrode.

A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, the internal electrode layers being alternately exposed to two edge faces of the multilayer chip facing each other, and a pair of external electrodes respectively formed on the two edge faces so as to be connected to the internal electrode layers exposed on the respective edge faces, each external electrode extending to at least one side face of the multilayer chip, wherein in the multilayer chip, oxides including Zn and Ni are present around the internal electrode layer in a vicinity of a connection part connecting the internal electrode layer to the external electrode.

The present invention provides a leadless stacked ceramic capacitor. the capacitor body are respectively provided with internal electrode terminals. The part forms an electrical connection with the external electrodes, and a plurality of multilayer ceramic capacitors are vertically stacked, and the two adjacent external electrodes are cured to form an adhesive interface by polymer conductive adhesive, and the polymer conductive adhesive includes 75%˜85% metal powder and 15%˜25% viscose provide support strength and conductive channels.

The present invention provides a leadless stacked ceramic capacitor. the capacitor body are respectively provided with internal electrode terminals. The part forms an electrical connection with the external electrodes, and a plurality of multilayer ceramic capacitors are vertically stacked, and the two adjacent external electrodes are cured to form an adhesive interface by polymer conductive adhesive, and the polymer conductive adhesive includes 75%˜85% metal powder and 15%˜25% viscose provide support strength and conductive channels.

A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and first and second external electrodes disposed outside of the ceramic body and connected to the first and second internal electrodes, respectively. The ceramic body includes an active portion including of the first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween to form capacitance, and a cover portion disposed in upper and lower portions of the active portion. The cover portion has a larger number of pores than the dielectric layer of the active portion, and the cover portion includes a ceramic-polymer composite filled with a polymer in the pores of the cover portion.

A ceramic electronic component includes a body, including a dielectric layer and an internal electrode. The dielectric layer includes a plurality of dielectric grains, and at least one of the plurality of dielectric grains has a core-dual shell structure having a core and a dual shell. The dual shell includes a first shell, surrounding at least a portion of the core, and a second shell, surrounding at least a portion of the first shell. The dual shell includes different types of rare earth elements R1 and R2, and R2.sub.S1/R1.sub.S1 is 0.01 or less and R2.sub.S2/R1.sub.S1 is 0.5 to 3.0, where R1.sub.S1 and R1.sub.S2 denote concentrations of R1 included in the first shell and the second shell, respectively, and R2.sub.S1 and R2.sub.S2 denote concentrations of R2 included in the first shell and the second shell, respectively.

A multilayer capacitor includes a body having a plurality of dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and further including an active region in which the first and second internal electrodes overlap each other, and upper and lower covers disposed above and below the active region, respectively; and first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively, wherein the upper and lower covers include barium titanate (BT, BaTiO.sub.3) and Yttria-stabilized zirconia (YSZ).