Method for manufacturing electronic device

Abstract

Provided is a method of manufacturing an electronic device. An electronic device having excellent moisture blocking property and durability may be provided by the method.

Claims

1. A method of manufacturing an organic electronic device, comprising: laminating an encapsulating film onto a surface of the organic electronic device, wherein the encapsulating film is formed by a first layer comprising a first adhesive component and a second layer comprising a second adhesive component, wherein the first and second adhesive components are different, and the laminating comprising placing the encapsulating film onto the organic electronic device such that the second layer is in contact with the organic electronic device, and the first layer is not in contact with the organic electronic device, wherein the first adhesive component of the first layer comprises polyisobutene resin, the first layer further comprising a tackifier, and wherein the first layer comprises 5 to 250 parts by weight of a moisture scavenger relative to 100 parts by weight of the first adhesive component; and wherein the second layer comprises less than 5 parts by weight of the moisture scavenger relative to 100 parts by weight of a solid content of the second layer.

2. The method according to claim 1, wherein the laminating of the second layer to be in contact with the organic electronic device includes contacting the second layer with the organic electronic device and heating the second layer.

3. The method according to claim 2, wherein the second layer is in contact with the organic electronic device to cover an entire surface of the organic electronic device.

4. The method according to claim 3, wherein the organic electronic device is formed on a bottom substrate and the second layer is in contact with the organic electronic device to cover an entire surface of the organic electronic device and at least a part of the bottom substrate.

5. The method according to claim 2, wherein the second layer is solid or semi-solid at room temperature, and heated to maintain a viscosity of 10.sup.3 to 10.sup.5 Pas at the time to be in contact with the organic electronic device.

6. The method according to claim 2, wherein the heating is performed at 40 to 100? C.

7. The method according to claim 1, wherein the laminating of the second layer on the organic electronic device to be in contact with the organic electronic device is performed in a vacuum state.

8. The method according to claim 7, wherein the laminating of the second layer on the organic electronic device to be in contact with the organic electronic device is performed using a vacuum press.

9. The method according to claim 1, further comprising: curing the second layer after the second layer is laminated on the organic electronic device to be in contact with the organic electronic device.

10. The method according to claim 9, wherein the curing of the second layer is performed such that the second layer has a glass transition temperature of 0? C. or more after curing.

11. The method according to claim 1, further comprising: transferring the first layer to an upper substrate before the second layer is laminated on the organic electronic device to be in contact with the organic electronic device.

12. The method according to claim 11, wherein the transferring of the first layer to the upper substrate is performed by contacting the first layer with the upper substrate and performing roll lamination.

13. The method according to claim 1, wherein the organic electronic device is an organic light emitting diode.

14. The method according to claim 1, wherein the moisture scavenger comprises a metal oxide, a sulphate, an organic metal oxide, or a combination thereof.

15. The method according to claim 14, wherein the moisture scavenger comprises magnesium oxide, calcium oxide, strontium oxide, barium oxide, aluminum oxide, magnesium sulphate, sodium sulphate, nickel sulphate, aluminum oxide octylate, or a combination thereof.

16. The method according to claim 14, wherein the moisture scavenger comprises calcined dolomite.

17. The method according to claim 14, wherein the first layer further comprises a moisture blocker.

18. The method according to claim 1, wherein the second layer comprises a moisture blocker.

19. The method according to claim 1, wherein the first adhesive component has a contact angle of 80? or more with respect to deionized water.

20. The method according to claim 1, wherein the first adhesive component has a water vapor transmission rate of 50 g/m.sup.2 day or less.

21. The method according to claim 1, wherein the first adhesive component has a weight average molecular weight of 100,000 to 2,000,000.

22. The method according to claim 1, wherein the tackifier comprises a hydrogenated petroleum.

23. The method according to claim 1, wherein the second adhesive component of the second layer comprises a silane-modified epoxy resin.

24. The method according to claim 1, wherein the second layer further comprises a binder resin.

25. The method according to claim 24, wherein the binder resin comprises a phenoxy resin.

26. The method according to claim 1, wherein the first adhesive component of the first layer further comprises a styrene block copolymer.

27. The method according to claim 26, wherein the styrene block copolymer is a styrene-ethylene-butadiene-styrene block copolymer.

28. The method according to claim 26, wherein the styrene block copolymer is a maleic acid anhydride styrene-ethylene-butadiene-styrene block copolymer.

29. The method according claim 1, wherein the first layer has a lower tensile modulus than the second layer, the tensile modulus being measured after curing at 25? C., the tensile modulus of the first layer is approximately 0.001 to 100 Mpa and the tensile modulus of the second layer is approximate 200 to 1000 Mpa.

30. The method according claim 1, wherein the first adhesive component is a pressure sensitive adhesive composition, and the second adhesive component is a hot-melt adhesive composition.

31. The method according claim 1, wherein the second adhesive component comprises an epoxy resin.

32. The method according claim 1, wherein the second adhesive component of the second layer does not comprise polyisobutene resin.

33. The method according claim 1, wherein the first adhesive component of the first layer does not comprise epoxy resin.

34. A method of manufacturing an organic electronic device, comprising: laminating an encapsulating film onto a surface of the organic electronic device, wherein the encapsulating film is formed by a first layer including a pressure sensitive adhesive component and a second layer including an adhesive component, and the laminating comprising placing the encapsulating film onto the organic electronic device such that the second layer is in contact with the organic electronic device, and the first layer is not in contact with the organic electronic device, wherein the pressure sensitive adhesive component of the first layer comprises polyisobutene resin and the adhesive component of the second layer does not comprise polyisobutene resin, the first layer further comprising a tackifier, and wherein the first layer comprises 5 to 250 parts by weight of a moisture scavenger relative to 100 parts by weight of the pressure sensitive adhesive component; and wherein the second layer comprises less than 5 parts by weight of the moisture scavenger relative to 100 parts by weight of a solid content of the second layer.

35. The method of claim 34, wherein the pressure sensitive adhesive component of the first layer does not comprise epoxy resin.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic diagram of a film according to an exemplary embodiment; and

(2) FIG. 2 is a schematic diagram illustrating a method of manufacturing an electronic device according to an exemplary embodiment.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

(3) Hereinafter, a method of manufacturing an organic device will be described in further detail with reference to Examples and Comparative Examples, but the scope of the method is not limited to the following Examples.

(4) Hereinafter, physical properties shown in Examples and Comparative Examples are evaluated by the following methods.

(5) 1. Measurement of Contact Angle

(6) A contact angle was measured with respect to a coating layer formed by preparing a solution having a solid content of 15 wt % by dissolving a base resin in a dilutable solvent, coating the prepared solution on a glass to have a thickness of 10 nm and drying the coated solution. Particularly, the contact angle was measured using DSA100 produced by KRUSS. Deionized water was dropped to the coating layer at approximately 25? C., which was repeated 10 times, and then an average of the measured results was determined as the contact angle.

(7) 2. Measurement of WVTR

(8) A resin composition was prepared by dissolving the component for the first layer used in Example or the resin used in Comparative Example in a solvent. The resin composition was coated on a base film (releasing polyester film, RS-21G, SKC) having a thickness of 38 ?m. Subsequently, the coated composition was dried at 110? C. for 10 minutes, and thereby a film-type layer having a thickness of 100 ?m was prepared. Afterward, the base film was detached, the film-type layer was maintained at 100? F. and a relative humidity of 100%, and then a WVTR with respect to a thickness direction of the film-type layer was measured. The WVTR was measured as prescribed in regulations of ASTM F1249.

(9) 3. Measurement of Tensile Modulus

(10) A resin composition was prepared by dissolving a first or second layer prepared in Example or Comparative Example in a solvent. The resin composition was coated on a base film (releasing polyester film, RS-21G, SKC) having a thickness of 38 ?m. Subsequently, the coated composition was dried at 110? C. for 10 minutes, and thereby a film-type layer having a thickness of 40 ?m was prepared. The prepared coating layer was designed to be coated in a length direction, and then cut in a size of 50 mm?10 mm (length?width), thereby preparing a specimen. Both terminal ends of the specimen were taped to leave 25 mm in a length direction. Subsequently, while the taped part was extended at 25? C. at a rate of 18 mm/min, a tensile modulus was measured.

(11) 4. Evaluation of Moisture Blocking Property

(12) While a specimen formed in Example or Comparative Example was maintained in a constant temperature and constant humidity chamber at 85? C. and a relative humidity of 85% for approximately 500 hours, a length of the calcium-deposited part which was oxidized and made transparent was measured. Since calcium had a total length in one direction of 10 mm, the length of the oxidized part of the calcium from one terminal end became 5 mm, which meant that all of the calcium was oxidized.

(13) 5. Evaluation of Durability and Reliability

(14) While a specimen formed in Example or Comparative Example was maintained in a constant temperature and constant humidity chamber at 85? C. and a relative humidity of 85% for approximately 500 hours, it was observed whether or not lifting occurred at an interface between the glass substrate and the encapsulating layer.

(15) 6. Evaluation of Applicability of Panel

(16) It was observed with the unaided eye whether or not bubbles were generated in a specimen formed in Example or Comparative Example.

Example 1

(1) Preparation of Encapsulating Film

(17) 1) Preparation of First Layer Solution

(18) A moisture scavenger solution was prepared by adding 100 g of calcined dolomite as a moisture scavenger and 0.5 g of stearic acid as a dispersing agent to a toluene to have a solid content of 50 wt %. In addition, separately, 65 g of a polyisobutene resin (weight average molecular weight of 450,000) and 5 g of a maleic acid anhydride-grated styrene-ethylene-butadiene-styrene block copolymer (MA-SEBS, Product Name: FG-1901X, Manufacturer: Kraton) were added as base resins for the first layer to a reaction vessel at room temperature, and 30 g of a hydrogenated dicyclopentadiene-based resin (softening point: 125? C.) was added thereto as a tackifier and diluted with toluene to have a solid content of approximately 20 wt %. The previously prepared moisture scavenger solution was added to the solution to have a content of the calcined dolomite of 30 parts by weight with respect to 100 parts by weight of the base resins for the first layer, and mixed together, thereby preparing a first layer solution.

(19) 2) Preparation of Second Layer Solution

(20) 200 g of a silane-modified epoxy resin (KSR-177, Kukdo Chemical) and 150 g of a phenoxy resin (YP-50, Tohto Kasei) were added to a reaction vessel at room temperature, and then diluted with methylethylketone. 4 g of imidazole (Shikoku Chemical) which was a curing agent was added to the homogenized solution, and stirred at a high speed for 1 hour, thereby preparing a second layer solution.

(21) 3) Formation of Film

(22) A first layer was formed to have a thickness of 40 ?m by coating the solution of a first layer prepared above on a release surface of releasing PET and drying the coated solution at 110? C. for 10 minutes.

(23) A second layer was formed to have a thickness of 15 ?m by coating the solution of a second layer prepared above on a release surface of releasing PET and drying the coated solution at 130? C. for 3 minutes.

(24) A multilayer film was formed by laminating the first and second layers.

(2) Preparation of Specimen

(25) Calcium (Ca) was deposited on a glass substrate having a size of 12 mm?12 mm (length?width) to have a size of 10 mm?10 mm (length?width). Separately, a film formed in the above was cut to a size of 12 mm?12 mm (length?width). Subsequently, the first layer of the film was transferred to a cover glass. Afterward, an opposite surface to that of the film on which the cover glass was disposed was laminated on the calcium of the glass substrate, and thermally pressed using a vacuum press at 80? C. for 2 minutes, and cured at 100? C. for 3 hours, thereby forming an encapsulating layer. Thus, a specimen was manufactured.

Example 2

(26) A film and a specimen were prepared as described in Example 1, except that 60 g of polyisobutene and 10 g of MA-SEBS were used instead of 65 g of polyisobutene and 5 g of MA-SEBS as PSA component of the first layer of the film.

Example 3

(27) A film and a specimen were prepared as described in Example 1, except that 55 g of polyisobutene and 15 g of MA-SEBS were used instead of 65 g of polyisobutene and 5 g of MA-SEBS as PSA component of the first layer of the film.

Example 4

(28) A film and specimen were prepared as described in Example 2, except that a styrene-butadiene-styrene block copolymer (SBS, Product Name: D-1101, Manufacturer: Kraton) was used instead of MA-SEBS of the PSA components for the first layer.

Example 5

(29) A film and specimen were prepared as described in Example 2, except that a styrene-isoprene-styrene block copolymer (SIS, Product Name: D-1107, Manufacturer: Kraton) was used instead of MA-SEBS of the PSA components for the first layer.

Example 6

(30) A film and specimen were prepared as described in Example 2, except that 70 g of a polyisobutene resin was used instead of 60 g of a polyisobutene resin and 10 g of MA-SEBS as PSA components for the first layer.

Comparative Example 1

(31) A specimen was prepared as described in Example 1, except that a second layer of a film was in contact with an upper substrate.

Comparative Example 2

(32) A specimen was prepared as described in Example 1, except that a bottom substrate having calcium was in contact with a second layer of the film before a first layer was attached to an upper substrate, and then thermally pressed and cured.

(33) TABLE-US-00001 TABLE 1 Contact Angle.sup.a WVTR.sup.b M1.sup.c M2.sup.d Tg 1.sup.e Tg 2.sup.f EXAMPLE 1 108 7.8 0.5 680 ?60 101 2 103 7.8 0.71 680 ?57 101 3 101 41.0 0.76 680 ?55 101 4 110 10.0 0.6 680 ?62 101 5 109 9.3 0.69 680 ?59 101 6 111 3.2 0.5 680 ?65 101 .sup.aContact Angle (Unit: ?) of PSA component of First Layer .sup.bWVTR (Unit: g/m.sup.2 .Math. day) of PSA component of First Layer .sup.cTensile Modulus (Unit: MPa) of First Layer .sup.dTensile Modulus (Unit: MPa) of Second Layer .sup.eGlass Transition Temperature (Unit: ? C.) of PSA component of First Layer After Curing .sup.fGlass Transition Temperature (Unit: ? C.) of Adhesive component of Second Layer After Curing *C. EXAMPLE: Comparative Example

(34) TABLE-US-00002 TABLE 2 Moisture Blocking Durability and Possibility Property.sup.g Reliability to Apply Panel EXAMPLE 1 2.7 Good No Bubbles 2 3.1 Good No Bubbles 3 3.3 Good No Bubbles 4 2.8 Good No Bubbles 5 2.8 Good No Bubbles 6 2.5 Good No Bubbles C. 1 2.4 Destroyed Bubbles EXAMPLE 2 2.7 Good Bubbles .sup.gLength of calcium oxidized in one direction from one surface (Unit: mm) *C. EXAMPLE: Comparative Example